Texas Instruments

The TX7316 is a highly integrated, high-performance transmitter solution for ultrasound imaging system. The device has total 16 pulser circuits (PULS), 16 transmit/receive (T/R) switches, and supports both on-chip and off-chip beamformer (TxBF). The device also integrates on-chip floating power supplies that reduce the number of required high voltage power supplies. The TX7316 (referred to as device in this data sheet) has a pulser circuit that generates three-level high voltage pulses (up to ±100 V) that can be used to excite multiple channels of an ultrasound transducer. The device supports total 8 outputs for 5-level mode and 16 outputs for 3-level mode. The maximum output current is configurable from 2.4 A to 0.6 A. A T/R switch under OFF state protects the receiver circuit by providing high isolation between the high-voltage transmitter and the low-voltage receiver when the pulser is generating high-voltage pulses. When the transducer is receiving echo signals, the T/R switch turns ON and connects the transducer to the receiver. The ON/OFF operation of the T/R switch is either controlled by an external pin or controlled by on-chip beamforming engine in the device. The T/R switch offers 12-Ω impedance in the ON state. Ultrasound transmission relies on the excitation of multiple transducer elements with the delay profile of the excitation across the different elements defining the direction of the transmission. Such an operation is referred to as transmit beamforming. The TX7316 supports staggered pulsing of the different channels, allowing for transmit beamforming. The device supports both off-chip and on-chip beamforming operation. In the off-chip beamformer mode, the output transition of each pulser and TR switch ON/OFF operation is controlled by external control pins. To eliminate the effect of jitter from the external control signals, the device supports a synchronization feature. When the synchronization feature is enabled, the external control signals are latched using a low-jitter beamformer clock signal. In the on-chip beamformer mode, the delay profile for the pulsing of the different channels is stored within the device. The device supports a transmit beamformer delay resolution of one beamformer clock period and a maximum delay of 213beamformer clock periods. An internal pattern generator generates the output pulse patterns based on pattern profiles stored in a profile RAM. Up to 16 beamforming profiles and 48/28 pattern profiles for 3/5-level mode can be stored in the profile RAM. On-chip beamforming mode reduces the number of control signals that must be routed from the FPGA to the device. TX7316 is available in a 15-mm × 10-mm 216-pin NFBGA package (ZCX package) and is specified for operation from 0°C to 70°C. The TX7316 is a highly integrated, high-performance transmitter solution for ultrasound imaging system. The device has total 16 pulser circuits (PULS), 16 transmit/receive (T/R) switches, and supports both on-chip and off-chip beamformer (TxBF). The device also integrates on-chip floating power supplies that reduce the number of required high voltage power supplies. The TX7316 (referred to as device in this data sheet) has a pulser circuit that generates three-level high voltage pulses (up to ±100 V) that can be used to excite multiple channels of an ultrasound transducer. The device supports total 8 outputs for 5-level mode and 16 outputs for 3-level mode. The maximum output current is configurable from 2.4 A to 0.6 A. A T/R switch under OFF state protects the receiver circuit by providing high isolation between the high-voltage transmitter and the low-voltage receiver when the pulser is generating high-voltage pulses. When the transducer is receiving echo signals, the T/R switch turns ON and connects the transducer to the receiver. The ON/OFF operation of the T/R switch is either controlled by an external pin or controlled by on-chip beamforming engine in the device. The T/R switch offers 12-Ω impedance in the ON state. Ultrasound transmission relies on the excitation of multiple transducer elements with the delay profile of the excitation across the different elements defining the direction of the transmission. Such an operation is referred to as transmit beamforming. The TX7316 supports staggered pulsing of the different channels, allowing for transmit beamforming. The device supports both off-chip and on-chip beamforming operation. In the off-chip beamformer mode, the output transition of each pulser and TR switch ON/OFF operation is controlled by external control pins. To eliminate the effect of jitter from the external control signals, the device supports a synchronization feature. When the synchronization feature is enabled, the external control signals are latched using a low-jitter beamformer clock signal. In the on-chip beamformer mode, the delay profile for the pulsing of the different channels is stored within the device. The device supports a transmit beamformer delay resolution of one beamformer clock period and a maximum delay of 213beamformer clock periods. An internal pattern generator generates the output pulse patterns based on pattern profiles stored in a profile RAM. Up to 16 beamforming profiles and 48/28 pattern profiles for 3/5-level mode can be stored in the profile RAM. On-chip beamforming mode reduces the number of control signals that must be routed from the FPGA to the device. TX7316 is available in a 15-mm × 10-mm 216-pin NFBGA package (ZCX package) and is specified for operation from 0°C to 70°C.

The TX7332 is a highly integrated, high-performance transmitter solution for ultrasound imaging system. The device has total 32 pulser circuits (PULS), 32 transmit/receive (T/R) switches, and supports both on-chip and off-chip beamformer (TxBF). The device also integrates on-chip floating power supplies that reduce the number of required high voltage power supplies. The TX7332 has a pulser circuit that generates three-level high voltage pulses (up to ±100 V) that can be used to excite multiple channels of an ultrasound transducer. The device supports total 32 outputs. The maximum output current is configurable from 1.2 A to 0.3 A. A T/R switch under OFF state protects the receiver circuit by providing high isolation between the high-voltage transmitter and the low-voltage receiver when the pulser is generating high-voltage pulses. When the transducer is receiving echo signals, the T/R switch turns ON and connects the transducer to the receiver. The ON/OFF operation of the T/R switch is either controlled by an external pin or controlled by on-chip beamforming engine in the device. The T/R switch offers 24-Ω impedance in the ON state. Ultrasound transmission relies on the excitation of multiple transducer elements with the delay profile of the excitation across the different elements defining the direction of the transmission. Such an operation is referred to as transmit beamforming. The TX7332 supports staggered pulsing of the different channels, allowing for transmit beamforming. The device supports both off-chip and on-chip beamforming operation. In the off-chip beamformer mode, the output transition of each pulser and TR switch ON/OFF operation is controlled by external control pins. To eliminate the effect of jitter from the external control signals, the device supports a synchronization feature. When the synchronization feature is enabled, the external control signals are latched using a low-jitter beamformer clock signal. In the on-chip beamformer mode, the delay profile for the pulsing of the different channels is stored within the device. The device supports a transmit beamformer delay resolution of one beamformer clock period and a maximum delay of 213beamformer clock periods. An internal pattern generator generates the output pulse patterns based on pattern profiles stored in a profile RAM. Up to 16 beamforming profiles and 32 pattern profiles can be stored in the profile RAM. On-chip beamforming mode reduces the number of control signals that must be routed from the FPGA to the device.. The TX7332 is available in a 17-mm × 11-mm 260-pin NFBGA package and is specified for operation from 0°C to 70°C. The TX7332 is a highly integrated, high-performance transmitter solution for ultrasound imaging system. The device has total 32 pulser circuits (PULS), 32 transmit/receive (T/R) switches, and supports both on-chip and off-chip beamformer (TxBF). The device also integrates on-chip floating power supplies that reduce the number of required high voltage power supplies. The TX7332 has a pulser circuit that generates three-level high voltage pulses (up to ±100 V) that can be used to excite multiple channels of an ultrasound transducer. The device supports total 32 outputs. The maximum output current is configurable from 1.2 A to 0.3 A. A T/R switch under OFF state protects the receiver circuit by providing high isolation between the high-voltage transmitter and the low-voltage receiver when the pulser is generating high-voltage pulses. When the transducer is receiving echo signals, the T/R switch turns ON and connects the transducer to the receiver. The ON/OFF operation of the T/R switch is either controlled by an external pin or controlled by on-chip beamforming engine in the device. The T/R switch offers 24-Ω impedance in the ON state. Ultrasound transmission relies on the excitation of multiple transducer elements with the delay profile of the excitation across the different elements defining the direction of the transmission. Such an operation is referred to as transmit beamforming. The TX7332 supports staggered pulsing of the different channels, allowing for transmit beamforming. The device supports both off-chip and on-chip beamforming operation. In the off-chip beamformer mode, the output transition of each pulser and TR switch ON/OFF operation is controlled by external control pins. To eliminate the effect of jitter from the external control signals, the device supports a synchronization feature. When the synchronization feature is enabled, the external control signals are latched using a low-jitter beamformer clock signal. In the on-chip beamformer mode, the delay profile for the pulsing of the different channels is stored within the device. The device supports a transmit beamformer delay resolution of one beamformer clock period and a maximum delay of 213beamformer clock periods. An internal pattern generator generates the output pulse patterns based on pattern profiles stored in a profile RAM. Up to 16 beamforming profiles and 32 pattern profiles can be stored in the profile RAM. On-chip beamforming mode reduces the number of control signals that must be routed from the FPGA to the device.. The TX7332 is available in a 17-mm × 11-mm 260-pin NFBGA package and is specified for operation from 0°C to 70°C.

TX7364 is a highly integrated, high-performance transmitter device for ultrasound imaging system. The device has total 64 pulser circuits, 64 transmit/ receive switches (referred as T/R or TR switches) and supports on-chip beamformer (TxBF). The device also integrates on-chip floating power supplies that reduce the number of required high voltage power supplies. TX7364 has a pulser circuit that generates three-level high voltage pulses (up to ±100 V) that is used to excite multiple channels of an ultrasound transducer. The device supports total 64 outputs. The maximum output current is 1A. Device can be used as a transmitter solution for many applications like ultrasound imaging, non-destructive testing, SONAR, LIDAR, marine navigation system, brain imaging systems and so on. TX7364 is a highly integrated, high-performance transmitter device for ultrasound imaging system. The device has total 64 pulser circuits, 64 transmit/ receive switches (referred as T/R or TR switches) and supports on-chip beamformer (TxBF). The device also integrates on-chip floating power supplies that reduce the number of required high voltage power supplies. TX7364 has a pulser circuit that generates three-level high voltage pulses (up to ±100 V) that is used to excite multiple channels of an ultrasound transducer. The device supports total 64 outputs. The maximum output current is 1A. Device can be used as a transmitter solution for many applications like ultrasound imaging, non-destructive testing, SONAR, LIDAR, marine navigation system, brain imaging systems and so on.

The TX75E16 is a highly integrated, high-performance transmitter for ultrasound imaging system. The device has total 16 pulser circuits, 16 transmit/receive switches (referred as T/R or TR switches), and supports on-chip beamformer (TxBF). The device also integrates on-chip floating power supplies that reduce the number of required high voltage power supplies. The TX75E16 has a pulser circuit that generates five-level high voltage pulses (up to ±100 V) that is used to excite multiple channels of an ultrasound transducer. The device supports total 16 outputs. The maximum output current is 2 A. The device can be used as a transmitter for many applications like ultrasound imaging, non-destructive testing, SONAR, LIDAR, marine navigation system, brain imaging systems and so on. The TX75E16 (referred as device in this data sheet) is highly integrated transmitter targeted for exciting ultrasound transducers. Device integrates 16 pulsers and 16 T/R switches, on-chip beamformer, and pattern generator. The device integrates all the decoupling capacitors required for the floating supplies and internal bias voltages. This integration significantly reduces the required number of external capacitors. The TX75E16 is available in a 10-mm × 10-mm 144-pin FC-BGA package (ALH package) and is specified for operation from 0°C to 70°C. Pulser circuit generates five-level high voltage pulses (up to ±100 V) with maximum output current of 2 A. When pulser transmits the high voltage pulses, T/R switch turns OFF and protects the low voltage receiver circuit from damage. When the transducer is receiving echo signals, the T/R switch turns ON and connects the transducer to the receiver. The ON/OFF operation of the T/R switch is controlled by on-chip beamforming engine in the device. The T/R switch offers 8-Ω impedance in the ON state. Ultrasound transmission relies on excitation of multiple transducer elements, with different delay values defining the direction of the transmission. Such an operation is referred to as transmit beamforming. The TX75E16 supports staggered pulsing of the different channels, allowing for transmit beamforming. In the on-chip beamformer mode, delay profile for pulsing of different channels is stored within the device. The device supports a transmit beamformer delay resolution of one beamformer clock period and a maximum delay of 2 14 beamformer clock periods. An internal pattern generator generates the output pulse patterns based on pattern profiles stored in a profile RAM. Each channel has a RAM, which is 960 words long. The patterns have global and local repeats feature. This capability can be used to generate long patterns and can be used in Shear-Wave imaging. These pattern profiles and delay profiles are written using a high-speed (400 MHz) serial peripheral interface. The high-speed writes can be prone to errors, therefore the device has a checksum feature to detect errors in SPI writes. To protect the device from getting damaged because of improper configuration, an internal error flag register can detect faulty condition and configure the device in shutdown mode automatically. The TX75E16 is a highly integrated, high-performance transmitter for ultrasound imaging system. The device has total 16 pulser circuits, 16 transmit/receive switches (referred as T/R or TR switches), and supports on-chip beamformer (TxBF). The device also integrates on-chip floating power supplies that reduce the number of required high voltage power supplies. The TX75E16 has a pulser circuit that generates five-level high voltage pulses (up to ±100 V) that is used to excite multiple channels of an ultrasound transducer. The device supports total 16 outputs. The maximum output current is 2 A. The device can be used as a transmitter for many applications like ultrasound imaging, non-destructive testing, SONAR, LIDAR, marine navigation system, brain imaging systems and so on. The TX75E16 (referred as device in this data sheet) is highly integrated transmitter targeted for exciting ultrasound transducers. Device integrates 16 pulsers and 16 T/R switches, on-chip beamformer, and pattern generator. The device integrates all the decoupling capacitors required for the floating supplies and internal bias voltages. This integration significantly reduces the required number of external capacitors. The TX75E16 is available in a 10-mm × 10-mm 144-pin FC-BGA package (ALH package) and is specified for operation from 0°C to 70°C. Pulser circuit generates five-level high voltage pulses (up to ±100 V) with maximum output current of 2 A. When pulser transmits the high voltage pulses, T/R switch turns OFF and protects the low voltage receiver circuit from damage. When the transducer is receiving echo signals, the T/R switch turns ON and connects the transducer to the receiver. The ON/OFF operation of the T/R switch is controlled by on-chip beamforming engine in the device. The T/R switch offers 8-Ω impedance in the ON state. Ultrasound transmission relies on excitation of multiple transducer elements, with different delay values defining the direction of the transmission. Such an operation is referred to as transmit beamforming. The TX75E16 supports staggered pulsing of the different channels, allowing for transmit beamforming. In the on-chip beamformer mode, delay profile for pulsing of different channels is stored within the device. The device supports a transmit beamformer delay resolution of one beamformer clock period and a maximum delay of 2 14 beamformer clock periods. An internal pattern generator generates the output pulse patterns based on pattern profiles stored in a profile RAM. Each channel has a RAM, which is 960 words long. The patterns have global and local repeats feature. This capability can be used to generate long patterns and can be used in Shear-Wave imaging. These pattern profiles and delay profiles are written using a high-speed (400 MHz) serial peripheral interface. The high-speed writes can be prone to errors, therefore the device has a checksum feature to detect errors in SPI writes. To protect the device from getting damaged because of improper configuration, an internal error flag register can detect faulty condition and configure the device in shutdown mode automatically.

This 1-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCAaccepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCBaccepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCAshould not exceed VCCB. When the output-enable (OE) input is low, all outputs are placed in the high-impedance state. This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This 1-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCAaccepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCBaccepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCAshould not exceed VCCB. When the output-enable (OE) input is low, all outputs are placed in the high-impedance state. This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

The TXB0102 device is a 2-bit noninverting translator that uses two separate configurable power-supply rails. The A port is designed to track V CCA. V CCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track V CCB. V CCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. V CCA must not exceed V CCB. When the output-enable (OE) input is low, all outputs are placed in the high-impedance state. This device is fully specified for partial-power-down applications using I off. The I off circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device. OE must be tied to GND through a pulldown resistor to assure the high-impedance state during power up or power down; the minimum value of the resistor is determined by the current-sourcing capability of the driver. NanoFree™ technology is a major breakthrough in IC packaging concepts, using the die as the package. The TXB0102 device is a 2-bit noninverting translator that uses two separate configurable power-supply rails. The A port is designed to track V CCA. V CCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track V CCB. V CCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. V CCA must not exceed V CCB. When the output-enable (OE) input is low, all outputs are placed in the high-impedance state. This device is fully specified for partial-power-down applications using I off. The I off circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device. OE must be tied to GND through a pulldown resistor to assure the high-impedance state during power up or power down; the minimum value of the resistor is determined by the current-sourcing capability of the driver. NanoFree™ technology is a major breakthrough in IC packaging concepts, using the die as the package.

Voltage-level translators address the challenges posed by simultaneous use of different supply-voltage levels on the same circuit board. This 4-bit non-inverting translator uses two separate configurable power-supply rails. The A port is designed to track V CCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track V CCB. VCCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. V CCA should not exceed V CCB. When the output-enable (OE) input is low, all outputs are placed in the high-impedance state. To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver. The TXB0104 is designed so that the OE input circuit is supplied by V CCA. This device is fully specified for partial-power-down applications using I off. The I off circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. Voltage-level translators address the challenges posed by simultaneous use of different supply-voltage levels on the same circuit board. This 4-bit non-inverting translator uses two separate configurable power-supply rails. The A port is designed to track V CCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track V CCB. VCCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. V CCA should not exceed V CCB. When the output-enable (OE) input is low, all outputs are placed in the high-impedance state. To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver. The TXB0104 is designed so that the OE input circuit is supplied by V CCA. This device is fully specified for partial-power-down applications using I off. The I off circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

This 6-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCAaccepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCBaccepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCAshould not exceed VCCB. When the output-enable (OE) input is low, all outputs are placed in the high-impedance state. The TXB0106-Q1 device is designed so that the OE input circuit is supplied by VCCA. This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver. This 6-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCAaccepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCBaccepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCAshould not exceed VCCB. When the output-enable (OE) input is low, all outputs are placed in the high-impedance state. The TXB0106-Q1 device is designed so that the OE input circuit is supplied by VCCA. This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

This 8-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.2V to 3.6V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.65V to 5.5V. This allows for universal low-voltage bidirectional translation between any of the 1.2V, 1.5V, 1.8V, 2.5V, 3.3V, and 5V voltage nodes. VCCA should not exceed VCCB. When the output-enable (OE) input is low, all outputs are placed in the high-impedance state. The TXB0108 is designed so that the OE input circuit is supplied by VCCA. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. To ensure the high-impedance state during power-up or power-down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver. This 8-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.2V to 3.6V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.65V to 5.5V. This allows for universal low-voltage bidirectional translation between any of the 1.2V, 1.5V, 1.8V, 2.5V, 3.3V, and 5V voltage nodes. VCCA should not exceed VCCB. When the output-enable (OE) input is low, all outputs are placed in the high-impedance state. The TXB0108 is designed so that the OE input circuit is supplied by VCCA. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. To ensure the high-impedance state during power-up or power-down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.