Texas Instruments

The TPSM41625 power module is an easy-to-use integrated power supply that combines a DC/DC converter with power MOSFETs, a shielded inductor, and passives into a compact QFN package. This power solution requires few external components while maintaining the ability to adjust key parameters to meet specific design requirements. Applications requiring increased current can benefit from the ability to parallel two TPSM41625 devices. The 11-mm × 16-mm × 4.2-mm, 69-pin QFN package with optimal package layout has excellent power dissipation capability which enhances thermal performance. The package footprint has all signal pins accessible from the perimeter and large thermal pads beneath the device. The TPSM41625 offers flexibilty with many features including power good signal, clock synchronization, programmable UVLO, soft-start timing selection, prebias start-up, as well as overcurrent and overtemperature protection making it a great product for powering a wide range of devices and systems. space space space The TPSM41625 power module is an easy-to-use integrated power supply that combines a DC/DC converter with power MOSFETs, a shielded inductor, and passives into a compact QFN package. This power solution requires few external components while maintaining the ability to adjust key parameters to meet specific design requirements. Applications requiring increased current can benefit from the ability to parallel two TPSM41625 devices. The 11-mm × 16-mm × 4.2-mm, 69-pin QFN package with optimal package layout has excellent power dissipation capability which enhances thermal performance. The package footprint has all signal pins accessible from the perimeter and large thermal pads beneath the device. The TPSM41625 offers flexibilty with many features including power good signal, clock synchronization, programmable UVLO, soft-start timing selection, prebias start-up, as well as overcurrent and overtemperature protection making it a great product for powering a wide range of devices and systems. space space space

The TPSM53603 power module is a highly integrated 3-A power solution that combines a 36-V input, step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm x 5.5-mm x 4-mm, 15-pin package usesEnhanced HotRod QFNtechnology for improved thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing. The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and overtemperature protections, making the TPSM53603 an excellent device for powering a wide range of applications. The TPSM53603 power module is a highly integrated 3-A power solution that combines a 36-V input, step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm x 5.5-mm x 4-mm, 15-pin package usesEnhanced HotRod QFNtechnology for improved thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing. The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and overtemperature protections, making the TPSM53603 an excellent device for powering a wide range of applications.

The TPSM53604 power module is a highly integrated 4-A power solution that combines a 36-V input, step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm x 5.5-mm x 4-mm, 15-pin package usesEnhanced HotRod QFNtechnology for improved thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing. The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and overtemperature protections, making the TPSM53604 an excellent device for powering a wide range of applications. The TPSM53604 power module is a highly integrated 4-A power solution that combines a 36-V input, step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm x 5.5-mm x 4-mm, 15-pin package usesEnhanced HotRod QFNtechnology for improved thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing. The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and overtemperature protections, making the TPSM53604 an excellent device for powering a wide range of applications.

The TPSM5601R5 power module is a highly integrated 1.5-A power solution that combines a 60-V input, step-down DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally enhanced QFN package. The 5-mm × 5.5-mm × 4-mm, 15-pin QFN package uses Enhanced HotRod QFN technology for enhanced thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing. The TPSM5601R5 is a compact, easy-to-use power module with a wide adjustable output voltage range of 1.0 V to 6 V. The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and temperature protections, making the TPSM5601R5 an excellent device for powering a wide range of applications. Space-constrained applications benefit from the 5.0-mm × 5.5-mm package. Additionally, the TPSM5601R5Soffers frequency spread-spectrum operation. The TPSM5601R5 power module is a highly integrated 1.5-A power solution that combines a 60-V input, step-down DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally enhanced QFN package. The 5-mm × 5.5-mm × 4-mm, 15-pin QFN package uses Enhanced HotRod QFN technology for enhanced thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing. The TPSM5601R5 is a compact, easy-to-use power module with a wide adjustable output voltage range of 1.0 V to 6 V. The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and temperature protections, making the TPSM5601R5 an excellent device for powering a wide range of applications. Space-constrained applications benefit from the 5.0-mm × 5.5-mm package. Additionally, the TPSM5601R5Soffers frequency spread-spectrum operation.

The TPSM5601R5Hx power module is a highly integrated 1.5-A power solution that combines a 60-V input, step-down DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm × 5.5-mm × 4-mm, 15-pin QFN package usesEnhanced HotRod QFNtechnology for enhanced thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing. The TPSM5601R5Hx is a compact, easy-to-use power module with a wide adjustable output voltage range of 1.0 V to 16 V. The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent and temperature protections, making the TPSM5601R5Hx an excellent device for powering a wide range of applications. Space-constrained applications benefit from the 5-mm × 5.5-mm package. Additionally, the TPSM5601R5HEXToffers extended low temperature operation of –55°C and the TPSM5601R5HSoffers frequency spread-spectrum operation. The TPSM5601R5Hx power module is a highly integrated 1.5-A power solution that combines a 60-V input, step-down DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm × 5.5-mm × 4-mm, 15-pin QFN package usesEnhanced HotRod QFNtechnology for enhanced thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing. The TPSM5601R5Hx is a compact, easy-to-use power module with a wide adjustable output voltage range of 1.0 V to 16 V. The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent and temperature protections, making the TPSM5601R5Hx an excellent device for powering a wide range of applications. Space-constrained applications benefit from the 5-mm × 5.5-mm package. Additionally, the TPSM5601R5HEXToffers extended low temperature operation of –55°C and the TPSM5601R5HSoffers frequency spread-spectrum operation.

The TPSM5601R5Hx power module is a highly integrated 1.5-A power solution that combines a 60-V input, step-down DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm × 5.5-mm × 4-mm, 15-pin QFN package usesEnhanced HotRod QFNtechnology for enhanced thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing. The TPSM5601R5Hx is a compact, easy-to-use power module with a wide adjustable output voltage range of 1.0 V to 16 V. The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent and temperature protections, making the TPSM5601R5Hx an excellent device for powering a wide range of applications. Space-constrained applications benefit from the 5-mm × 5.5-mm package. Additionally, the TPSM5601R5HEXToffers extended low temperature operation of –55°C and the TPSM5601R5HSoffers frequency spread-spectrum operation. The TPSM5601R5Hx power module is a highly integrated 1.5-A power solution that combines a 60-V input, step-down DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm × 5.5-mm × 4-mm, 15-pin QFN package usesEnhanced HotRod QFNtechnology for enhanced thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing. The TPSM5601R5Hx is a compact, easy-to-use power module with a wide adjustable output voltage range of 1.0 V to 16 V. The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent and temperature protections, making the TPSM5601R5Hx an excellent device for powering a wide range of applications. Space-constrained applications benefit from the 5-mm × 5.5-mm package. Additionally, the TPSM5601R5HEXToffers extended low temperature operation of –55°C and the TPSM5601R5HSoffers frequency spread-spectrum operation.

The TPSM5D1806 dual 6-A output power module is a highly integrated and flexible DC-DC power supply packaged in a compact 8-mm × 5.5-mm × 1.8-mm, QFN package. The input voltage range of 4.5 V to 15 V allows conversion from a wide intermediate bus as well as standard 5-V and 12-V rails. The two 6-A outputs can be configured independently for two separate power rails or combined for a single 2-phase, 12-A output. The low-profile, 51-pin QFN package with optimal package layout enhances thermal performance. The package footprint has all signal pins accessible from the perimeter and large thermal pads beneath the device for simple layout and easy handling in manufacturing. The integrated power design eliminates the loop compensation and magnetics part selection from the design process. The device offers independent enable control and power good signal for each output. Switching frequency and phase offsetting can be configured using pin-strapping. The device also offers overcurrent and thermal shutdown protection. The TPSM5D1806 dual 6-A output power module is a highly integrated and flexible DC-DC power supply packaged in a compact 8-mm × 5.5-mm × 1.8-mm, QFN package. The input voltage range of 4.5 V to 15 V allows conversion from a wide intermediate bus as well as standard 5-V and 12-V rails. The two 6-A outputs can be configured independently for two separate power rails or combined for a single 2-phase, 12-A output. The low-profile, 51-pin QFN package with optimal package layout enhances thermal performance. The package footprint has all signal pins accessible from the perimeter and large thermal pads beneath the device for simple layout and easy handling in manufacturing. The integrated power design eliminates the loop compensation and magnetics part selection from the design process. The device offers independent enable control and power good signal for each output. Switching frequency and phase offsetting can be configured using pin-strapping. The device also offers overcurrent and thermal shutdown protection.

The TPSM5D1806E dual 6-A output power module is a highly integrated and flexible DC-DC power supply packaged in a compact 8-mm × 5.5-mm × 1.8-mm QFN package. The input voltage range of 4.5 V to 15 V allows conversion from a wide intermediate bus as well as standard 5-V and 12-V rails. The two 6-A outputs can be configured independently for two separate power rails or combined for a single 2-phase, 12-A output. The low-profile, 51-pin QFN package with optimal package layout enhances thermal performance. The enhanced temperature performance of –55°C enables aerospace applications in environments such as outside cabin-mounted modules or flight control units. The package footprint has all signal pins accessible from the perimeter and large thermal pads beneath the device for simple layout and easy handling in manufacturing. The integrated power design eliminates the loop compensation and magnetics part selection from the design process. The device offers independent enable control and power-good signal for each output. Switching frequency and phase offsetting can be configured using pin-strapping. The device also offers overcurrent and thermal shutdown protection. The TPSM5D1806E dual 6-A output power module is a highly integrated and flexible DC-DC power supply packaged in a compact 8-mm × 5.5-mm × 1.8-mm QFN package. The input voltage range of 4.5 V to 15 V allows conversion from a wide intermediate bus as well as standard 5-V and 12-V rails. The two 6-A outputs can be configured independently for two separate power rails or combined for a single 2-phase, 12-A output. The low-profile, 51-pin QFN package with optimal package layout enhances thermal performance. The enhanced temperature performance of –55°C enables aerospace applications in environments such as outside cabin-mounted modules or flight control units. The package footprint has all signal pins accessible from the perimeter and large thermal pads beneath the device for simple layout and easy handling in manufacturing. The integrated power design eliminates the loop compensation and magnetics part selection from the design process. The device offers independent enable control and power-good signal for each output. Switching frequency and phase offsetting can be configured using pin-strapping. The device also offers overcurrent and thermal shutdown protection.

The TPSM63602 synchronous buck power module is a highly integrated 36-V, 2-A DC/DC solution that combines power MOSFETs, a shielded inductor, and passives in an Enhanced HotRod™ QFN package. The module has pins for VIN and VOUT located at the corners of the package for optimized input and output capacitor layout placement. Four larger thermal pads beneath the module enable a simple layout and easy handling in manufacturing. With an output voltage from 1 V to 16 V, the TPSM63602 is designed to quickly and easily implement a low-EMI design in a small PCB footprint. The total solution requires as few as four external components and eliminates the magnetics and compensation part selection from the design process. Although designed for small size and simplicity in space-constrained applications, the TPSM63602 module offers many features for robust performance: precision enable with hysteresis for adjustable input-voltage UVLO, resistor-programmable switch node slew rate for improved EMI, integrated VCC, bootstrap and input capacitors for increased reliability and higher density, constant switching frequency over the full load current range for enhanced load transient performance, and a PGOOD indicator for sequencing, fault protection, and output voltage monitoring. space The TPSM63602 synchronous buck power module is a highly integrated 36-V, 2-A DC/DC solution that combines power MOSFETs, a shielded inductor, and passives in an Enhanced HotRod™ QFN package. The module has pins for VIN and VOUT located at the corners of the package for optimized input and output capacitor layout placement. Four larger thermal pads beneath the module enable a simple layout and easy handling in manufacturing. With an output voltage from 1 V to 16 V, the TPSM63602 is designed to quickly and easily implement a low-EMI design in a small PCB footprint. The total solution requires as few as four external components and eliminates the magnetics and compensation part selection from the design process. Although designed for small size and simplicity in space-constrained applications, the TPSM63602 module offers many features for robust performance: precision enable with hysteresis for adjustable input-voltage UVLO, resistor-programmable switch node slew rate for improved EMI, integrated VCC, bootstrap and input capacitors for increased reliability and higher density, constant switching frequency over the full load current range for enhanced load transient performance, and a PGOOD indicator for sequencing, fault protection, and output voltage monitoring. space