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ROHM RB098BGE-30TL

Discrete Semiconductor Products

RF501BGE2STL

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Rohm Semiconductor

DIODE SWITCHING SI 200V 5A 3-PIN(2+TAB) DPAK T/R

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Search across all available documentation for this part.

DocumentsTechnical Data Sheet EN Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials +37

ROHM RB098BGE-30TL

Discrete Semiconductor Products

RF501BGE2STL

Active

Rohm Semiconductor

DIODE SWITCHING SI 200V 5A 3-PIN(2+TAB) DPAK T/R

Deep-Dive with AI

DocumentsTechnical Data Sheet EN Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials +37

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	RF501BGE2STL

Current - Average Rectified (Io)	5 A
Current - Reverse Leakage @ Vr	1 µA
Mounting Type	Surface Mount
Operating Temperature - Junction	150 ¯C
Package / Case	TO-252-3, SC-63, DPAK (2 Leads + Tab)
Reverse Recovery Time (trr)	25 ns
Speed	500 ns, 200 mA
Supplier Device Package	TO-252GE
Technology	Standard
Voltage - DC Reverse (Vr) (Max) [Max]	200 V
Voltage - Forward (Vf) (Max) @ If [Max]	920 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Cut Tape (CT)	1	$ 1.86
		10	$ 1.18
		100	$ 0.80
		500	$ 0.63
		1000	$ 0.58
	Digi-Reel®	1	$ 1.86
		10	$ 1.18
		100	$ 0.80
		500	$ 0.63
		1000	$ 0.58
	N/A	2031	$ 1.85
	Tape & Reel (TR)	2500	$ 0.47
Newark	Each (Supplied on Cut Tape)	1	$ 1.90
		10	$ 1.23
		25	$ 1.09
		50	$ 0.96
		100	$ 0.82
		250	$ 0.74
		500	$ 0.65
		1000	$ 0.59

Description

General part information

RF501 Series

RF501BM2S is the silicon epitaxial planar type Fast Recovery Diode.

Documents

Technical documentation and resources

Technical Data Sheet EN

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

PCB Layout Thermal Design Guide

Judgment Criteria of Thermal Evaluation

Notes for Calculating Power Consumption:Static Operation

Part Explanation

Application Note

About Flammability of Materials

Environmental Data

What Is Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

List of Diode Package Thermal Resistance

Compliance of the RoHS directive

Environmental Data

Diode Types and Applications

Technical Article

Moisture Sensitivity Level - Diodes

Package Information

Basics of Thermal Resistance and Heat Dissipation

What is a Thermal Model? (Diode)

Precautions When Measuring the Rear of the Package with a Thermocouple

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Report of SVHC under REACH Regulation

Environmental Data

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Measurement Method and Usage of Thermal Resistance RthJC

About Export Regulations

Export Information

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

How to Create Symbols for PSpice Models

Reliability Test Result

Manufacturing Data

Notes for Temperature Measurement Using Thermocouples

Two-Resistor Model for Thermal Simulation

How to Use LTspice® Models

Schematic Design & Verification

Anti-Whisker formation - Diodes

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

Power Loss and Thermal Design of Diodes

Notes for Temperature Measurement Using Forward Voltage of PN Junction

RF501BGE2S ESD Data

Characteristics Data

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Select Rectifier Diodes

Technical Article

RF501 Series

Super Fast Recovery Diode

Part	Technology	Voltage - DC Reverse (Vr) (Max) [Max]	Operating Temperature - Junction	Supplier Device Package	Package / Case	Mounting Type	Current - Average Rectified (Io)	Voltage - Forward (Vf) (Max) @ If [Max]	Speed	Reverse Recovery Time (trr)	Current - Reverse Leakage @ Vr	Operating Temperature - Junction [Max]
Rohm Semiconductor RF501BGE2STL	Standard	200 V	150 ¯C	TO-252GE	DPAK (2 Leads + Tab) SC-63 TO-252-3	Surface Mount	5 A	920 mV	200 mA 500 ns	25 ns	1 µA
Rohm Semiconductor RF501PS2STB	Standard	200 V		8-TSOP		Surface Mount	5 A	920 mV	200 mA 500 ns	30 ns	1 µA	150 °C
Rohm Semiconductor RF501BM2STL	Standard	200 V		TO-252	DPAK (2 Leads + Tab) SC-63 TO-252-3	Surface Mount	5 A	920 mV	200 mA 500 ns	25 ns	1 µA	150 °C
Rohm Semiconductor RF501B2STL	Standard	200 V		CPD	DPAK (2 Leads + Tab) SC-63 TO-252-3	Surface Mount	5 A	920 mV	200 mA 500 ns	30 ns	1 µA	150 °C