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ROHM RF505BM6STL

Discrete Semiconductor Products

RF501BM2STL

Obsolete

Rohm Semiconductor

RECTIFIER, 200V, 5A, TO-252 ROHS COMPLIANT: YES

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Search across all available documentation for this part.

DocumentsTechnical Data Sheet EN ESD Data +42

ROHM RF505BM6STL

Discrete Semiconductor Products

RF501BM2STL

Obsolete

Rohm Semiconductor

RECTIFIER, 200V, 5A, TO-252 ROHS COMPLIANT: YES

Deep-Dive with AI

DocumentsTechnical Data Sheet EN ESD Data +42

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	RF501BM2STL

Current - Average Rectified (Io)	5 A
Current - Reverse Leakage @ Vr	1 µA
Mounting Type	Surface Mount
Operating Temperature - Junction [Max]	150 °C
Package / Case	TO-252-3, SC-63, DPAK (2 Leads + Tab)
Reverse Recovery Time (trr)	25 ns
Speed	500 ns, 200 mA
Supplier Device Package	TO-252
Technology	Standard
Voltage - DC Reverse (Vr) (Max) [Max]	200 V
Voltage - Forward (Vf) (Max) @ If [Max]	920 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Cut Tape (CT)	1	$ 1.92
		10	$ 1.22
		100	$ 0.82
		500	$ 0.65
		1000	$ 0.60
	Digi-Reel®	1	$ 1.92
		10	$ 1.22
		100	$ 0.82
		500	$ 0.65
		1000	$ 0.60
	N/A	0	$ 0.54
	Tape & Reel (TR)	2500	$ 0.54
		5000	$ 0.50
		7500	$ 0.49
Newark	Each (Supplied on Cut Tape)	1	$ 1.66
		10	$ 1.12
		25	$ 1.03
		50	$ 0.94
		100	$ 0.85
		250	$ 0.76
		500	$ 0.67

Description

General part information

RF501 Series

RF501BM2S is the silicon epitaxial planar type Fast Recovery Diode.

Documents

Technical documentation and resources

Technical Data Sheet EN

ESD Data

Characteristics Data

Power Loss and Thermal Design of Diodes

Two-Resistor Model for Thermal Simulation

What Is Thermal Design

Judgment Criteria of Thermal Evaluation

Method for Monitoring Switching Waveform

Schematic Design & Verification

Condition of Soldering / Land Pattern Reference

Package Information

θ<sub>JA</sub> and Ψ<sub>JT</sub>

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Measurement Method and Usage of Thermal Resistance RthJC

How to Create Symbols for PSpice Models

List of Diode Package Thermal Resistance

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

PCB Layout Thermal Design Guide

Basics of Thermal Resistance and Heat Dissipation

Part Explanation

Application Note

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Moisture Sensitivity Level - Diodes

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

How to Select Rectifier Diodes

Technical Article

Precautions When Measuring the Rear of the Package with a Thermocouple

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Report of SVHC under REACH Regulation

Environmental Data

About Flammability of Materials

Environmental Data

Reliability Test Result

Manufacturing Data

Inner Structure

Package Information

Taping Information

Package Information

What is a Thermal Model? (Diode)

Package Dimensions

Package Information

Anti-Whisker formation - Diodes

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

About Export Regulations

Export Information

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Compliance of the RoHS directive

Environmental Data

Diode Types and Applications

Technical Article

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Explanation for Marking

Package Information

How to Use LTspice® Models

Schematic Design & Verification

RF501 Series

Super Fast Recovery Diode

Part	Technology	Voltage - DC Reverse (Vr) (Max) [Max]	Operating Temperature - Junction	Supplier Device Package	Package / Case	Mounting Type	Current - Average Rectified (Io)	Voltage - Forward (Vf) (Max) @ If [Max]	Speed	Reverse Recovery Time (trr)	Current - Reverse Leakage @ Vr	Operating Temperature - Junction [Max]
Rohm Semiconductor RF501BGE2STL	Standard	200 V	150 ¯C	TO-252GE	DPAK (2 Leads + Tab) SC-63 TO-252-3	Surface Mount	5 A	920 mV	200 mA 500 ns	25 ns	1 µA
Rohm Semiconductor RF501PS2STB	Standard	200 V		8-TSOP		Surface Mount	5 A	920 mV	200 mA 500 ns	30 ns	1 µA	150 °C
Rohm Semiconductor RF501BM2STL	Standard	200 V		TO-252	DPAK (2 Leads + Tab) SC-63 TO-252-3	Surface Mount	5 A	920 mV	200 mA 500 ns	25 ns	1 µA	150 °C
Rohm Semiconductor RF501B2STL	Standard	200 V		CPD	DPAK (2 Leads + Tab) SC-63 TO-252-3	Surface Mount	5 A	920 mV	200 mA 500 ns	30 ns	1 µA	150 °C