Zenode.ai Logo
Beta
Log InSign Up
ROHM RF505BM6STL
Discrete Semiconductor Products

RF501BM2STL

Obsolete
Rohm Semiconductor

RECTIFIER, 200V, 5A, TO-252 ROHS COMPLIANT: YES

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsTechnical Data Sheet ENTO252 TL Taping Spec+32
ROHM RF505BM6STL
Discrete Semiconductor Products

RF501BM2STL

Obsolete
Rohm Semiconductor

RECTIFIER, 200V, 5A, TO-252 ROHS COMPLIANT: YES

Deep-Dive with AI

DocumentsTechnical Data Sheet ENTO252 TL Taping Spec+32

Technical Specifications

Parameters and characteristics for this part

SpecificationRF501BM2STL
Current - Average Rectified (Io)5 A
Current - Reverse Leakage @ Vr1 µA
Mounting TypeSurface Mount
Operating Temperature - Junction150 °C
Package / CaseSC-63, DPAK (2 Leads + Tab), TO-252-3
Reverse Recovery Time (trr)25 ns
Speed200 mA, 500 ns
Supplier Device PackageTO-252
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]200 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 1.92
10$ 1.22
100$ 0.82
500$ 0.65
1000$ 0.60
Digi-Reel® 1$ 1.92
10$ 1.22
100$ 0.82
500$ 0.65
1000$ 0.60
Tape & Reel (TR) 2500$ 0.54
5000$ 0.50
7500$ 0.49
NewarkEach (Supplied on Cut Tape) 1$ 1.66
10$ 1.12
25$ 1.03
50$ 0.94
100$ 0.85
250$ 0.76
500$ 0.67

Description

General part information

RF501BGE2S Series

RF501BGE2S is the silicon epitaxial planar type Fast Recovery Diode.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

TO252 TL Taping Spec

Datasheet

TO-252 Part Marking

Related Document

Diode Flammability

Related Document

Notes for Temperature Measurement Using Thermocouples

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Package Dimensions

Package Information

Diode Types and Applications

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

What Is Thermal Design

Thermal Design

How to Select Rectifier Diodes

Technical Article

ESD Data

Characteristics Data

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Judgment Criteria of Thermal Evaluation

Thermal Design

How to Create Symbols for PSpice Models

Models

About Export Regulations

Export Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

List of Diode Package Thermal Resistance

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Reliability Test Result

Manufacturing Data

What is a Thermal Model? (Diode)

Thermal Design

Power Loss and Thermal Design of Diodes

Thermal Design

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Part Explanation

Application Note

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Moisture Sensitivity Level - Diodes

Package Information