Zenode.ai Logo
Beta
HP8KE6TB1
Discrete Semiconductor Products

RS1E350BNTB1

Active
Rohm Semiconductor

NCH 30V 80A POWER MOSFET: RS1E35

Deep-Dive with AI

Search across all available documentation for this part.

HP8KE6TB1
Discrete Semiconductor Products

RS1E350BNTB1

Active
Rohm Semiconductor

NCH 30V 80A POWER MOSFET: RS1E35

Technical Specifications

Parameters and characteristics for this part

SpecificationRS1E350BNTB1
Current - Continuous Drain (Id) @ 25°C80 A, 35 A
Drain to Source Voltage (Vdss)30 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 4.5 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]185 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]7900 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case8-PowerTDFN
Power Dissipation (Max)35 W, 3 W
Rds On (Max) @ Id, Vgs1.7 mOhm
Supplier Device Package8-HSOP
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 3.42
10$ 2.29
100$ 1.71
500$ 1.49
1000$ 1.42
Digi-Reel® 1$ 3.42
10$ 2.29
100$ 1.71
500$ 1.49
1000$ 1.42
N/A 2207$ 3.27
Tape & Reel (TR) 2500$ 1.28

Description

General part information

RS1E Series

Power MOSFETs are made as low ON-resistance devices by the micro-processing technologies useful for wide range of applications. Broad lineup covering compact types, high-power types and complex types to meet various needs in the market.

Documents

Technical documentation and resources

Datasheet

Datasheet

How to Create Symbols for PSpice Models

Models

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Taping Information

Package Information

HSOP8 Cu AlR Inner Structure

Package Information

What Is Thermal Design

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

What is a Thermal Model? (Transistor)

Thermal Design

HSOP8(TB1) Dimension

Package Information

RS1E350BN ESD Data

Characteristics Data

Two-Resistor Model for Thermal Simulation

Thermal Design

Report of SVHC under REACH Regulation

Environmental Data

About Export Regulations

Export Information

HSOP8(TB1) Explanation for Marking

Package Information

Constitution Materials List

Environmental Data

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Compliance of the RoHS directive

Environmental Data

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

Anti-Whisker formation - Transistors

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Moisture Sensitivity Level - Transistors

Package Information

How to Use LTspice® Models

Schematic Design & Verification

Types and Features of Transistors

Application Note

HSOP8(TB1) Taping Information

Package Information

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Part Explanation

Application Note