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RS1E130GNTB
Discrete Semiconductor Products

RS1E130GNTB

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Rohm Semiconductor

MOSFET N-CH 30V 13A 8HSOP

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RS1E130GNTB
Discrete Semiconductor Products

RS1E130GNTB

Active
Rohm Semiconductor

MOSFET N-CH 30V 13A 8HSOP

Technical Specifications

Parameters and characteristics for this part

SpecificationRS1E130GNTB
Current - Continuous Drain (Id) @ 25°C13 A
Drain to Source Voltage (Vdss)30 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 4.5 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs7.9 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]420 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case8-PowerTDFN
Power Dissipation (Max)3 W, 22.2 W
Rds On (Max) @ Id, Vgs11.7 mOhm
Supplier Device Package8-HSOP
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.61
10$ 0.52
100$ 0.36
500$ 0.28
1000$ 0.23
Digi-Reel® 1$ 0.61
10$ 0.52
100$ 0.36
500$ 0.28
1000$ 0.23
N/A 341$ 0.89
Tape & Reel (TR) 2500$ 0.20
5000$ 0.19
12500$ 0.18
25000$ 0.18

Description

General part information

RS1E Series

Power MOSFETs are made as low ON-resistance devices by the micro-processing technologies useful for wide range of applications. Broad lineup covering compact types, high-power types and complex types to meet various needs in the market.

Documents

Technical documentation and resources

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Thermal Design

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Technical Article

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Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

How to Use LTspice® Models

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Basics of Thermal Resistance and Heat Dissipation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Report of SVHC under REACH Regulation

Environmental Data

About Export Regulations

Export Information

How to Create Symbols for PSpice Models

Models

What Is Thermal Design

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Compliance of the RoHS directive

Environmental Data

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Technical Article

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

RS1E130GN ESD Data

Characteristics Data

Types and Features of Transistors

Application Note

Part Explanation

Application Note

Anti-Whisker formation - Transistors

Package Information

RS1E130GN Data Sheet

Data Sheet

Moisture Sensitivity Level - Transistors

Package Information

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information