Texas Instruments

The GTL2010 provides ten NMOS pass transistors (Sn and Dn) with a common gate (GREF) and a reference transistor (SREFand DREF). The low ON-state resistance of the switch allows connections to be made with minimal propagation delay. With no direction control pin required, the device allows bidirectional voltage translations any voltage (1 V to 5 V) to any voltage (1 V to 5 V). When the Sn or Dn port is LOW, the clamp is in the ON state and a low-resistance connection exists between the Sn and Dn ports. Assuming the higher voltage is on the Dn port, when the Dn port is HIGH, the voltage on the Sn port is limited to the voltage set by the reference transistor (SREF). When the Sn port is HIGH, the Dn port is pulled to VCCby the pullup resistors. All transistors in the GTL2010 have the same electrical characteristics, and there is minimal deviation from one output to another in voltage or propagation delay. This offers superior matching over discrete transistor voltage-translation solutions where the fabrication of the transistors is not symmetrical. With all transistors being identical, the reference transistor (SREF/DREF) can be located on any of the other ten matched Sn/Dn transistors, allowing for easier board layout. The translator transistors with integrated ESD circuitry provides excellent ESD protection. The GTL2010 provides ten NMOS pass transistors (Sn and Dn) with a common gate (GREF) and a reference transistor (SREFand DREF). The low ON-state resistance of the switch allows connections to be made with minimal propagation delay. With no direction control pin required, the device allows bidirectional voltage translations any voltage (1 V to 5 V) to any voltage (1 V to 5 V). When the Sn or Dn port is LOW, the clamp is in the ON state and a low-resistance connection exists between the Sn and Dn ports. Assuming the higher voltage is on the Dn port, when the Dn port is HIGH, the voltage on the Sn port is limited to the voltage set by the reference transistor (SREF). When the Sn port is HIGH, the Dn port is pulled to VCCby the pullup resistors. All transistors in the GTL2010 have the same electrical characteristics, and there is minimal deviation from one output to another in voltage or propagation delay. This offers superior matching over discrete transistor voltage-translation solutions where the fabrication of the transistors is not symmetrical. With all transistors being identical, the reference transistor (SREF/DREF) can be located on any of the other ten matched Sn/Dn transistors, allowing for easier board layout. The translator transistors with integrated ESD circuitry provides excellent ESD protection.

The SN74GTL2014 is a 4-channel translator to interface between 3.3-V LVTTL chip set I/O and Xeon processor GTL–/GTL/GTL+ I/O. The SN74GTL2014 integrates ESD protection cells on all terminals and is available in a TSSOP package (5.0 mm × 4.4 mm). The device is characterized over the free air temperature range of –40°C to 85°C. The SN74GTL2014 is a 4-channel translator to interface between 3.3-V LVTTL chip set I/O and Xeon processor GTL–/GTL/GTL+ I/O. The SN74GTL2014 integrates ESD protection cells on all terminals and is available in a TSSOP package (5.0 mm × 4.4 mm). The device is characterized over the free air temperature range of –40°C to 85°C.

The SN74GTL3004 provides for a selectable GTL Voltage Reference (GTL VREF). The value of the GTL VREFcan be adjusted using S0 and S1 select pins. The S0 and S1 pins contain glitch-suppression circuitry for excellent noise immunity. When left floating, the S0 and S1 control input pins have 100-kµ pullups that set the GTL VREFdefault value to the 0.67 × VTTratio(S0 = 1 and S1 =1). The SN74GTL3004 provides for a selectable GTL Voltage Reference (GTL VREF). The value of the GTL VREFcan be adjusted using S0 and S1 select pins. The S0 and S1 pins contain glitch-suppression circuitry for excellent noise immunity. When left floating, the S0 and S1 control input pins have 100-kµ pullups that set the GTL VREFdefault value to the 0.67 × VTTratio(S0 = 1 and S1 =1).

The SN74GTLP1394 is a high-drive, 2-bit, 3-wire bus transceiver that provides LVTTL-to-GTLP and GTLP-to-LVTTL signal-level translation. It allows for transparent and inverted transparent modes of data transfer with separate LVTTL input and LVTTL output pins, which provides a feedback path for control and diagnostics monitoring. The device provides a high-speed interface between cards operating at LVTTL logic levels and a backplane operating at GTLP signal levels, and is especially designed to work with the Texas Instruments 1394 backplane physical-layer controllers. High-speed (about three times faster than standard LVTTL or TTL) backplane operation is a direct result of GTLP reduced output swing (<1 V), reduced input threshold levels, improved differential input, OEC™ circuitry, and TI-OPC™ circuitry. Improved GTLP OEC and TI-OPC circuitry minimizes bus-settling time and have been designed and tested using several backplane models. The high drive allows incident-wave switching in heavily loaded backplanes with equivalent load impedance down to 11. GTLP is the TI derivative of the Gunning Transceiver Logic (GTL) JEDEC standard JESD 8-3. The ac specification of the SN74GTLP1394 is given only at the preferred higher noise margin GTLP, but the user has the flexibility of using this device at either GTL (VTT= 1.2 V and VREF= 0.8 V) or GTLP (VTT= 1.5 V and VREF= 1 V) signal levels. Normally, the B port operates at GTLP signal levels. The A-port and control inputs operate at LVTTL logic levels, but are 5-V tolerant and are compatible with TTL and 5-V CMOS inputs. VREFis the B port differential input reference voltage. This device is fully specified for live-insertion applications using Ioff, power-up 3-state, and BIAS VCC. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. The BIAS VCCcircuitry precharges and preconditions the B-port input/output connections, preventing disturbance of active data on the backplane during card insertion or removal, and permits true live-insertion capability. This GTLP device features TI-OPC circuitry, which actively limits the overshoot caused by improperly terminated backplanes, unevenly distributed cards, or empty slots during low-to-high signal transitions. This improves signal integrity, which allows adequate noise margin to be maintained at higher frequencies. High-drive GTLP backplane interface devices feature adjustable edge-rate control (ERC\). Changing the ERC\ input voltage between GND and VCCadjusts the B-port output rise and fall times. This allows the designer to optimize system data-transfer rate and signal integrity to the backplane load. When VCCis between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, the output-enable (OE\) input should be tied to VCCthrough a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. The SN74GTLP1394 is a high-drive, 2-bit, 3-wire bus transceiver that provides LVTTL-to-GTLP and GTLP-to-LVTTL signal-level translation. It allows for transparent and inverted transparent modes of data transfer with separate LVTTL input and LVTTL output pins, which provides a feedback path for control and diagnostics monitoring. The device provides a high-speed interface between cards operating at LVTTL logic levels and a backplane operating at GTLP signal levels, and is especially designed to work with the Texas Instruments 1394 backplane physical-layer controllers. High-speed (about three times faster than standard LVTTL or TTL) backplane operation is a direct result of GTLP reduced output swing (<1 V), reduced input threshold levels, improved differential input, OEC™ circuitry, and TI-OPC™ circuitry. Improved GTLP OEC and TI-OPC circuitry minimizes bus-settling time and have been designed and tested using several backplane models. The high drive allows incident-wave switching in heavily loaded backplanes with equivalent load impedance down to 11. GTLP is the TI derivative of the Gunning Transceiver Logic (GTL) JEDEC standard JESD 8-3. The ac specification of the SN74GTLP1394 is given only at the preferred higher noise margin GTLP, but the user has the flexibility of using this device at either GTL (VTT= 1.2 V and VREF= 0.8 V) or GTLP (VTT= 1.5 V and VREF= 1 V) signal levels. Normally, the B port operates at GTLP signal levels. The A-port and control inputs operate at LVTTL logic levels, but are 5-V tolerant and are compatible with TTL and 5-V CMOS inputs. VREFis the B port differential input reference voltage. This device is fully specified for live-insertion applications using Ioff, power-up 3-state, and BIAS VCC. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. The BIAS VCCcircuitry precharges and preconditions the B-port input/output connections, preventing disturbance of active data on the backplane during card insertion or removal, and permits true live-insertion capability. This GTLP device features TI-OPC circuitry, which actively limits the overshoot caused by improperly terminated backplanes, unevenly distributed cards, or empty slots during low-to-high signal transitions. This improves signal integrity, which allows adequate noise margin to be maintained at higher frequencies. High-drive GTLP backplane interface devices feature adjustable edge-rate control (ERC\). Changing the ERC\ input voltage between GND and VCCadjusts the B-port output rise and fall times. This allows the designer to optimize system data-transfer rate and signal integrity to the backplane load. When VCCis between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, the output-enable (OE\) input should be tied to VCCthrough a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74GTLP1395 is two 1-bit, high-drive, 3-wire bus transceivers that provide LVTTL-to-GTLP and GTLP-to-LVTTL signal-level translation for applications, such as primary and secondary clocks, that require individual output-enable and true/complement controls. The device allows for transparent and inverted transparent modes of data transfer with separate LVTTL input and LVTTL output pins, which provide a feedback path for control and diagnostics monitoring. The device provides a high-speed interface between cards operating at LVTTL logic levels and a backplane operating at GTLP signal levels and is designed especially to work with the Texas Instruments 3.3-V 1394 backplane physical-layer controller. High-speed (about three times faster than standard LVTTL or TTL) backplane operation is a direct result of GTLP reduced output swing (<1 V), reduced input threshold levels, improved differential input, OEC™ circuitry, and TI-OPC™ circuitry. Improved GTLP OEC and TI-OPC circuitry minimizes bus settling time, and have been designed and tested using several backplane models. The high drive allows incident-wave switching in heavily loaded backplanes, with equivalent load impedance down to 11. GTLP is the Texas Instruments derivative of the Gunning Transceiver Logic (GTL) JEDEC standard JESD 8-3. The ac specification of the SN74GTLP1395 is given only at the preferred higher noise margin GTLP, but the user has the flexibility of using this device at either GTL (VTT= 1.2 V and VREF= 0.8 V) or GTLP (VTT= 1.5 V and VREF= 1 V) signal levels. For information on using GTLP devices in FB+/BTL applications, refer to TI application reports,Texas Instruments GTLP Frequently Asked Questions, literature number SCEA019, andGTLP in BTL Applications, literature number SCEA017. Normally, the B port operates at GTLP signal levels. The A-port and control inputs operate at LVTTL logic levels, but are 5-V tolerant and are compatible with TTL or 5-V CMOS devices. VREFis the B-port differential input reference voltage. This device is fully specified for live-insertion applications using Ioff, power-up 3-state, and BIAS VCC. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. The BIAS VCCcircuitry precharges and preconditions the B-port input/output connections, preventing disturbance of active data on the backplane during card insertion or removal, and permits true live-insertion capability. This GTLP device features TI-OPC circuitry, which actively limits the overshoot caused by improperly terminated backplanes, unevenly distributed cards, or empty slots during low-to-high signal transitions. This improves signal integrity, which allows adequate noise margin to be maintained at higher frequencies. High-drive GTLP backplane interface devices feature adjustable edge-rate control (ERC). Changing the ERC input voltage between low and high adjusts the B-port output rise and fall times.This allows the designer to optimize system data-transfer rate and signal integrity to the backplane load. When VCCis between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, the output-enable (OE\) input should be tied to VCCthrough a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. The SN74GTLP1395 is two 1-bit, high-drive, 3-wire bus transceivers that provide LVTTL-to-GTLP and GTLP-to-LVTTL signal-level translation for applications, such as primary and secondary clocks, that require individual output-enable and true/complement controls. The device allows for transparent and inverted transparent modes of data transfer with separate LVTTL input and LVTTL output pins, which provide a feedback path for control and diagnostics monitoring. The device provides a high-speed interface between cards operating at LVTTL logic levels and a backplane operating at GTLP signal levels and is designed especially to work with the Texas Instruments 3.3-V 1394 backplane physical-layer controller. High-speed (about three times faster than standard LVTTL or TTL) backplane operation is a direct result of GTLP reduced output swing (<1 V), reduced input threshold levels, improved differential input, OEC™ circuitry, and TI-OPC™ circuitry. Improved GTLP OEC and TI-OPC circuitry minimizes bus settling time, and have been designed and tested using several backplane models. The high drive allows incident-wave switching in heavily loaded backplanes, with equivalent load impedance down to 11. GTLP is the Texas Instruments derivative of the Gunning Transceiver Logic (GTL) JEDEC standard JESD 8-3. The ac specification of the SN74GTLP1395 is given only at the preferred higher noise margin GTLP, but the user has the flexibility of using this device at either GTL (VTT= 1.2 V and VREF= 0.8 V) or GTLP (VTT= 1.5 V and VREF= 1 V) signal levels. For information on using GTLP devices in FB+/BTL applications, refer to TI application reports,Texas Instruments GTLP Frequently Asked Questions, literature number SCEA019, andGTLP in BTL Applications, literature number SCEA017. Normally, the B port operates at GTLP signal levels. The A-port and control inputs operate at LVTTL logic levels, but are 5-V tolerant and are compatible with TTL or 5-V CMOS devices. VREFis the B-port differential input reference voltage. This device is fully specified for live-insertion applications using Ioff, power-up 3-state, and BIAS VCC. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. The BIAS VCCcircuitry precharges and preconditions the B-port input/output connections, preventing disturbance of active data on the backplane during card insertion or removal, and permits true live-insertion capability. This GTLP device features TI-OPC circuitry, which actively limits the overshoot caused by improperly terminated backplanes, unevenly distributed cards, or empty slots during low-to-high signal transitions. This improves signal integrity, which allows adequate noise margin to be maintained at higher frequencies. High-drive GTLP backplane interface devices feature adjustable edge-rate control (ERC). Changing the ERC input voltage between low and high adjusts the B-port output rise and fall times.This allows the designer to optimize system data-transfer rate and signal integrity to the backplane load. When VCCis between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, the output-enable (OE\) input should be tied to VCCthrough a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74GTLP2033 is a high-drive, 8-bit, three-wire registered transceiver that provides inverted LVTTL-to-GTLP and GTLP-to-LVTTL signal-level translation. The device allows for transparent, latched, and flip-flop modes of data transfer with separate LVTTL input and LVTTL output pins, which provides a feedback path for control and diagnostics monitoring, the same functionality as the SN74FB2033. The device provides a high-speed interface between cards operating at LVTTL logic levels and a backplane operating at GTLP signal levels. High-speed (about three times faster than standard LVTTL or TTL) backplane operation is a direct result of GTLP's reduced output swing (<1 V), reduced input threshold levels, improved differential input, OEC™ circuitry, and TI-OPC™ circuitry. Improved GTLP OEC and TI-OPC circuits minimize bus-settling time and have been designed and tested using several backplane models. The high drive allows incident-wave switching in heavily loaded backplanes with equivalent load impedance down to 11. GTLP is the Texas Instruments derivative of the Gunning Transceiver Logic (GTL) JEDEC standard JESD 8-3. The ac specification of the SN74GTLP2033 is given only at the preferred higher noise-margin GTLP, but the user has the flexibility of using this device at either GTL (VTT= 1.2 V and VREF= 0.8 V) or GTLP (VTT= 1.5 V and VREF= 1 V) signal levels. For information on using GTLP devices in FB+/BTL applications, refer to TI application reports,Texas Instruments GTLP Frequently Asked Questions, literature number SCEA019, andGTLP in BTL Applications, literature number SCEA017. Normally, the B port operates at GTLP signal levels. The A-port and control inputs operate at LVTTL logic levels, but are 5-V tolerant and can be directly driven by TTL or 5-V CMOS devices. VREFis the B-port differential input reference voltage. This device is fully specified for live-insertion applications using Ioff, power-up 3-state, and BIAS VCC. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. The BIAS VCCcircuitry precharges and preconditions the B-port input/output connections, preventing disturbance of active data on the backplane during card insertion or removal, and permits true live-insertion capability. This GTLP device features TI-OPC circuitry, which actively limits overshoot caused by improperly terminated backplanes, unevenly distributed cards, or empty slots during low-to-high signal transitions. This improves signal integrity, which allows adequate noise margin to be maintained at higher frequencies. High-drive GTLP backplane interface devices feature adjustable edge-rate control (ERC). Changing the ERC input voltage between low and high adjusts the B-port output rise and fall times.This allows the designer to optimize system data-transfer rate and signal integrity to the backplane load. When VCCis between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, OEAB\ should be tied to VCCthrough a pullup resistor and OEAB and OEBA should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sinking/current-sourcing capability of the driver. The SN74GTLP2033 is a high-drive, 8-bit, three-wire registered transceiver that provides inverted LVTTL-to-GTLP and GTLP-to-LVTTL signal-level translation. The device allows for transparent, latched, and flip-flop modes of data transfer with separate LVTTL input and LVTTL output pins, which provides a feedback path for control and diagnostics monitoring, the same functionality as the SN74FB2033. The device provides a high-speed interface between cards operating at LVTTL logic levels and a backplane operating at GTLP signal levels. High-speed (about three times faster than standard LVTTL or TTL) backplane operation is a direct result of GTLP's reduced output swing (<1 V), reduced input threshold levels, improved differential input, OEC™ circuitry, and TI-OPC™ circuitry. Improved GTLP OEC and TI-OPC circuits minimize bus-settling time and have been designed and tested using several backplane models. The high drive allows incident-wave switching in heavily loaded backplanes with equivalent load impedance down to 11. GTLP is the Texas Instruments derivative of the Gunning Transceiver Logic (GTL) JEDEC standard JESD 8-3. The ac specification of the SN74GTLP2033 is given only at the preferred higher noise-margin GTLP, but the user has the flexibility of using this device at either GTL (VTT= 1.2 V and VREF= 0.8 V) or GTLP (VTT= 1.5 V and VREF= 1 V) signal levels. For information on using GTLP devices in FB+/BTL applications, refer to TI application reports,Texas Instruments GTLP Frequently Asked Questions, literature number SCEA019, andGTLP in BTL Applications, literature number SCEA017. Normally, the B port operates at GTLP signal levels. The A-port and control inputs operate at LVTTL logic levels, but are 5-V tolerant and can be directly driven by TTL or 5-V CMOS devices. VREFis the B-port differential input reference voltage. This device is fully specified for live-insertion applications using Ioff, power-up 3-state, and BIAS VCC. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. The BIAS VCCcircuitry precharges and preconditions the B-port input/output connections, preventing disturbance of active data on the backplane during card insertion or removal, and permits true live-insertion capability. This GTLP device features TI-OPC circuitry, which actively limits overshoot caused by improperly terminated backplanes, unevenly distributed cards, or empty slots during low-to-high signal transitions. This improves signal integrity, which allows adequate noise margin to be maintained at higher frequencies. High-drive GTLP backplane interface devices feature adjustable edge-rate control (ERC). Changing the ERC input voltage between low and high adjusts the B-port output rise and fall times.This allows the designer to optimize system data-transfer rate and signal integrity to the backplane load. When VCCis between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, OEAB\ should be tied to VCCthrough a pullup resistor and OEAB and OEBA should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sinking/current-sourcing capability of the driver.

The SN74GTLP21395 is two 1-bit, high-drive, 3-wire bus transceivers that provide LVTTL-to-GTLP and GTLP-to-LVTTL signal-level translation for applications, such as primary and secondary clocks, that require individual output-enable and true/complement controls. The device allows for transparent and inverted transparent modes of data transfer with separate LVTTL input and LVTTL output pins, which provide a feedback path for control and diagnostics monitoring. The device provides a high-speed interface between cards operating at LVTTL logic levels and a backplane operating at GTLP signal levels and is designed especially to work with the Texas Instruments 3.3-V 1394 backplane physical-layer controller. High-speed (about three times faster than standard LVTTL or TTL) backplane operation is a direct result of GTLP reduced output swing (<1 V), reduced input threshold levels, improved differential input, OEC™ circuitry, and TI-OPC™ circuitry. Improved GTLP OEC and TI-OPC circuitry minimizes bus settling time, and have been designed and tested using several backplane models. The high drive allows incident-wave switching in heavily loaded backplanes, with equivalent load impedance down to 11. The Y outputs, which are designed to sink up to 12 mA, include equivalent 26-resistors to reduce overshoot and undershoot. GTLP is the Texas Instruments derivative of the Gunning Transceiver Logic (GTL) JEDEC standard JESD 8-3. The ac specification of the SN74GTLP21395 is given only at the preferred higher noise margin GTLP, but the user has the flexibility of using this device at either GTL (VTT= 1.2 V and VREF= 0.8 V) or GTLP (VTT= 1.5 V and VREF= 1 V) signal levels. For information on using GTLP devices in FB+/BTL applications, refer to TI application reports,Texas Instruments GTLP Frequently Asked Questions, literature number SCEA019, andGTLP in BTL Applications, literature number SCEA017. Normally, the B port operates at GTLP signal levels. The A-port and control inputs operate at LVTTL logic levels, but are 5-V tolerant and are compatible with TTL or 5-V CMOS devices. VREFis the B-port differential input reference voltage. This device is fully specified for live-insertion applications using Ioff, power-up 3-state, and BIAS VCC. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. The BIAS VCCcircuitry precharges and preconditions the B-port input/output connections, preventing disturbance of active data on the backplane during card insertion or removal, and permits true live-insertion capability. This GTLP device features TI-OPC circuitry, which actively limits the overshoot caused by improperly terminated backplanes, unevenly distributed cards, or empty slots during low-to-high signal transitions. This improves signal integrity, which allows adequate noise margin to be maintained at higher frequencies. High-drive GTLP backplane interface devices feature adjustable edge-rate control (ERC). Changing the ERC input voltage between low and high adjusts the B-port output rise and fall times.This allows the designer to optimize system data-transfer rate and signal integrity to the backplane load. When VCCis between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, the output-enable (OE\) input should be tied to VCCthrough a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. The SN74GTLP21395 is two 1-bit, high-drive, 3-wire bus transceivers that provide LVTTL-to-GTLP and GTLP-to-LVTTL signal-level translation for applications, such as primary and secondary clocks, that require individual output-enable and true/complement controls. The device allows for transparent and inverted transparent modes of data transfer with separate LVTTL input and LVTTL output pins, which provide a feedback path for control and diagnostics monitoring. The device provides a high-speed interface between cards operating at LVTTL logic levels and a backplane operating at GTLP signal levels and is designed especially to work with the Texas Instruments 3.3-V 1394 backplane physical-layer controller. High-speed (about three times faster than standard LVTTL or TTL) backplane operation is a direct result of GTLP reduced output swing (<1 V), reduced input threshold levels, improved differential input, OEC™ circuitry, and TI-OPC™ circuitry. Improved GTLP OEC and TI-OPC circuitry minimizes bus settling time, and have been designed and tested using several backplane models. The high drive allows incident-wave switching in heavily loaded backplanes, with equivalent load impedance down to 11. The Y outputs, which are designed to sink up to 12 mA, include equivalent 26-resistors to reduce overshoot and undershoot. GTLP is the Texas Instruments derivative of the Gunning Transceiver Logic (GTL) JEDEC standard JESD 8-3. The ac specification of the SN74GTLP21395 is given only at the preferred higher noise margin GTLP, but the user has the flexibility of using this device at either GTL (VTT= 1.2 V and VREF= 0.8 V) or GTLP (VTT= 1.5 V and VREF= 1 V) signal levels. For information on using GTLP devices in FB+/BTL applications, refer to TI application reports,Texas Instruments GTLP Frequently Asked Questions, literature number SCEA019, andGTLP in BTL Applications, literature number SCEA017. Normally, the B port operates at GTLP signal levels. The A-port and control inputs operate at LVTTL logic levels, but are 5-V tolerant and are compatible with TTL or 5-V CMOS devices. VREFis the B-port differential input reference voltage. This device is fully specified for live-insertion applications using Ioff, power-up 3-state, and BIAS VCC. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. The BIAS VCCcircuitry precharges and preconditions the B-port input/output connections, preventing disturbance of active data on the backplane during card insertion or removal, and permits true live-insertion capability. This GTLP device features TI-OPC circuitry, which actively limits the overshoot caused by improperly terminated backplanes, unevenly distributed cards, or empty slots during low-to-high signal transitions. This improves signal integrity, which allows adequate noise margin to be maintained at higher frequencies. High-drive GTLP backplane interface devices feature adjustable edge-rate control (ERC). Changing the ERC input voltage between low and high adjusts the B-port output rise and fall times.This allows the designer to optimize system data-transfer rate and signal integrity to the backplane load. When VCCis between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, the output-enable (OE\) input should be tied to VCCthrough a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74GTLP22033 is a high-drive, 8-bit, three-wire registered transceiver that provides inverted LVTTL-to-GTLP and GTLP-to-LVTTL signal-level translation. The device allows for transparent, latched, and flip-flop modes of data transfer with separate LVTTL input and LVTTL output pins, which provides a feedback path for control and diagnostics monitoring, the same functionality as the SN74FB2033. The device provides a high-speed interface between cards operating at LVTTL logic levels and a backplane operating at GTLP signal levels. High-speed (about three times faster than standard LVTTL or TTL) backplane operation is a direct result of GTLP's reduced output swing (<1 V), reduced input threshold levels, improved differential input, OEC™ circuitry, and TI-OPC™ circuitry. Improved GTLP OEC and TI-OPC circuits minimize bus-settling time and have been designed and tested using several backplane models. The high drive allows incident-wave switching in heavily loaded backplanes with equivalent load impedance down to 11. The AO outputs, which are designed to sink up to 12 mA, include equivalent 26-resistors to reduce overshoot and undershoot. GTLP is the Texas Instruments derivative of the Gunning Transceiver Logic (GTL) JEDEC standard JESD 8-3. The ac specification of the SN74GTLP22033 is given only at the preferred higher noise margin GTLP, but the user has the flexibility of using this device at either GTL (VTT= 1.2 V and VREF= 0.8 V) or GTLP (VTT= 1.5 V and VREF= 1 V) signal levels. For information on using GTLP devices in FB+/BTL applications, refer to TI application reports,Texas Instruments GTLP Frequently Asked Questions, literature number SCEA019, andGTLP in BTL Applications, literature number SCEA017. Normally, the B port operates at GTLP signal levels. The A-port and control inputs operate at LVTTL logic levels, but are 5-V tolerant and can be directly driven by TTL or 5-V CMOS devices. VREFis the B-port differential input reference voltage. This device is fully specified for live-insertion applications using Ioff, power-up 3-state, and BIAS VCC. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. The BIAS VCCcircuitry precharges and preconditions the B-port input/output connections, preventing disturbance of active data on the backplane during card insertion or removal, and permits true live-insertion capability. This GTLP device features TI-OPC circuitry, which actively limits overshoot caused by improperly terminated backplanes, unevenly distributed cards, or empty slots during low-to-high signal transitions. This improves signal integrity, which allows adequate noise margin to be maintained at higher frequencies. High-drive GTLP backplane interface devices feature adjustable edge-rate control (ERC). Changing the ERC input voltage between low and high adjusts the B-port output rise and fall times.This allows the designer to optimize system data-transfer rate and signal integrity to the backplane load. When VCCis between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, OEAB\ should be tied to VCCthrough a pullup resistor and OEAB and OEBA should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sinking/current-sourcing capability of the driver. The SN74GTLP22033 is a high-drive, 8-bit, three-wire registered transceiver that provides inverted LVTTL-to-GTLP and GTLP-to-LVTTL signal-level translation. The device allows for transparent, latched, and flip-flop modes of data transfer with separate LVTTL input and LVTTL output pins, which provides a feedback path for control and diagnostics monitoring, the same functionality as the SN74FB2033. The device provides a high-speed interface between cards operating at LVTTL logic levels and a backplane operating at GTLP signal levels. High-speed (about three times faster than standard LVTTL or TTL) backplane operation is a direct result of GTLP's reduced output swing (<1 V), reduced input threshold levels, improved differential input, OEC™ circuitry, and TI-OPC™ circuitry. Improved GTLP OEC and TI-OPC circuits minimize bus-settling time and have been designed and tested using several backplane models. The high drive allows incident-wave switching in heavily loaded backplanes with equivalent load impedance down to 11. The AO outputs, which are designed to sink up to 12 mA, include equivalent 26-resistors to reduce overshoot and undershoot. GTLP is the Texas Instruments derivative of the Gunning Transceiver Logic (GTL) JEDEC standard JESD 8-3. The ac specification of the SN74GTLP22033 is given only at the preferred higher noise margin GTLP, but the user has the flexibility of using this device at either GTL (VTT= 1.2 V and VREF= 0.8 V) or GTLP (VTT= 1.5 V and VREF= 1 V) signal levels. For information on using GTLP devices in FB+/BTL applications, refer to TI application reports,Texas Instruments GTLP Frequently Asked Questions, literature number SCEA019, andGTLP in BTL Applications, literature number SCEA017. Normally, the B port operates at GTLP signal levels. The A-port and control inputs operate at LVTTL logic levels, but are 5-V tolerant and can be directly driven by TTL or 5-V CMOS devices. VREFis the B-port differential input reference voltage. This device is fully specified for live-insertion applications using Ioff, power-up 3-state, and BIAS VCC. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. The BIAS VCCcircuitry precharges and preconditions the B-port input/output connections, preventing disturbance of active data on the backplane during card insertion or removal, and permits true live-insertion capability. This GTLP device features TI-OPC circuitry, which actively limits overshoot caused by improperly terminated backplanes, unevenly distributed cards, or empty slots during low-to-high signal transitions. This improves signal integrity, which allows adequate noise margin to be maintained at higher frequencies. High-drive GTLP backplane interface devices feature adjustable edge-rate control (ERC). Changing the ERC input voltage between low and high adjusts the B-port output rise and fall times.This allows the designer to optimize system data-transfer rate and signal integrity to the backplane load. When VCCis between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, OEAB\ should be tied to VCCthrough a pullup resistor and OEAB and OEBA should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sinking/current-sourcing capability of the driver.

The SN74GTLP817 is a medium-drive fanout driver that provides LVTTL-to-GTLP and GTLP-to-LVTTL signal-level translation. The device provides a high-speed interface between cards operating at LVTTL logic levels and a backplane operating at GTLP signal levels. High-speed (about three times faster than standard TTL or LVTTL) backplane operation is a direct result of GTLP reduced output swing (<1 V), reduced input threshold levels, improved differential input, and OEC™ circuitry. The improved GTLP OEC circuitry minimizes bus settling time and has been designed and tested using several backplane models. The medium drive allows incident-wave switching in heavily loaded backplanes with equivalent load impedance down to 19. BO1 and BO2 can be tied together to drive an equivalent load impedance down to 11. GTLP is the Texas Instruments (TI™) derivative of the Gunning Transceiver Logic (GTL) JEDEC standard JESD 8-3. The ac specification of the SN74GTLP817 is given only at the preferred higher noise-margin GTLP, but the user has the flexibility of using this device at either GTL (VTT= 1.2 V and VREF= 0.8 V) or GTLP (VTT= 1.5 V and VREF= 1 V) signal levels. Normally, the B port operates at GTLP signal levels. The A-port and control inputs operate at LVTTL logic levels but are 5-V tolerant and are compatible with TTL and 5-V CMOS inputs. VREFis the B-port differential input reference voltage. GNDT is the TTL output ground, while GNDG is the GTLP output ground, and both may be separated from each other for a quieter device. This device is fully specified for hot-insertion applications using Ioffand power-up 3-state. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. This device features adjustable edge-rate control (ERC). Changing the ERC input voltage between GND and VCCadjusts the B-port output rise and fall times. This allows the designer to optimize system data-transfer rate and signal integrity to the backplane load. ERC automatically is selected to the same speed as alternate source 1-to-6 fanout drivers that use pin 18 for 3.3-V or 5-V VCC. When VCCis between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, the output-enable (OE\) input should be tied to VCCthrough a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. The SN74GTLP817 is a medium-drive fanout driver that provides LVTTL-to-GTLP and GTLP-to-LVTTL signal-level translation. The device provides a high-speed interface between cards operating at LVTTL logic levels and a backplane operating at GTLP signal levels. High-speed (about three times faster than standard TTL or LVTTL) backplane operation is a direct result of GTLP reduced output swing (<1 V), reduced input threshold levels, improved differential input, and OEC™ circuitry. The improved GTLP OEC circuitry minimizes bus settling time and has been designed and tested using several backplane models. The medium drive allows incident-wave switching in heavily loaded backplanes with equivalent load impedance down to 19. BO1 and BO2 can be tied together to drive an equivalent load impedance down to 11. GTLP is the Texas Instruments (TI™) derivative of the Gunning Transceiver Logic (GTL) JEDEC standard JESD 8-3. The ac specification of the SN74GTLP817 is given only at the preferred higher noise-margin GTLP, but the user has the flexibility of using this device at either GTL (VTT= 1.2 V and VREF= 0.8 V) or GTLP (VTT= 1.5 V and VREF= 1 V) signal levels. Normally, the B port operates at GTLP signal levels. The A-port and control inputs operate at LVTTL logic levels but are 5-V tolerant and are compatible with TTL and 5-V CMOS inputs. VREFis the B-port differential input reference voltage. GNDT is the TTL output ground, while GNDG is the GTLP output ground, and both may be separated from each other for a quieter device. This device is fully specified for hot-insertion applications using Ioffand power-up 3-state. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. This device features adjustable edge-rate control (ERC). Changing the ERC input voltage between GND and VCCadjusts the B-port output rise and fall times. This allows the designer to optimize system data-transfer rate and signal integrity to the backplane load. ERC automatically is selected to the same speed as alternate source 1-to-6 fanout drivers that use pin 18 for 3.3-V or 5-V VCC. When VCCis between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, the output-enable (OE\) input should be tied to VCCthrough a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74GTLPH1645 is a high-drive, 16-bit bus transceiver that provides LVTTL-to-GTLP and GTLP-to-LVTTL signal-level translation. It is partitioned as two 8-bit transceivers. The device provides a high-speed interface between cards operating at LVTTL logic levels and a backplane operating at GTLP signal levels. High-speed (about three times faster than standard LVTTL or TTL) backplane operation is a direct result of GTLP's reduced output swing (<1 V), reduced input threshold levels, improved differential input, OEC™ circuitry, and TI-OPC™ circuitry. Improved GTLP OEC and TI-OPC circuits minimize bus-settling time and have been designed and tested using several backplane models. The high drive allows incident-wave switching in heavily loaded backplanes with equivalent load impedance down to 11. GTLP is the Texas Instruments derivative of the Gunning Transceiver Logic (GTL) JEDEC standard JESD 8-3. The ac specification of the SN74GTLPH1645 is given only at the preferred higher noise-margin GTLP, but the user has the flexibility of using this device at either GTL (VTT= 1.2 V and VREF= 0.8 V) or GTLP (VTT= 1.5 V and VREF= 1 V) signal levels. Normally, the B port operates at GTLP signal levels. The A-port and control inputs operate at LVTTL logic levels but are 5-V tolerant and are compatible with TTL and 5-V CMOS inputs. VREFis the B-port differential input reference voltage. This device is fully specified for live-insertion applications using Ioff, power-up 3-state, and BIAS VCC. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. The BIAS VCCcircuitry precharges and preconditions the B-port input/output connections, preventing disturbance of active data on the backplane during card insertion or removal, and permits true live-insertion capability. This GTLP device features TI-OPC circuitry, which actively limits the overshoot caused by improperly terminated backplanes, unevenly distributed cards, or empty slots during low-to-high signal transitions. This improves signal integrity, which allows adequate noise margin to be maintained at higher frequencies. High-drive GTLP backplane interface devices feature adjustable edge-rate control (ERC\). Changing the ERC\ input voltage between GND and VCCadjusts the B-port output rise and fall times.This allows the designer to optimize system data-transfer rate and signal integrity to the backplane load. Active bus-hold circuitry holds unused or undriven LVTTL data inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended. When VCCis between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, the output-enable (OE\) input should be tied to VCCthrough a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. The SN74GTLPH1645 is a high-drive, 16-bit bus transceiver that provides LVTTL-to-GTLP and GTLP-to-LVTTL signal-level translation. It is partitioned as two 8-bit transceivers. The device provides a high-speed interface between cards operating at LVTTL logic levels and a backplane operating at GTLP signal levels. High-speed (about three times faster than standard LVTTL or TTL) backplane operation is a direct result of GTLP's reduced output swing (<1 V), reduced input threshold levels, improved differential input, OEC™ circuitry, and TI-OPC™ circuitry. Improved GTLP OEC and TI-OPC circuits minimize bus-settling time and have been designed and tested using several backplane models. The high drive allows incident-wave switching in heavily loaded backplanes with equivalent load impedance down to 11. GTLP is the Texas Instruments derivative of the Gunning Transceiver Logic (GTL) JEDEC standard JESD 8-3. The ac specification of the SN74GTLPH1645 is given only at the preferred higher noise-margin GTLP, but the user has the flexibility of using this device at either GTL (VTT= 1.2 V and VREF= 0.8 V) or GTLP (VTT= 1.5 V and VREF= 1 V) signal levels. Normally, the B port operates at GTLP signal levels. The A-port and control inputs operate at LVTTL logic levels but are 5-V tolerant and are compatible with TTL and 5-V CMOS inputs. VREFis the B-port differential input reference voltage. This device is fully specified for live-insertion applications using Ioff, power-up 3-state, and BIAS VCC. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. The BIAS VCCcircuitry precharges and preconditions the B-port input/output connections, preventing disturbance of active data on the backplane during card insertion or removal, and permits true live-insertion capability. This GTLP device features TI-OPC circuitry, which actively limits the overshoot caused by improperly terminated backplanes, unevenly distributed cards, or empty slots during low-to-high signal transitions. This improves signal integrity, which allows adequate noise margin to be maintained at higher frequencies. High-drive GTLP backplane interface devices feature adjustable edge-rate control (ERC\). Changing the ERC\ input voltage between GND and VCCadjusts the B-port output rise and fall times.This allows the designer to optimize system data-transfer rate and signal integrity to the backplane load. Active bus-hold circuitry holds unused or undriven LVTTL data inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended. When VCCis between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, the output-enable (OE\) input should be tied to VCCthrough a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.