IPS8200Industrial digital output expansion board based on IPS8200HQ for STM32 Nucleo | Expansion Boards, Daughter Cards | 2 | Active | The X-NUCLEO-OUT17A1 is an industrial digital output expansion board for STM32 Nucleo. It provides a powerful and flexible environment for the evaluation of the driving and diagnostic capabilities of the IPS8200HQ-1 octal high-side, smart power, solid-state relay in a digital output module connected to 1.0 A industrial loads.
The X-NUCLEO-OUT17A1 interfaces with the microcontroller on the STM32 Nucleo via STISO620 and STISO621 and Arduino®UNO R3 connectors.
The user can select which driving mode controls the IPS8200HQ-1: parallel (SEL2 = L by JP21 = open) or SPI (SEL2 = H by JP21 = closed).
In the case of SPI selection, the user can select the communication protocol between 8 bits (SEL1 = L by JP22 = open) or 16 bits (SEL1 = H by JP22 = closed).
The VCCsupply pin of the IPS8200HQ-1 is provided by the connector CN1, while the loads (driven by the 8 output channels of the IPS8200HQ-1) can be connected between the connectors CN2, CN3, CN4, CN12, and the pin 2 of the connector CN1.
The on-board digital isolators (STISO620 and STISO621) feature the 2.8k VRMS(4k VPK) galvanic isolation between the two application sides: logic and process sides.
The logic side is the application side of the MCU and it is supplied by the VISO_L rail (3.3 or 5.0 V). VISO_L can be supplied by an external power supply connected to CN13 or, alternatively by the pin 4 (SW1 = close 1-2) or pin 5 (SW1 = close 2-3) of CN6.
The process side is the application side of the industrial loads and it is supplied by the VCC and VISO_P rails. The VISO_P (3.3 or 5.0 V) is usually supplied by the VREG rail (JP31 = closed) that can be generated by the step-down embedded in the IPS8200HQ-1 (SW17 = close 1-2, JP20 = closed, JP15 = closed and JP28 = close 2-4 (VREG = 3.3 V) or JP28 = 1-3 (VREG = 5.0 V)).
Alternatively, VREG can be provided by an external power supply connected to CN14 (SW17 = close 2-3, JP20 = open, JP15 = open).
In parallel driving mode (active with the default jumper and switch settings) the application board can work even without any Nucleo board: in this case, the user must provide the process side voltage (usually 24 V) by the CN1 and the VISO_L (usually 3.3 V) by the CN13. The INXsignals, available on CN5[1, 2, 3], CN8[4] and CN9[3, 5, 7, 8], drives on/off the correspondent OUTXconnected to the loads on the process side.
The INXpins can be driven low/high swinging between 0V and VISO_L. The activation of each OUTX (OUT1… OUT8) can be monitored by the green LEDs DOX (DO1… DO8).
The activation of the three diagnostic pins (TWARN, PGOOD, FAULT) can be visualized on the correspondent red LEDs (D11, D12, D13, respectively) or monitored by an oscilloscope on CN8[5], CN5[9], CN5[10].
The SPI driving mode can be set by changing the default configuration (JP21 = close; SW4, SW5, SW6, SW7, SW9, SW10, SW11, SW12, SW13, SW14, SW15, SW20 = close 2-3, SW18 = close 1-2). The SPI-8bits is the default mode (JP22 = open), while the SPI-16bits mode can be activated by JP22 = close.
In SPI driving mode it is also possible to activate the MCU freeze detection feature by setting SW3 = close 2-3.
The expansion board can be connected to either a NUCLEO-F401RE or a NUCLEO-G431RB development board. In this case the companion firmware X-CUBE-IPS detects the selected configuration (GPIO, SPI-8bits, SPI-16bits) by reading the signals SEL2_L and SEL1 from CN8[1] and CN8[6]. The activation of the MCU freeze feature is detected by WDEN(in) on CN9[4].
It is also possible to evaluate a system composed of a X-NUCLEO-OUT17A1 stacked on other expansion boards. In fact, SPI driving mode allows the daisy-chaining communication with another X-NUCLEO-OUT17A1 stacked through the Arduino connectors: the two stacked boards must be configured with SW6, SW18 = close 2-3 on one board, and SW6, SW18 = close 1-2 on the other board. |
IPS8200HQOctal high-side smart power solid-state relay with serial/parallel selectable interface on-chip | Integrated Circuits (ICs) | 1 | Active | The IPS8200HQ and IPS8200HQ -1 are monolithic 8-channel drivers, designed using STMicroelectronics™ VIPower™ technology, and intended to drive any kind of load with one side connected to the ground. Both ICs operates from 10.5 V to 36 V and feature a very low supply current, parallel or 4-wire SPI control interface, a 4x2 LED matrix, and a micropower step-down switching regulator with a peak current control loop mode.
The SPI interface (enabled by SEL2 pin = H) can work up to 5 MHz in 8-bits (SEL1 = L), or 16-bits (SEL1 = H) with a parity check and extended diagnostic (DC/DC operation, case overtemperature, SPI Communication Fail, and Power Good) information. In SPI mode the daisy chain is allowed, and both the OUT_EN signal and the MCU freeze detection by watchdog are available. If enabled (WD_EN voltage above 25% of VREG), the watchdog circuitry generates an internal reset on expiry of the internal watchdog timer. The watchdog timer reset can be achieved by applying a negative pulse on the WD pin. The watchdog timer can be programmed by the set voltage on the WD_EN pin.
The internal LED matrix driver circuitry (4 rows, 2 columns) allows the efficient driving of the 8 LEDs reporting the on/off status of each of the 8 outputs. The VREG pin supplies both the logic output buffers and LED matrix. The 100 mA output current capability of the integrated step-down (featuring overload and short-circuit conditions) can be used to supply both the VREG pin and other application components (for example: digital isolators or optocouplers).
Active per-channel current limitations (0.7 A and 1.0 A for IPS8200HQ and IPS8200HQ-1, respectively), combined with channel-independent thermal shutdown, protect the circuitry against overload and short circuits. Built-in thermal shutdown protects each channel from overtemperature and overload: each overheated channel automatically turns OFF after its junction temperature triggers the protection threshold (TTSD). The channel turns back ON if its junction temperature decreases lower than the restart threshold (TR). An additional case temperature sensor protects the whole chip against overtemperature: if the case temperature triggers the TCSD threshold then overloaded channels are turned OFF and restart only when the case temperature decreases to the reset threshold (TCR). Non-overloaded channels continue to operate normally.
Loss of GND protection guarantees automatic turn-off of the outputs in case of a ground wire break.
Dedicated diagnostic pins report the detection of: invalid voltage range on VCC rail (PG pin), caseovertemperature (TWARN pin), SPI fault, or junction overtemperature (FAULT pin). |
IPS8200HQ-1Octal high-side smart power solid-state relay with serial/parallel selectable interface on-chip | Power Management (PMIC) | 1 | Active | The IPS8200HQ and IPS8200HQ -1 are monolithic 8-channel drivers, designed using STMicroelectronics™ VIPower™ technology, and intended to drive any kind of load with one side connected to the ground. Both ICs operates from 10.5 V to 36 V and feature a very low supply current, parallel or 4-wire SPI control interface, a 4x2 LED matrix, and a micropower step-down switching regulator with a peak current control loop mode.
The SPI interface (enabled by SEL2 pin = H) can work up to 5 MHz in 8-bits (SEL1 = L), or 16-bits (SEL1 = H) with a parity check and extended diagnostic (DC/DC operation, case overtemperature, SPI Communication Fail, and Power Good) information. In SPI mode the daisy chain is allowed, and both the OUT_EN signal and the MCU freeze detection by watchdog are available. If enabled (WD_EN voltage above 25% of VREG), the watchdog circuitry generates an internal reset on expiry of the internal watchdog timer. The watchdog timer reset can be achieved by applying a negative pulse on the WD pin. The watchdog timer can be programmed by the set voltage on the WD_EN pin.
The internal LED matrix driver circuitry (4 rows, 2 columns) allows the efficient driving of the 8 LEDs reporting the on/off status of each of the 8 outputs. The VREG pin supplies both the logic output buffers and LED matrix. The 100 mA output current capability of the integrated step-down (featuring overload and short-circuit conditions) can be used to supply both the VREG pin and other application components (for example: digital isolators or optocouplers).
Active per-channel current limitations (0.7 A and 1.0 A for IPS8200HQ and IPS8200HQ-1, respectively), combined with channel-independent thermal shutdown, protect the circuitry against overload and short circuits. Built-in thermal shutdown protects each channel from overtemperature and overload: each overheated channel automatically turns OFF after its junction temperature triggers the protection threshold (TTSD). The channel turns back ON if its junction temperature decreases lower than the restart threshold (TR). An additional case temperature sensor protects the whole chip against overtemperature: if the case temperature triggers the TCSD threshold then overloaded channels are turned OFF and restart only when the case temperature decreases to the reset threshold (TCR). Non-overloaded channels continue to operate normally.
Loss of GND protection guarantees automatic turn-off of the outputs in case of a ground wire break.
Dedicated diagnostic pins report the detection of: invalid voltage range on VCC rail (PG pin), caseovertemperature (TWARN pin), SPI fault, or junction overtemperature (FAULT pin). |
| Single | 2 | Obsolete | |
IRF630N-channel 200 V, 0.35 Ohm typ., 9 A Power MOSFET in DPAK package | Transistors | 1 | Active | This Power MOSFET series realized with STMicroelectronics unique STripFET™ process has specifically been designed to minimize input capacitance and gate charge. It is therefore suitable as primary switch in advanced high-efficiency isolated DC-DC converters. |
| Transistors | 1 | Obsolete | |
| Single FETs, MOSFETs | 1 | Obsolete | |
ISA203V148 V flyback converter 12 V - 5 A based on PM8804 | Evaluation Boards | 1 | Active | STEVAL-ISA203V1 evaluation board is designed to demonstrate high efficiency DC-DC conversion with 60 W output (12 V/5 A) from 42 to 56 VDCinput (48 V nom.), which is especially suitable for telecom applications.
The power conversion stage is based on a flyback topology managed by the PM8804 controller, which features all the integrated circuitry necessary for a compact and efficient 48 V converter. The highly configurable controller includes a programmable oscillator for switching frequency regulation up to 1 Mhz, adjustable slope compensation, dual complementary low-side drivers with programmable dead time, programmable soft start, soft turn off and a programmable current sense blanking time.
The secondary side employs the SRK1000 adaptive synchronous rectification controller for flyback converters. |
| Sensors, Transducers | 1 | Active | |
ISM330iNEMO inertial module with Machine Learning Core, Finite State Machine with digital output for industrial applications. | Motion Sensors | 8 | Active | The ISM330DHCX is a system-in-package featuring a high-performance 3D digital accelerometer and 3D digital gyroscope tailored for Industry 4.0 applications.
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
In the ISM330DHCX the sensing elements of the accelerometer and of the gyroscope are implemented on the same silicon die, thus guaranteeing superior stability and robustness.
The ISM330DHCX has a full-scale acceleration range of ±2/±4/±8/±16 g and a wide angular rate range of ±125/±250/±500/±1000/±2000/±4000 dps that enable its usage in a broad range of applications.
All the design aspects and the calibration of the ISM330DHCX have been optimized to reach superior accuracy, stability, extremely low noise and full data synchronization.
An unmatched set of embedded features (Machine Learning Core, programmable FSM, FIFO, sensor hub, event decoding and interrupts) are enablers for implementing smart and complex sensor nodes which deliver high performance at very low power.
The ISM330DHCX is available in a 14-lead plastic land grid array (LGA) package. |
