
MSCSM120DDUM16CTBL3NG-Module Series
1200V, 12.5 mOhm, BL3, Double Dual Common Source Baseplate-less mSiC™ MOSFET Module
Manufacturer: Microchip Technology
Catalog
1200V, 12.5 mOhm, BL3, Double Dual Common Source Baseplate-less mSiC™ MOSFET Module
| Part | Operating Temperature [Min] | Operating Temperature [Max] | Supplier Device Package | Current - Continuous Drain (Id) @ 25°C | Configuration | Package / Case | Mounting Type | Input Capacitance (Ciss) (Max) @ Vds | Rds On (Max) @ Id, Vgs | Drain to Source Voltage (Vdss) | Drain to Source Voltage (Vdss) | Technology | Power - Max [Max] | Gate Charge (Qg) (Max) @ Vgs | Power - Max | Vgs(th) (Max) @ Id | Vgs(th) (Max) @ Id [Max] | Gate Charge (Qg) (Max) @ Vgs [Max] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology | -40 C | 175 °C | SP6C | 733 A | 2 N Channel | Module | Chassis Mount | 27000 pF | 3.5 mOhm | 1200 V | 1.2 kV | Silicon Carbide (SiC) | 2.97 kW | 2088 nC | ||||
Microchip Technology | -40 C | 175 °C | 254 A | 2 N Channel | Module | Chassis Mount | 9060 pF | 10.4 mOhm | 1200 V | 1.2 kV | Silicon Carbide (SiC) | 696 nC | 1.067 kW | |||||
Microchip Technology | -55 °C | 175 ░C | 150 A | 4 N-Channel Common Source | Module | Chassis Mount | 6040 pF | 1200 V | 1.2 kV | Silicon Carbide (SiC) | 560 W | 464 nC | 2.8 V | |||||
Microchip Technology | -55 °C | 175 ░C | 79 A | 2 N-Channel (Dual) Common Source | Module | Chassis Mount | 3020 pF | 31 mOhm | 1200 V | 1.2 kV | Silicon Carbide (SiC) | 310 W | 232 nC | 2.8 V | ||||
Microchip Technology | -40 C | 175 °C | 733 A | 2 N Channel | Module | Chassis Mount | 27000 pF | 3.5 mOhm | 1200 V | 1.2 kV | Silicon Carbide (SiC) | 2.97 kW | 2088 nC | 2.8 V | ||||
Microchip Technology | -55 °C | 175 ░C | 79 A | 2 N-Channel (Dual) Asymmetrical | Module | Chassis Mount | 3020 pF | 31 mOhm | 1200 V | 1.2 kV | Silicon Carbide (SiC) | 310 W | 232 nC | 2.8 V | ||||
Microchip Technology | -40 C | 175 °C | SP6C LI | 947 A | 2 N Channel | Module | Chassis Mount | 36240 pF | 2.6 mOhm | 1200 V | 1.2 kV | Silicon Carbide (SiC) | 3.75 kW | 2784 nC | 2.8 V | |||
Microchip Technology | -55 °C | 175 ░C | 79 A | 2 N Channel | Module | Chassis Mount | 3020 pF | 31 mOhm | 1200 V | 1.2 kV | Silicon Carbide (SiC) | 310 W | 232 nC | 2.8 V | ||||
Microchip Technology | -40 C | 175 °C | 495 A | 2 N Channel | Module | Chassis Mount | 18100 pF | 5.2 mOhm | 1200 V | 1.2 kV | Silicon Carbide (SiC) | 2.031 kW | 2.8 V | 1392 nC | ||||
Microchip Technology | -40 C | 175 °C | SP6C LI | 805 A | 2 N Channel | Module | Chassis Mount | 30200 pF | 3.1 mOhm | 1200 V | 1.2 kV | Silicon Carbide (SiC) | 3.215 kW | 2.8 V | 2320 nC |
Key Features
- • Configuration: Double dual common source
- • VDSS (V): 1200
- • RDSon (mR) typ: 12.5
- • Current (A) Tc=80°C: 120
- • Silicon type: SiC MOSFET
- • Package type: BL3
Description
AI
• SiC Power MOSFET
- Low RDS(on)
- High-temperature performance
• Kelvin source for easy drive
• Low stray inductance
• Internal thermistor for temperature monitoring (optional)
• High-efficiency converter
• Outstanding performance at high-frequency operation
• Stable temperature behavior
• Direct mounting to the heatsink (isolated package)
• Low junction to case thermal resistance
• RoHS Compliant