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Technical Specifications
Parameters and characteristics for this part
| Specification | 20-350000-10-HT |
|---|---|
| Board Material | Polyimide (PI) |
| Board Thickness | 1.57 mm |
| Board Thickness | 0.062 " |
| Contact Finish - Post | Tin-Lead |
| Contact Finish Thickness - Post | 200 µin |
| Contact Finish Thickness - Post | 5.08 µm |
| Contact Material - Post [custom] | Brass |
| Convert From (Adapter End) | SOIC |
| Convert To (Adapter End) | 7.62 mm |
| Convert To (Adapter End) | DIP |
| Convert To (Adapter End) | 0.3 in |
| Material | FR4 Epoxy Glass |
| Mounting Type | Through Hole |
| Number of Positions | 20 |
| Package Accepted | SOIC |
| Pitch | 0.05 in |
| Pitch | 1.27 mm |
| Pitch - Mating | 1.27 mm |
| Pitch - Mating | 0.05 in |
| Pitch - Post | 0.1 in |
| Pitch - Post | 2.54 mm |
| Proto Board Type | DIP to DIP |
| Termination | Solder |
| Termination Post Length | 0.125 in |
| Termination Post Length | 3.18 mm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 38 | $ 16.89 | |
| N/A | 0 | $ 19.57 | ||
Description
General part information
20-3500 Series
IC Socket Adapter SOIC To DIP, 0.3" (7.62mm) Row Spacing Through Hole
Documents
Technical documentation and resources
