20-3500 Series

Part	Size / Dimension [y]	Size / Dimension [x]	Size / Dimension [x]	Size / Dimension [y]	Package Accepted	Number of Positions	Board Thickness	Board Thickness	Board Thickness	Proto Board Type	Pitch [x]	Pitch [x]	Material	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Mounting Type	Contact Material - Post [custom]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Post	Pitch - Mating	Pitch - Mating	Termination Post Length	Termination Post Length	Board Material	Pitch - Post	Pitch - Post	Termination	Convert From (Adapter End)
Aries Electronics 20-350000-10	0.45 in	50.8 mm	2 in	11.43 mm	SOIC	20	0.062 in	0.0625 in	1.57 mm	SMD to DIP	0.05 in	1.27 mm	FR4 Epoxy Glass
Aries Electronics 20-350001-11-RC														0.3 in	DIP	7.62 mm	Through Hole	Brass	200 µin	5.08 µm	Tin	0.05 in	1.27 mm	3.18 mm	0.125 in	FR4 Epoxy Glass	2.54 mm	0.1 in	Solder	SOJ
Aries Electronics 20-350000-11-RC-P	0.45 in	50.8 mm	2 in	11.43 mm	SOIC	20	0.062 in	0.0625 in	1.57 mm	SMD to DIP	0.05 in	1.27 mm	FR4 Epoxy Glass
Aries Electronics 20-350000-10-HT														0.3 in	DIP	7.62 mm	Through Hole	Brass	200 µin	5.08 µm	Tin-Lead	0.05 in	1.27 mm	3.18 mm	0.125 in	Polyimide (PI)	2.54 mm	0.1 in	Solder	SOIC
Aries Electronics 20-350000-11-RC	0.45 in	50.8 mm	2 in	11.43 mm	SOIC	20	0.062 in	0.0625 in	1.57 mm	SMD to DIP	0.05 in	1.27 mm	FR4 Epoxy Glass
Aries Electronics 20-350001-10														0.3 in	DIP	7.62 mm	Through Hole	Brass	200 µin	5.08 µm	Tin	0.05 in	1.27 mm	3.18 mm	0.125 in	FR4 Epoxy Glass	2.54 mm	0.1 in	Solder	SOJ

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly