20-3500 Series

Catalog

SOCKET ADAPTER SOIC TO 20DIP 0.3

Part	Board Thickness	Board Thickness	Board Thickness	Material	Proto Board Type	Number of Positions	Pitch	Pitch	Package Accepted	Size / Dimension [y]	Size / Dimension [x]	Size / Dimension [x]	Size / Dimension [y]	Board Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Mating	Pitch - Mating	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Convert From (Adapter End)	Contact Finish - Post	Mounting Type	Pitch - Post	Pitch - Post	Contact Material - Post [custom]	Termination	Termination Post Length	Termination Post Length
Aries Electronics 20-350000-10	1.57 mm	0.062 "	0.0625 in	FR4 Epoxy Glass	SMD to DIP	20	0.05 in	1.27 mm	SOIC	11.43 mm	2 in	50.8 mm	0.45 in
Aries Electronics 20-350001-11-RC	1.57 mm	0.062 "		FR4 Epoxy Glass	DIP to DIP	20	0.05 in	1.27 mm	SOIC					FR4 Epoxy Glass	200 µin	5.08 µm	1.27 mm	0.05 in	7.62 mm	DIP	0.3 in	SOJ	Tin	Through Hole	0.1 in	2.54 mm	Brass	Solder	0.125 in	3.18 mm
Aries Electronics 20-350000-11-RC-P	1.57 mm	0.062 "	0.0625 in	FR4 Epoxy Glass	SMD to DIP	20	0.05 in	1.27 mm	SOIC	11.43 mm	2 in	50.8 mm	0.45 in
Aries Electronics 20-350000-10-HT	1.57 mm	0.062 "		FR4 Epoxy Glass	DIP to DIP	20	0.05 in	1.27 mm	SOIC					Polyimide (PI)	200 µin	5.08 µm	1.27 mm	0.05 in	7.62 mm	DIP	0.3 in	SOIC	Tin-Lead	Through Hole	0.1 in	2.54 mm	Brass	Solder	0.125 in	3.18 mm
Aries Electronics 20-350000-11-RC	1.57 mm	0.062 "	0.0625 in	FR4 Epoxy Glass	SMD to DIP	20	0.05 in	1.27 mm	SOIC	11.43 mm	2 in	50.8 mm	0.45 in
Aries Electronics 20-350001-10	1.57 mm	0.062 "		FR4 Epoxy Glass	DIP to DIP	20	0.05 in	1.27 mm	SOIC					FR4 Epoxy Glass	200 µin	5.08 µm	1.27 mm	0.05 in	7.62 mm	DIP	0.3 in	SOJ	Tin	Through Hole	0.1 in	2.54 mm	Brass	Solder	0.125 in	3.18 mm