Aries Electronics is an industry leader in IC sockets and electronic interconnects, specializing in ZIF test sockets, burn-in sockets, and Correct-A-Chip adapters since 1972.
Parts that are not part of a series
Company background and product focus
Aries Electronics, established in 1972 and based in Bristol, Pennsylvania, is a recognized industry leader in IC sockets and electronic interconnection products. The company manufactures a comprehensive range of test and burn-in sockets, adapters, and connectors for electronics applications worldwide.
Aries Electronics is the industry leader in ZIF (Zero-Insertion-Force) Test Sockets for DIP, PGA, PLCC, and SOIC devices. Their product line includes several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets, along with high-frequency test sockets exceeding 60 GHz.
Key product categories include:
Aries serves semiconductor manufacturers, test houses, and electronics OEMs requiring precision interconnection solutions for IC testing, prototyping, and production applications.
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Product families from Aries Electronics
| Series | Category | Parts | Status | Description |
|---|---|---|---|---|
| Series | Category | Parts | Status | Description |
|---|---|---|---|---|
| IC Sockets | 2 | Active | ||
| Sockets for ICs, Transistors | 2 | Active | ||
| Sockets for ICs, Transistors | 1 | Active | ||
| Connectors, Interconnects | 4 | Active | ||
| Rectangular Connectors | 1 | Active | ||
| Headers, Specialty Pin | 5 | Active | ||
| Cable Assemblies | 1 | Active | ||
| Flat Flex Ribbon Jumpers, Cables | 1 | Active | ||
| Connectors, Interconnects | 2 | Active | ||
| Connectors, Interconnects | 4 | Active |
Parts from Aries Electronics that are not part of a series
| Part Information | Pricing (lowest) | Mounting Type | Contact Finish Thickness - Post | Contact Finish - Post | Contact Material - Post | Contact Material - Mating | Grid Rows | Number of Positions or Pins (Grid) | Grid Columns | Type | Contact Finish Thickness - Mating | Housing Material | Termination | Contact Finish - Mating | Operating Temperature (Min) | Operating Temperature (Max) | Pitch - Post | Features | Pitch - Mating | Contact Type | Color | Number of Positions | Connector Type | Contact Finish Thickness | Number of Rows | Contact Finish |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() Aries Electronics CONN SOCKET SIP 1POS GOLD | Sign in to see pricing | Through Hole | 30 µin | Tin | Brass | Beryllium Copper | 1 | 1 | 1 | SIP | 30 µin | Glass Filled, Nylon, PA, Polyamide | Wire Wrap | Gold | — | — | — | — | — | — | — | — | — | — | — | — |
![]() Aries Electronics CONN SOCKET SIP 1POS GOLD | Sign in to see pricing | Through Hole | 200 µin | Tin | Brass | Beryllium Copper | 1 | 1 | 1 | SIP | 10 µin | Nylon 4/6, PA46, Polyamide | Wire Wrap | Gold | -55 °C | 105 °C | — | — | — | — | — | — | — | — | — | — |
![]() Aries Electronics CONN SOCKET SIP 1POS GOLD | Sign in to see pricing | Through Hole | 200 µin | Tin | Brass | Beryllium Copper | 1 | 1 | 1 | SIP | 10 µin | Nylon 4/6, PA46, Polyamide | Wire Wrap | Gold | -55 °C | 105 °C | — | — | — | — | — | — | — | — | — | — |
![]() Aries Electronics CONN SOCKET SIP 1POS GOLD | Sign in to see pricing | Through Hole | 200 µin | Tin | Brass | Beryllium Copper | 1 | 1 | 1 | SIP | 10 µin | Glass Filled, Nylon 4/6, PA46, Polyamide | Solder | Gold | — | — | — | — | — | — | — | — | — | — | — | — |
![]() Aries Electronics CONN SOCKET SIP 1POS GOLD | Sign in to see pricing | Through Hole | 200 µin | Tin | Brass | Beryllium Copper | 1 | 1 | 1 | SIP | 10 µin | Glass Filled, Nylon 4/6, PA46, Polyamide | Solder | Gold | — | — | — | — | — | — | — | — | — | — | — | — |
![]() Aries Electronics CONN SOCKET SIP 1POS GOLD | Sign in to see pricing | Through Hole | 200 µin | Tin | Brass | Beryllium Copper | 1 | 1 | 1 | SIP | 10 µin | Glass Filled, Nylon 4/6, PA46, Polyamide | Solder | Gold | — | — | — | — | — | — | — | — | — | — | — | — |
![]() Aries Electronics CONN SOCKET SIP 1POS GOLD | Sign in to see pricing | Through Hole | 10 µin | Gold | Brass | Beryllium Copper | 1 | 1 | 1 | SIP | 10 µin | Glass Filled, Nylon 4/6, PA46, Polyamide | Solder | Gold | — | — | — | — | — | — | — | — | — | — | — | — |
![]() Aries Electronics CONN SOCKET SIP 1POS GOLD | Sign in to see pricing | Surface Mount | 200 µin | Tin | Brass | Beryllium Copper | 1 | 1 | 1 | SIP | 10 µin | Glass Filled, Nylon 4/6, PA46, Polyamide | Solder | Gold | — | — | 0.1 in | Open Frame | 0.1 in | — | — | — | — | — | — | — |
![]() Aries Electronics CONN SOCKET SIP 1POS GOLD | Sign in to see pricing | Through Hole | 200 µin | Tin | Brass | Beryllium Copper | 1 | 1 | 1 | SIP | 10 µin | Glass Filled, Nylon 4/6, PA46, Polyamide | Solder | Gold | — | — | 0.1 in | Open Frame | 0.1 in | — | — | — | — | — | — | — |
![]() Aries Electronics CONN HDR DIP FORK 1POS TIN | Sign in to see pricing | Through Hole | — | — | — | — | — | — | — | — | — | — | Solder | — | — | — | — | — | — | Forked | Black | 1 | DIL - Header, DIP | 200 µin | 1 | Tin |