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YZP-6-BGA Pkg
Integrated Circuits (ICs)

SN74LVC2G07YEPR

Obsolete
Texas Instruments

IC BUF NON-INVERT 5.5V 6DSBGA

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YZP-6-BGA Pkg
Integrated Circuits (ICs)

SN74LVC2G07YEPR

Obsolete
Texas Instruments

IC BUF NON-INVERT 5.5V 6DSBGA

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

SpecificationSN74LVC2G07YEPR
Current - Output High, Low [custom]-
Current - Output High, Low [custom]32 mA
Logic TypeBuffer, Non-Inverting
Mounting TypeSurface Mount
Number of Bits per Element1
Number of Elements2
Operating Temperature [Max]125 °C
Operating Temperature [Min]-40 °C
Output TypeOpen Drain
Package / Case6-XFBGA, DSBGA
Supplier Device Package6-DSBGA
Voltage - Supply [Max]5.5 V
Voltage - Supply [Min]1.65 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

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Description

General part information

SN74LVC2G07-EP Series

This dual buffer and driver is designed for 1.65-V to 5.5-V VCCoperation. The output of the SN74LVC2G07 device is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.

NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

Documents

Technical documentation and resources