SN74LVC2G07-EP Series

Enhanced product 2-ch, 1.65-V to 5.5-V buffers with open-drain outputs

Catalog

Enhanced product 2-ch, 1.65-V to 5.5-V buffers with open-drain outputs

Part	Current - Output High, Low [custom]	Current - Output High, Low [custom]	Operating Temperature [Min]	Operating Temperature [Max]	Package / Case	Logic Type	Number of Elements	Supplier Device Package	Mounting Type	Number of Bits per Element	Voltage - Supply [Max]	Voltage - Supply [Min]	Output Type	Operating Temperature [Max]	Operating Temperature [Min]
Texas Instruments SN74LVC2G07DCKR-P	-	32 mA	-40 °C	125 °C	6-TSSOP SC-88 SOT-363	Buffer Non-Inverting	2	SC-70-6	Surface Mount	2	5.5 V	1.65 V	Open Drain
Texas Instruments SN74LVC2G07DCKT	-	32 mA	-40 °C	125 °C	6-TSSOP SC-88 SOT-363	Buffer Non-Inverting	2	SC-70-6	Surface Mount	1	5.5 V	1.65 V	Open Drain
Texas Instruments SN74LVC2G07YZPR	-	32 mA	-40 °C	125 °C	6-XFBGA DSBGA	Buffer Non-Inverting	2	6-DSBGA	Surface Mount	1	5.5 V	1.65 V	Open Drain
Texas Instruments SN74LVC2G07MDCKTEP	-	24 mA			6-TSSOP SC-88 SOT-363	Buffer Non-Inverting	2	SC-70-6	Surface Mount	1	5.5 V	1.65 V	Open Drain	125 °C	-55 °C
Texas Instruments SN74LVC2G07DRYR	-	32 mA	-40 °C	125 °C	6-UFDFN	Buffer Non-Inverting	2	6-SON (1.45x1)	Surface Mount	1	5.5 V	1.65 V	Open Drain
Texas Instruments SN74LVC2G07DSFR	-	32 mA	-40 °C	125 °C	6-XFDFN	Buffer Non-Inverting	2	6-SON (1x1)	Surface Mount	1	5.5 V	1.65 V	Open Drain
Texas Instruments SN74LVC2G07DCKR	-	32 mA	-40 °C	125 °C	6-TSSOP SC-88 SOT-363	Buffer Non-Inverting	2	SC-70-6	Surface Mount	1	5.5 V	1.65 V	Open Drain
Texas Instruments SN74LVC2G07DCKTG4	-	32 mA	-40 °C	125 °C	6-TSSOP SC-88 SOT-363	Buffer Non-Inverting	2	SC-70-6	Surface Mount	1	5.5 V	1.65 V	Open Drain
Texas Instruments SN74LVC2G07YEPR	-	32 mA	-40 °C	125 °C	6-XFBGA DSBGA	Buffer Non-Inverting	2	6-DSBGA	Surface Mount	1	5.5 V	1.65 V	Open Drain
Texas Instruments SN74LVC2G07DCKRG4	-	32 mA	-40 °C	125 °C	6-TSSOP SC-88 SOT-363	Buffer Non-Inverting	2	SC-70-6	Surface Mount	1	5.5 V	1.65 V	Open Drain

Catalog

Enhanced product 2-ch, 1.65-V to 5.5-V buffers with open-drain outputs

Key Features

• Controlled BaselineOne Assembly SiteOne Test SiteOne Fabrication SiteExtended Temperature Performance of –55°C to 125°CEnhanced Diminishing Manufacturing Sources (DMS) SupportEnhanced Product-Change NotificationQualification PedigreeSupports 5-V VCCOperationInputs and Open-Drain Outputs Accept Voltages up to 5.5 VMax tpdof 5.7 ns at 3.3 VLow Power Consumption, 10 µA Max ICC±24-mA Output Drive at 3.3 VTypical VOLP(Output Ground Bounce)<0.8 V at VCC= 3.3 V, TA= 25°CTypical VOHV(Output VOHUndershoot)>2 V at VCC= 3.3 V, TA= 25°CIoffSupports Partial-Power-Down Mode OperationLatch-Up Performance Exceeds 100 mA Per JESD 78, Class IIESD Protection Exceeds JESD 222000-V Human-Body Model (A114-A)200-V Machine Model (A115-A)1000-V Charged-Device Model (C101)Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.Controlled BaselineOne Assembly SiteOne Test SiteOne Fabrication SiteExtended Temperature Performance of –55°C to 125°CEnhanced Diminishing Manufacturing Sources (DMS) SupportEnhanced Product-Change NotificationQualification PedigreeSupports 5-V VCCOperationInputs and Open-Drain Outputs Accept Voltages up to 5.5 VMax tpdof 5.7 ns at 3.3 VLow Power Consumption, 10 µA Max ICC±24-mA Output Drive at 3.3 VTypical VOLP(Output Ground Bounce)<0.8 V at VCC= 3.3 V, TA= 25°CTypical VOHV(Output VOHUndershoot)>2 V at VCC= 3.3 V, TA= 25°CIoffSupports Partial-Power-Down Mode OperationLatch-Up Performance Exceeds 100 mA Per JESD 78, Class IIESD Protection Exceeds JESD 222000-V Human-Body Model (A114-A)200-V Machine Model (A115-A)1000-V Charged-Device Model (C101)Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

Description

This dual buffer and driver is designed for 1.65-V to 5.5-V VCCoperation. The output of the SN74LVC2G07 device is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA. NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. This dual buffer and driver is designed for 1.65-V to 5.5-V VCCoperation. The output of the SN74LVC2G07 device is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA. NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.