
SN74LVC2G07DCKR
Active2-CH, 1.65-V TO 5.5-V BUFFERS WITH OPEN-DRAIN OUTPUTS
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SN74LVC2G07DCKR
Active2-CH, 1.65-V TO 5.5-V BUFFERS WITH OPEN-DRAIN OUTPUTS
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Technical Specifications
Parameters and characteristics for this part
| Specification | SN74LVC2G07DCKR |
|---|---|
| Current - Output High, Low [custom] | - |
| Current - Output High, Low [custom] | 32 mA |
| Logic Type | Buffer, Non-Inverting |
| Mounting Type | Surface Mount |
| Number of Bits per Element | 1 |
| Number of Elements | 2 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -40 °C |
| Output Type | Open Drain |
| Package / Case | 6-TSSOP, SC-88, SOT-363 |
| Supplier Device Package | SC-70-6 |
| Voltage - Supply [Max] | 5.5 V |
| Voltage - Supply [Min] | 1.65 V |
SN74LVC2G07-EP Series
Enhanced product 2-ch, 1.65-V to 5.5-V buffers with open-drain outputs
| Part | Current - Output High, Low [custom] | Current - Output High, Low [custom] | Operating Temperature [Min] | Operating Temperature [Max] | Package / Case | Logic Type | Number of Elements | Supplier Device Package | Mounting Type | Number of Bits per Element | Voltage - Supply [Max] | Voltage - Supply [Min] | Output Type | Operating Temperature [Max] | Operating Temperature [Min] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments | - | 32 mA | -40 °C | 125 °C | 6-TSSOP SC-88 SOT-363 | Buffer Non-Inverting | 2 | SC-70-6 | Surface Mount | 2 | 5.5 V | 1.65 V | Open Drain | ||
Texas Instruments | - | 32 mA | -40 °C | 125 °C | 6-TSSOP SC-88 SOT-363 | Buffer Non-Inverting | 2 | SC-70-6 | Surface Mount | 1 | 5.5 V | 1.65 V | Open Drain | ||
Texas Instruments | - | 32 mA | -40 °C | 125 °C | 6-XFBGA DSBGA | Buffer Non-Inverting | 2 | 6-DSBGA | Surface Mount | 1 | 5.5 V | 1.65 V | Open Drain | ||
Texas Instruments | - | 24 mA | 6-TSSOP SC-88 SOT-363 | Buffer Non-Inverting | 2 | SC-70-6 | Surface Mount | 1 | 5.5 V | 1.65 V | Open Drain | 125 °C | -55 °C | ||
Texas Instruments | - | 32 mA | -40 °C | 125 °C | 6-UFDFN | Buffer Non-Inverting | 2 | 6-SON (1.45x1) | Surface Mount | 1 | 5.5 V | 1.65 V | Open Drain | ||
Texas Instruments | - | 32 mA | -40 °C | 125 °C | 6-XFDFN | Buffer Non-Inverting | 2 | 6-SON (1x1) | Surface Mount | 1 | 5.5 V | 1.65 V | Open Drain | ||
Texas Instruments | - | 32 mA | -40 °C | 125 °C | 6-TSSOP SC-88 SOT-363 | Buffer Non-Inverting | 2 | SC-70-6 | Surface Mount | 1 | 5.5 V | 1.65 V | Open Drain | ||
Texas Instruments | - | 32 mA | -40 °C | 125 °C | 6-TSSOP SC-88 SOT-363 | Buffer Non-Inverting | 2 | SC-70-6 | Surface Mount | 1 | 5.5 V | 1.65 V | Open Drain | ||
Texas Instruments | - | 32 mA | -40 °C | 125 °C | 6-XFBGA DSBGA | Buffer Non-Inverting | 2 | 6-DSBGA | Surface Mount | 1 | 5.5 V | 1.65 V | Open Drain | ||
Texas Instruments | - | 32 mA | -40 °C | 125 °C | 6-TSSOP SC-88 SOT-363 | Buffer Non-Inverting | 2 | SC-70-6 | Surface Mount | 1 | 5.5 V | 1.65 V | Open Drain |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 0.45 | |
| 10 | $ 0.28 | |||
| 25 | $ 0.23 | |||
| 100 | $ 0.17 | |||
| 250 | $ 0.15 | |||
| 500 | $ 0.13 | |||
| 1000 | $ 0.12 | |||
| Digi-Reel® | 1 | $ 0.45 | ||
| 10 | $ 0.28 | |||
| 25 | $ 0.23 | |||
| 100 | $ 0.17 | |||
| 250 | $ 0.15 | |||
| 500 | $ 0.13 | |||
| 1000 | $ 0.12 | |||
| Tape & Reel (TR) | 3000 | $ 0.10 | ||
| 6000 | $ 0.09 | |||
| 9000 | $ 0.09 | |||
| 15000 | $ 0.08 | |||
| 21000 | $ 0.08 | |||
| 30000 | $ 0.08 | |||
| 75000 | $ 0.07 | |||
| 150000 | $ 0.07 | |||
| Texas Instruments | LARGE T&R | 1 | $ 0.13 | |
| 100 | $ 0.09 | |||
| 250 | $ 0.07 | |||
| 1000 | $ 0.04 | |||
Description
General part information
SN74LVC2G07-EP Series
This dual buffer and driver is designed for 1.65-V to 5.5-V VCCoperation. The output of the SN74LVC2G07 device is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
Documents
Technical documentation and resources