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TO-247N
Discrete Semiconductor Products

SCS220AE2GC11

Active
Rohm Semiconductor

SILICON CARBIDE SCHOTTKY DIODE, DUAL COMMON CATHODE, 650 V, 20 A, 15 NC, TO-247

TO-247N
Discrete Semiconductor Products

SCS220AE2GC11

Active
Rohm Semiconductor

SILICON CARBIDE SCHOTTKY DIODE, DUAL COMMON CATHODE, 650 V, 20 A, 15 NC, TO-247

Technical Specifications

Parameters and characteristics for this part

SpecificationSCS220AE2GC11
Current - Average Rectified (Io) (per Diode)10 A
Current - Reverse Leakage @ Vr200 µA
Diode Configuration1 Pair Common Cathode
Mounting TypeThrough Hole
Operating Temperature - Junction175 °C
Package / CaseTO-247-3
Reverse Recovery Time (trr)0 ns
Speed500 mA
Supplier Device PackageTO-247N
TechnologySiC (Silicon Carbide) Schottky
Voltage - DC Reverse (Vr) (Max) [Max]650 V
Voltage - Forward (Vf) (Max) @ If1.55 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 283$ 10.16
Tube 1$ 10.22
10$ 7.04
450$ 4.70
NewarkEach 1$ 9.92
10$ 7.28
25$ 7.13
60$ 7.00
120$ 6.85
270$ 4.89
510$ 4.88

Description

General part information

SCS220 Series

Switching loss reduced, enabling high-speed switching . (3-pin package)

Documents

Technical documentation and resources

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Part Explanation

Application Note

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

How to Create Symbols for PSpice Models

Models

PCB Layout Thermal Design Guide

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

What is a Thermal Model? (SiC Power Device)

Thermal Design

Explanation for Marking - TO-247N SiC_Marking-e.pdf

Package Information

About Export Administration Regulations (EAR)

Export Information

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Taping Information

Package Information

Diode Types and Applications

Technical Article

Simulation Verification to Identify Oscillation between Parallel Dies during Design Phase of Power Modules

Technical Article

How to Suppress the Parallel Drive Oscillation in SiC Modules

Application Note

Package Dimensions

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

How to Use LTspice® Models

Schematic Design & Verification

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

About Flammability of Materials

Environmental Data

Two-Resistor Model for Thermal Simulation

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

What Is Thermal Design

Thermal Design

ESD Data

Characteristics Data

Condition of Soldering

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Anti-Whisker formation

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Reliability Test Result

Manufacturing Data

Inner Structure

Package Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

How to Use Thermal Models

Thermal Design

SCS220AE2 Data Sheet

Data Sheet

Oscillation countermeasures for MOSFETs in parallel

Schematic Design & Verification

How to measure the oscillation occurs between parallel-connected devices

Technical Article

Compliance of the ELV directive

Environmental Data

Application Note for SiC Power Devices and Modules

Schematic Design & Verification

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Application Note EN

Datasheet