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353_TO220AC__2

Discrete Semiconductor Products

RFUH20TB3SNZC9

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Rohm Semiconductor

DIODE GEN PURP 350V 20A TO220NFM

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Search across all available documentation for this part.

DocumentsRFUH20TB3SNZC9 Datasheet (PDF)Compliance of the RoHS directive +41

353_TO220AC__2

Discrete Semiconductor Products

RFUH20TB3SNZC9

Active

Rohm Semiconductor

DIODE GEN PURP 350V 20A TO220NFM

Deep-Dive with AI

DocumentsRFUH20TB3SNZC9 Datasheet (PDF)Compliance of the RoHS directive +41

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	RFUH20TB3SNZC9

Current - Reverse Leakage @ Vr	10 nA
Mounting Type	Through Hole
Operating Temperature - Junction	150 ¯C
Package / Case	TO-220-2 Full Pack
Reverse Recovery Time (trr)	25 ns
Speed	500 ns, 200 mA
Supplier Device Package	TO-220NFM
Technology	Standard
Voltage - DC Reverse (Vr) (Max) [Max]	350 V
Voltage - Forward (Vf) (Max) @ If	1.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	896	$ 2.14
	Tube	1	$ 2.13
		10	$ 1.38
		100	$ 0.95
		500	$ 0.92
Mouser	N/A	1	$ 2.84
		10	$ 1.30
		100	$ 1.10
		500	$ 1.01
		1000	$ 1.00
		3000	$ 0.92

Description

General part information

RFUH20 Series

ROHM's fast recovery diodes are ultra high-speed, low VF, and suited for significant efficiency increase of switching power supply as well as reduction of switching loss.

Documents

Technical documentation and resources

RFUH20TB3SNZC9 Datasheet (PDF)

Compliance of the RoHS directive

Environmental Data

Measurement Method and Usage of Thermal Resistance RthJC

Method for Monitoring Switching Waveform

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Taping Information

Package Information

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

What Is Thermal Design

Moisture Sensitivity Level - Diodes

Package Information

Explanation for Marking

Package Information

PCB Layout Thermal Design Guide

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Certificate of not containing SVHC under REACH Regulation

Environmental Data

How to Select Rectifier Diodes

Technical Article

Reliability Test Result

Manufacturing Data

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Anti-Whisker formation - Diodes

Package Information

List of Diode Package Thermal Resistance

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Part Explanation

Application Note

Notes for Temperature Measurement Using Thermocouples

Package Dimensions

Package Information

About Export Regulations

Export Information

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Judgment Criteria of Thermal Evaluation

Basics of Thermal Resistance and Heat Dissipation

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

θ<sub>JA</sub> and Ψ<sub>JT</sub>

How to Use LTspice® Models

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

RFUH20TB3SNZ ESD Data

Characteristics Data

Inner Structure

Package Information

Two-Resistor Model for Thermal Simulation

What is a Thermal Model? (Diode)

Condition of Soldering / Land Pattern Reference

Package Information

Power Loss and Thermal Design of Diodes

Notes for Temperature Measurement Using Forward Voltage of PN Junction

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

About Flammability of Materials

Environmental Data

Diode Types and Applications

Technical Article

RFUH20 Series

Super Fast Recovery Diode

Part	Voltage - DC Reverse (Vr) (Max) [Max]	Package / Case	Mounting Type	Current - Reverse Leakage @ Vr	Speed	Reverse Recovery Time (trr)	Supplier Device Package	Operating Temperature - Junction	Technology	Voltage - Forward (Vf) (Max) @ If	Voltage - Forward (Vf) (Max) @ If [Max]	Operating Temperature - Junction [Max]
Rohm Semiconductor RFUH20NS3STL	350 V	D2PAK (2 Leads + Tab) TO-263-3 TO-263AB	Surface Mount	10 µA	200 mA 500 ns	25 ns	LPDS	150 ¯C	Standard	1.5 V
Rohm Semiconductor RFUH20TB3SNZC9	350 V	TO-220-2 Full Pack	Through Hole	10 nA	200 mA 500 ns	25 ns	TO-220NFM	150 ¯C	Standard	1.5 V
Rohm Semiconductor RFUH20NS4STL	430 V	D2PAK (2 Leads + Tab) TO-263-3 TO-263AB	Surface Mount	10 µA	200 mA 500 ns	25 ns	LPDS	150 ¯C	Standard	20 A	1.7 V
Rohm Semiconductor RFUH20TJ6SGC9	600 V	TO-220-2 Full Pack	Through Hole	10 µA	200 mA 500 ns	80 ns	TO-220ACFP	150 ¯C	Standard	2.8 V
Rohm Semiconductor RFUH20TB4SNZC9	430 V	TO-220-2 Full Pack	Through Hole	10 µA	200 mA 500 ns	25 ns	TO-220NFM	150 ¯C	Standard	20 A	1.7 V
Rohm Semiconductor RFUH20TF6S	600 V	TO-220-2	Through Hole	10 µA	200 mA 500 ns	35 ns	TO-220NFM		Standard	2.8 V		150 °C
Rohm Semiconductor RFUH20TF6SC9	600 V	TO-220-2 Full Pack	Through Hole	10 µA	200 mA 500 ns	35 ns	TO-220NFM	150 ¯C	Standard	2.8 V