Discrete Semiconductor Products

RFUH20TB4SNZC9

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DIODE STANDARD 430V 20A TO220NFM

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DocumentsMethod for Calculating Junction Temperature from Transient Thermal Resistance Data Diode Types and Applications +41

Discrete Semiconductor Products

RFUH20TB4SNZC9

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Rohm Semiconductor

DIODE STANDARD 430V 20A TO220NFM

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DocumentsMethod for Calculating Junction Temperature from Transient Thermal Resistance Data Diode Types and Applications +41

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	RFUH20TB4SNZC9

Current - Reverse Leakage @ Vr	10 µA
Mounting Type	Through Hole
Operating Temperature - Junction	150 ¯C
Package / Case	TO-220-2 Full Pack
Reverse Recovery Time (trr)	25 ns
Speed	500 ns, 200 mA
Supplier Device Package	TO-220NFM
Technology	Standard
Voltage - DC Reverse (Vr) (Max) [Max]	430 V
Voltage - Forward (Vf) (Max) @ If	20 A
Voltage - Forward (Vf) (Max) @ If [Max]	1.7 V

RFUH20 Series

Super Fast Recovery Diode

Part	Voltage - DC Reverse (Vr) (Max) [Max]	Package / Case	Mounting Type	Current - Reverse Leakage @ Vr	Speed	Reverse Recovery Time (trr)	Supplier Device Package	Operating Temperature - Junction	Technology	Voltage - Forward (Vf) (Max) @ If	Voltage - Forward (Vf) (Max) @ If [Max]	Operating Temperature - Junction [Max]
Rohm Semiconductor RFUH20NS3STL	350 V	D2PAK (2 Leads + Tab) TO-263-3 TO-263AB	Surface Mount	10 µA	200 mA 500 ns	25 ns	LPDS	150 ¯C	Standard	1.5 V
Rohm Semiconductor RFUH20TB3SNZC9	350 V	TO-220-2 Full Pack	Through Hole	10 nA	200 mA 500 ns	25 ns	TO-220NFM	150 ¯C	Standard	1.5 V
Rohm Semiconductor RFUH20NS4STL	430 V	D2PAK (2 Leads + Tab) TO-263-3 TO-263AB	Surface Mount	10 µA	200 mA 500 ns	25 ns	LPDS	150 ¯C	Standard	20 A	1.7 V
Rohm Semiconductor RFUH20TJ6SGC9	600 V	TO-220-2 Full Pack	Through Hole	10 µA	200 mA 500 ns	80 ns	TO-220ACFP	150 ¯C	Standard	2.8 V
Rohm Semiconductor RFUH20TB4SNZC9	430 V	TO-220-2 Full Pack	Through Hole	10 µA	200 mA 500 ns	25 ns	TO-220NFM	150 ¯C	Standard	20 A	1.7 V
Rohm Semiconductor RFUH20TF6S	600 V	TO-220-2	Through Hole	10 µA	200 mA 500 ns	35 ns	TO-220NFM		Standard	2.8 V		150 °C
Rohm Semiconductor RFUH20TF6SC9	600 V	TO-220-2 Full Pack	Through Hole	10 µA	200 mA 500 ns	35 ns	TO-220NFM	150 ¯C	Standard	2.8 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	985	$ 1.65
	Tube	1	$ 0.75
		50	$ 0.60
		100	$ 0.48
		500	$ 0.41
		1000	$ 0.40
		2000	$ 0.46
		5000	$ 0.42
		10000	$ 0.40
Mouser	N/A	1	$ 1.65
		10	$ 0.91
		100	$ 0.89
		1000	$ 0.89

Description

General part information

RFUH20 Series

ROHM's fast recovery diodes are ultra high-speed, low VF, and suited for significant efficiency increase of switching power supply as well as reduction of switching loss.

Documents

Technical documentation and resources

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Reliability Test Result

Manufacturing Data

Compliance of the RoHS directive

Environmental Data

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Anti-Whisker formation - Diodes

Package Information

RFUH20TB4SNZ Data Sheet

Data Sheet

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Moisture Sensitivity Level - Diodes

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

θJA and ΨJT

Thermal Design

RFUH20TB4SNZC9

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RFUH20TB4SNZC9

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Technical Specifications

RFUH20 Series

Pricing

Description

RFUH20 Series

Documents

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Diode Types and Applications

How to Select Reverse Current Protection Diodes for LDO Regulators

What is a Thermal Model? (Diode)

Package Dimensions

How to Select Rectifier Diodes

Precautions When Measuring the Rear of the Package with a Thermocouple

Two-Resistor Model for Thermal Simulation

Inner Structure

Part Explanation

Basics of Thermal Resistance and Heat Dissipation

Explanation for Marking

About Flammability of Materials

Power Loss and Thermal Design of Diodes

Method for Monitoring Switching Waveform

Measurement Method and Usage of Thermal Resistance RthJC

How to Use LTspice&reg; Models

Certificate of not containing SVHC under REACH Regulation

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Absolute Maximum Rating and Electrical Characteristics of Diodes

Taping Information

Judgment Criteria of Thermal Evaluation

θ<sub>JC</sub> and Ψ<sub>JT</sub>

List of Diode Package Thermal Resistance

RFUH20TB4SNZ ESD Data

PCB Layout Thermal Design Guide

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

About Export Regulations

Condition of Soldering / Land Pattern Reference

What Is Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Notes for Calculating Power Consumption:Static Operation

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Reliability Test Result

Compliance of the RoHS directive

Notes for Temperature Measurement Using Thermocouples

Anti-Whisker formation - Diodes

RFUH20TB4SNZ Data Sheet

Importance of Probe Calibration When Measuring Power: Deskew

Moisture Sensitivity Level - Diodes

Impedance Characteristics of Bypass Capacitor

θ<sub>JA</sub> and Ψ<sub>JT</sub>

RFUH20 Series

How to Use LTspice® Models

How to Use LTspice® Models: Tips for Improving Convergence