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Discrete Semiconductor Products

RFUH20TJ6SGC9

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Rohm Semiconductor

FAST / ULTRAFAST DIODE, 600 V, 20 A, SINGLE, 2.8 V, 18 NS, 120 A

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Search across all available documentation for this part.

Documentsθ<sub>JC</sub> and Ψ<sub>JT</sub>Impedance Characteristics of Bypass Capacitor +41

Product dimension image

Discrete Semiconductor Products

RFUH20TJ6SGC9

Active

Rohm Semiconductor

FAST / ULTRAFAST DIODE, 600 V, 20 A, SINGLE, 2.8 V, 18 NS, 120 A

Deep-Dive with AI

Documentsθ<sub>JC</sub> and Ψ<sub>JT</sub>Impedance Characteristics of Bypass Capacitor +41

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	RFUH20TJ6SGC9

Current - Reverse Leakage @ Vr	10 µA
Mounting Type	Through Hole
Operating Temperature - Junction	150 ¯C
Package / Case	TO-220-2 Full Pack
Reverse Recovery Time (trr)	80 ns
Speed	500 ns, 200 mA
Supplier Device Package	TO-220ACFP
Technology	Standard
Voltage - DC Reverse (Vr) (Max) [Max]	600 V
Voltage - Forward (Vf) (Max) @ If	2.8 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	617	$ 2.86
	Tube	1	$ 2.04
		50	$ 1.64
		100	$ 1.35
		500	$ 1.14
		1000	$ 0.97
		2000	$ 0.92
		5000	$ 0.89
		10000	$ 0.86

Description

General part information

RFUH20 Series

ROHM's fast recovery diodes are ultra high-speed, low VF, and suited for significant efficiency increase of switching power supply as well as reduction of switching loss.

Documents

Technical documentation and resources

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Diode Types and Applications

Technical Article

Precautions When Measuring the Rear of the Package with a Thermocouple

How to Use LTspice® Models

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Package Dimensions

Package Information

Part Explanation

Application Note

Condition of Soldering / Land Pattern Reference

Package Information

Reliability Test Result

Manufacturing Data

Judgment Criteria of Thermal Evaluation

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Moisture Sensitivity Level - Diodes

Package Information

Power Loss and Thermal Design of Diodes

Compliance of the RoHS directive

Environmental Data

How to Use the Thermal Resistance and Thermal Characteristics Parameters

PCB Layout Thermal Design Guide

RFUH20TJ6S Data Sheet

Basics of Thermal Resistance and Heat Dissipation

List of Diode Package Thermal Resistance

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Notes for Temperature Measurement Using Thermocouples

What is a Thermal Model? (Diode)

How to Create Symbols for PSpice Models

Notes for Calculating Power Consumption:Static Operation

How to Select Rectifier Diodes

Technical Article

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Anti-Whisker formation - Diodes

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Taping Information

Package Information

θ<sub>JA</sub> and Ψ<sub>JT</sub>

About Export Regulations

Export Information

What Is Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

ESD Data

Characteristics Data

Inner Structure

Package Information

RFUH20 Series

Super Fast Recovery Diode

Part	Voltage - DC Reverse (Vr) (Max) [Max]	Package / Case	Mounting Type	Current - Reverse Leakage @ Vr	Speed	Reverse Recovery Time (trr)	Supplier Device Package	Operating Temperature - Junction	Technology	Voltage - Forward (Vf) (Max) @ If	Voltage - Forward (Vf) (Max) @ If [Max]	Operating Temperature - Junction [Max]
Rohm Semiconductor RFUH20NS3STL	350 V	D2PAK (2 Leads + Tab) TO-263-3 TO-263AB	Surface Mount	10 µA	200 mA 500 ns	25 ns	LPDS	150 ¯C	Standard	1.5 V
Rohm Semiconductor RFUH20TB3SNZC9	350 V	TO-220-2 Full Pack	Through Hole	10 nA	200 mA 500 ns	25 ns	TO-220NFM	150 ¯C	Standard	1.5 V
Rohm Semiconductor RFUH20NS4STL	430 V	D2PAK (2 Leads + Tab) TO-263-3 TO-263AB	Surface Mount	10 µA	200 mA 500 ns	25 ns	LPDS	150 ¯C	Standard	20 A	1.7 V
Rohm Semiconductor RFUH20TJ6SGC9	600 V	TO-220-2 Full Pack	Through Hole	10 µA	200 mA 500 ns	80 ns	TO-220ACFP	150 ¯C	Standard	2.8 V
Rohm Semiconductor RFUH20TB4SNZC9	430 V	TO-220-2 Full Pack	Through Hole	10 µA	200 mA 500 ns	25 ns	TO-220NFM	150 ¯C	Standard	20 A	1.7 V
Rohm Semiconductor RFUH20TF6S	600 V	TO-220-2	Through Hole	10 µA	200 mA 500 ns	35 ns	TO-220NFM		Standard	2.8 V		150 °C
Rohm Semiconductor RFUH20TF6SC9	600 V	TO-220-2 Full Pack	Through Hole	10 µA	200 mA 500 ns	35 ns	TO-220NFM	150 ¯C	Standard	2.8 V