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R6004KNXC7G
Discrete Semiconductor Products

R6030JNXC7G

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Rohm Semiconductor

600V 30A TO-220FM, PRESTOMOS™ WITH INTEGRATED HIGH-SPEED DIODE

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R6004KNXC7G
Discrete Semiconductor Products

R6030JNXC7G

Active
Rohm Semiconductor

600V 30A TO-220FM, PRESTOMOS™ WITH INTEGRATED HIGH-SPEED DIODE

Technical Specifications

Parameters and characteristics for this part

SpecificationR6030JNXC7G
Current - Continuous Drain (Id) @ 25°C30 A
Drain to Source Voltage (Vdss)600 V
Drive Voltage (Max Rds On, Min Rds On)15 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs74 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]2500 pF
Mounting TypeThrough Hole
Operating Temperature150 °C
Package / CaseTO-220-3 Full Pack
Power Dissipation (Max) [Max]95 W
Rds On (Max) @ Id, Vgs143 mOhm
Supplier Device PackageTO-220FM
TechnologyMOSFET (Metal Oxide)
Vgs (Max)30 V
Vgs(th) (Max) @ Id7 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 2.56
10$ 2.29
50$ 2.17
100$ 1.88
250$ 1.78
500$ 1.70
NewarkEach 1$ 6.50

Description

General part information

R6030KNZ4 Series

R6030JNX is a power MOSFET with fast reverse recovery time (trr), suitable for the switching applications.PrestoMOS™ series, R60xxJNx series increases design flexibility while maintaining the industry’s fastest reverse recovery time (trr) optimized for EV charging stations and motor drive in home appliances such as refrigerators and Air Conditioners (ACs).

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Two-Resistor Model for Thermal Simulation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

How to Create Symbols for PSpice Models

Models

Explanation for Marking

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Package Dimensions

Package Information

Reliability Test Result

Manufacturing Data

Types and Features of Transistors

Application Note

R6030JNX ESD Data

Characteristics Data

Judgment Criteria of Thermal Evaluation

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Part Explanation

Application Note

Moisture Sensitivity Level - Transistors

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Inner Structure

Package Information

About Export Regulations

Export Information

What is a Thermal Model? (Transistor)

Thermal Design

Benefits given by PrestoMOS&trade; series for the Phase-Shift Full-Bridge

Technical Article

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

About Flammability of Materials

Environmental Data

List of Transistor Package Thermal Resistance

Thermal Design