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Discrete Semiconductor Products

RGW00TS65HRC11

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Rohm Semiconductor

HIGH-SPEED FAST SWITCHING TYPE, 650V 50A, TO-247N, FIELD STOP TRENCH IGBT FOR AUTOMOTIVE

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Product dimension image
Discrete Semiconductor Products

RGW00TS65HRC11

Active
Rohm Semiconductor

HIGH-SPEED FAST SWITCHING TYPE, 650V 50A, TO-247N, FIELD STOP TRENCH IGBT FOR AUTOMOTIVE

Technical Specifications

Parameters and characteristics for this part

SpecificationRGW00TS65HRC11
Current - Collector (Ic) (Max) [Max]96 A
Current - Collector Pulsed (Icm)200 A
Gate Charge141 nC
IGBT TypeTrench Field Stop
Mounting TypeThrough Hole
Operating Temperature [Max]175 °C
Operating Temperature [Min]-40 C
Package / CaseTO-247-3
Power - Max [Max]254 W
Supplier Device PackageTO-247N
Td (on/off) @ 25°C186 ns, 48 ns
Test Condition400 V, 25 A, 10 Ohm, 15 V
Vce(on) (Max) @ Vge, Ic1.9 V
Voltage - Collector Emitter Breakdown (Max)650 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 4.15
10$ 2.73
450$ 1.60
NewarkEach 1$ 3.90

Description

General part information

RGW00TS65DHR Series

The RGWxx65C series is a 650V IGBT with a built-in SiC schottky barrier diode, which reduces turn-on switching loss. This is an AEC-Q101 compliant product. It can be used with confidence even in harsh environments such as xEV on-board chargers, DC/DC converters, solar power conditioners, and UPS.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules

White Paper

What Is Thermal Design

Thermal Design

Package Dimensions

Package Information

About Flammability of Materials

Environmental Data

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

PCB Layout Thermal Design Guide

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

About Export Administration Regulations (EAR)

Export Information

How to Create Symbols for PSpice Models

Models

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Anti-Whisker formation

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Moisture Sensitivity Level

Package Information

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Types and Features of Transistors

Application Note

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Method for Monitoring Switching Waveform

Schematic Design & Verification

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Two-Resistor Model for Thermal Simulation

Thermal Design

Compliance of the ELV directive

Environmental Data