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SCT2450KEGC11
Discrete Semiconductor Products

SCS230AE2GC11

Active
Rohm Semiconductor

SILICON CARBIDE SCHOTTKY DIODE, DUAL COMMON CATHODE, 650 V, 30 A, 23 NC, TO-247

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Search across all available documentation for this part.

DocumentsJudgment Criteria of Thermal EvaluationPCB Layout Thermal Design Guide+32
SCT2450KEGC11
Discrete Semiconductor Products

SCS230AE2GC11

Active
Rohm Semiconductor

SILICON CARBIDE SCHOTTKY DIODE, DUAL COMMON CATHODE, 650 V, 30 A, 23 NC, TO-247

Deep-Dive with AI

DocumentsJudgment Criteria of Thermal EvaluationPCB Layout Thermal Design Guide+32

Technical Specifications

Parameters and characteristics for this part

SpecificationSCS230AE2GC11
Current - Average Rectified (Io) (per Diode)15 A
Current - Reverse Leakage @ Vr300 µA
Diode Configuration1 Pair Common Cathode
Mounting TypeThrough Hole
Operating Temperature - Junction175 °C
Package / CaseTO-247-3
Reverse Recovery Time (trr)0 ns
SpeedNo Recovery Time
Supplier Device PackageTO-247N
TechnologySiC (Silicon Carbide) Schottky
Voltage - DC Reverse (Vr) (Max) [Max]650 V
Voltage - Forward (Vf) (Max) @ If1.55 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 10.72
10$ 7.47
450$ 6.17
NewarkEach 1$ 12.65
10$ 9.08
25$ 9.03
60$ 8.99
120$ 8.93
270$ 6.42

Description

General part information

SCS230KE2 Series

Switching loss reduced, enabling high-speed switching . (3-pin package)

Documents

Technical documentation and resources

Judgment Criteria of Thermal Evaluation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Reliability Test Result

Manufacturing Data

Notes for Temperature Measurement Using Thermocouples

Thermal Design

About Flammability of Materials

Environmental Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Inner Structure

Package Information

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

How to measure the oscillation occurs between parallel-connected devices

Technical Article

Anti-Whisker formation

Package Information

4 Steps for Successful Thermal Designing of Power Devices

White Paper

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

SCS230AE2 Data Sheet

Data Sheet

Method for Monitoring Switching Waveform

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

About Export Administration Regulations (EAR)

Export Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Simulation Verification to Identify Oscillation between Parallel Dies during Design Phase of Power Modules

Technical Article

Compliance of the ELV directive

Environmental Data

What Is Thermal Design

Thermal Design

Diode Types and Applications

Technical Article

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Taping Information

Package Information

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

ESD Data

Characteristics Data

Package Dimensions

Package Information

Explanation for Marking - TO-247N SiC_Marking-e.pdf

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

How to Create Symbols for PSpice Models

Models