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Discrete Semiconductor Products

R6007RND3TL1

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Rohm Semiconductor

600V 7A, TO-252 (DPAK), PRESTOMOS™ WITH INTEGRATED HIGH-SPEED DIODE

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Product thumbnail image
Discrete Semiconductor Products

R6007RND3TL1

Active
Rohm Semiconductor

600V 7A, TO-252 (DPAK), PRESTOMOS™ WITH INTEGRATED HIGH-SPEED DIODE

Technical Specifications

Parameters and characteristics for this part

SpecificationR6007RND3TL1
Current - Continuous Drain (Id) @ 25°C7 A
Drain to Source Voltage (Vdss)600 V
Drive Voltage (Max Rds On, Min Rds On)15 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]17.5 nC
Input Capacitance (Ciss) (Max) @ Vds460 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseTO-252-3, SC-63, DPAK (2 Leads + Tab)
Power Dissipation (Max)96 W
Rds On (Max) @ Id, Vgs940 mOhm
Supplier Device PackageTO-252
TechnologyMOSFET (Metal Oxide)
Vgs (Max)30 V
Vgs(th) (Max) @ Id7 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 2.41
10$ 1.55
25$ 1.33
100$ 1.07
250$ 0.95
500$ 0.87
1000$ 0.81
Digi-Reel® 1$ 2.41
10$ 1.55
25$ 1.33
100$ 1.07
250$ 0.95
500$ 0.87
1000$ 0.81
N/A 3017$ 1.46
Tape & Reel (TR) 2500$ 0.33
NewarkEach (Supplied on Cut Tape) 1$ 1.00

Description

General part information

R6007 Series

R6007JND3 is a power MOSFET with fast reverse recovery time (trr), suitable for the switching applications.PrestoMOS™ series, R60xxJNx series increases design flexibility while maintaining the industry’s fastest reverse recovery time (trr) optimized for EV charging stations and motor drive in home appliances such as refrigerators and Air Conditioners (ACs).

Documents

Technical documentation and resources

Explanation for Marking

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

How to Use LTspice&reg; Models

Schematic Design & Verification

What Is Thermal Design

Thermal Design

About Flammability of Materials

Environmental Data

Benefits given by PrestoMOS&trade; series for the Phase-Shift Full-Bridge

Technical Article

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Report of SVHC under REACH Regulation

Environmental Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Compliance of the RoHS directive

Environmental Data

Part Explanation

Application Note

Condition of Soldering / Land Pattern Reference

Package Information

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

TO-252_TL1 Taping Information

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

R6007RND3 ESD Data

Characteristics Data

Package Dimensions

Package Information

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design

R6007RND3 Data Sheet

Data Sheet

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Anti-Whisker formation - Transistors

Package Information

About Export Regulations

Export Information

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Types and Features of Transistors

Application Note

Judgment Criteria of Thermal Evaluation

Thermal Design