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Discrete Semiconductor Products

R6007JND3TL1

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Rohm Semiconductor

600V 7A TO-252 (DPAK), PRESTOMOS™ WITH INTEGRATED HIGH-SPEED DIODE

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Product dimension image
Discrete Semiconductor Products

R6007JND3TL1

Active
Rohm Semiconductor

600V 7A TO-252 (DPAK), PRESTOMOS™ WITH INTEGRATED HIGH-SPEED DIODE

Technical Specifications

Parameters and characteristics for this part

SpecificationR6007JND3TL1
Current - Continuous Drain (Id) @ 25°C7 A
Drain to Source Voltage (Vdss)600 V
Drive Voltage (Max Rds On, Min Rds On)15 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]17.5 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]475 pF
Mounting TypeSurface Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-55 °C
Package / CaseTO-252-3, SC-63, DPAK (2 Leads + Tab)
Power Dissipation (Max)96 W
Rds On (Max) @ Id, Vgs [Max]780 mOhm
Supplier Device PackageTO-252
TechnologyMOSFET (Metal Oxide)
Vgs (Max)30 V
Vgs(th) (Max) @ Id7 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 1.85
10$ 1.53
100$ 1.22
500$ 1.03
1000$ 0.88
Digi-Reel® 1$ 1.85
10$ 1.53
100$ 1.22
500$ 1.03
1000$ 0.88
N/A 0$ 2.29
Tape & Reel (TR) 2500$ 0.80
5000$ 0.78
NewarkEach (Supplied on Cut Tape) 1$ 1.91
10$ 1.37
25$ 1.30
50$ 1.22
100$ 1.14
250$ 1.12
500$ 0.93
1000$ 0.86

Description

General part information

R6007 Series

R6007JND3 is a power MOSFET with fast reverse recovery time (trr), suitable for the switching applications.PrestoMOS™ series, R60xxJNx series increases design flexibility while maintaining the industry’s fastest reverse recovery time (trr) optimized for EV charging stations and motor drive in home appliances such as refrigerators and Air Conditioners (ACs).

Documents

Technical documentation and resources

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Types and Features of Transistors

Application Note

Judgment Criteria of Thermal Evaluation

Thermal Design

What Is Thermal Design

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

What is a Thermal Model? (Transistor)

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Reliability Test Result

Manufacturing Data

How to Create Symbols for PSpice Models

Models

How to Use LTspice® Models

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Anti-Whisker formation - Transistors

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Compliance of the RoHS directive

Environmental Data

Moisture Sensitivity Level - Transistors

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

About Export Regulations

Export Information

Part Explanation

Application Note

Report of SVHC under REACH Regulation

Environmental Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

R6007JND3 ESD Data

Characteristics Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Double-pulse test substantiated advantages of PrestoMOS&trade;

Technical Article

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

R6007JND3 Data Sheet

Data Sheet

List of Transistor Package Thermal Resistance

Thermal Design

TO-252_TL1 Taping Information

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Package Dimensions

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Explanation for Marking

Package Information

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Two-Resistor Model for Thermal Simulation

Thermal Design

Benefits given by PrestoMOS&trade; series for the Phase-Shift Full-Bridge

Technical Article

Technical Data Sheet EN

Datasheet