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Discrete Semiconductor Products

R6007ENJTL

Active
Rohm Semiconductor

TRANS MOSFET N-CH 600V ±7A 3-PIN TO-263 T/R

Product thumbnail image
Discrete Semiconductor Products

R6007ENJTL

Active
Rohm Semiconductor

TRANS MOSFET N-CH 600V ±7A 3-PIN TO-263 T/R

Technical Specifications

Parameters and characteristics for this part

SpecificationR6007ENJTL
Current - Continuous Drain (Id) @ 25°C7 A
Drain to Source Voltage (Vdss)600 V
Drive Voltage (Max Rds On, Min Rds On)10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [x]20 nC
Input Capacitance (Ciss) (Max) @ Vds390 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseD2PAK (2 Leads + Tab), TO-263AB, TO-263-3
Power Dissipation (Max)40 W
Rds On (Max) @ Id, Vgs620 mOhm
Supplier Device PackageLPTS
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 2.28
10$ 1.65
100$ 1.20
500$ 0.97
Digi-Reel® 1$ 2.28
10$ 1.65
100$ 1.20
500$ 0.97
Tape & Reel (TR) 1000$ 0.89
2000$ 0.81
3000$ 0.79
5000$ 0.79
NewarkEach (Supplied on Cut Tape) 1$ 2.60
10$ 1.86
25$ 1.68
50$ 1.51
100$ 1.33
300$ 1.28
500$ 1.01
1000$ 0.90

Description

General part information

R6007RND3 Series

R6007JND3 is a power MOSFET with fast reverse recovery time (trr), suitable for the switching applications.PrestoMOS™ series, R60xxJNx series increases design flexibility while maintaining the industry’s fastest reverse recovery time (trr) optimized for EV charging stations and motor drive in home appliances such as refrigerators and Air Conditioners (ACs).

Documents

Technical documentation and resources

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Part Explanation

Application Note

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Package Dimensions

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Explanation for Marking

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Reliability Test Result

Manufacturing Data

R6007ENJ Data Sheet

Data Sheet

Taping Information

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Judgment Criteria of Thermal Evaluation

Thermal Design

About Export Regulations

Export Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Types and Features of Transistors

Application Note

List of Transistor Package Thermal Resistance

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Report of SVHC under REACH Regulation

Environmental Data

About Flammability of Materials

Environmental Data

Two-Resistor Model for Thermal Simulation

Thermal Design

ESD Data

Characteristics Data

Inner Structure

Package Information

Condition of Soldering / Land Pattern Reference

Package Information

What is a Thermal Model? (Transistor)

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

What Is Thermal Design

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

How to Create Symbols for PSpice Models

Models

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Moisture Sensitivity Level - Transistors

Package Information