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U (SMD)
Discrete Semiconductor Products

2N2919U

Active
Microchip Technology

DUAL SMALL-SIGNAL BJT LCC-6 ROHS COMPLIANT: YES

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U (SMD)
Discrete Semiconductor Products

2N2919U

Active
Microchip Technology

DUAL SMALL-SIGNAL BJT LCC-6 ROHS COMPLIANT: YES

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

Specification2N2919U
Current - Collector (Ic) (Max) [Max]30 mA
Current - Collector Cutoff (Max) [Max]10 µA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]150
Mounting TypeSurface Mount
Operating Temperature200 °C
Package / Case6-SMD, No Lead
Power - Max [Max]350 mW
Supplier Device PackageU
Transistor Type2 NPN (Dual)
Vce Saturation (Max) @ Ib, Ic300 mV
Voltage - Collector Emitter Breakdown (Max) [Max]60 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 100$ 47.56
NewarkEach 100$ 47.57
500$ 45.74

Description

General part information

JANTX2N2919L-Dual-Transistor Series

This specification covers the performance requirements for two electrically isolated, matched NPN radiation hardened silicon 2N2919 and 2N2920, unitized transistors as one dual unit. Four levels of product assurance (JAN, JANTX, JANTXV and JANS) are provided for each encapsulated device type as specified in MIL-PRF-19500/355, and two levels of product assurance (JANHC and JANKC) are provided for each unencapsulated device (die), as specified in MIL-PRF-19500/355. Provisions for radiation hardness assurance (RHA) to eight radiation levels ("M", "D", "P", "L", "R", "F", "G" and "H") are provided for JANTXV, JANS, JANHC, JANKC, JANHCD, and JANKCD product assurance levels. The device package for the encapsulated device type are as follows: similar to TO-78 and surface mount version. The dimensions and topography for JANHC and JANKC unencapsulated die are as outlined in MIL-PRF-19500/355.

Documents

Technical documentation and resources