JANTX2N2919L-Dual-Transistor Series

NPN Silicon Dual 60V, 0.03A

Catalog

NPN Silicon Dual 60V, 0.03A

Part	Current - Collector Cutoff (Max) [Max]	Operating Temperature	Grade	Voltage - Collector Emitter Breakdown (Max) [Max]	Package / Case	DC Current Gain (hFE) (Min) @ Ic, Vce [Min]	Current - Collector (Ic) (Max) [Max]	Power - Max [Max]	Vce Saturation (Max) @ Ib, Ic	Transistor Type	Supplier Device Package	Mounting Type	Qualification
Microchip Technology JANTX2N2919L	10 µA	200 °C	Military	60 V	TO-78-6 Metal Can	150	30 mA	350 mW	300 mV	2 NPN (Dual)	TO-78-6	Through Hole	MIL-PRF-19500/355
Microchip Technology JAN2N2919U/TR	10 µA	200 °C	Military	60 V	6-SMD No Lead	150	30 mA	350 mW	300 mV	2 NPN (Dual)	U	Surface Mount	MIL-PRF-19500/355
Microchip Technology 2N2919L	10 µA	200 °C		60 V	TO-78-6 Metal Can	150	30 mA	350 mW	300 mV	2 NPN (Dual)	TO-78-6	Through Hole
Microchip Technology 2N2919U	10 µA	200 °C		60 V	6-SMD No Lead	150	30 mA	350 mW	300 mV	2 NPN (Dual)	U	Surface Mount
Microchip Technology JAN2N2919

Catalog

NPN Silicon Dual 60V, 0.03A

Key Features

- The device package for the encapsulated device type are as follows: similar to TO-78 and surface mount version.

- The dimensions and topography for JANHC and JANKC unencapsulated die are as outlined in MIL-PRF-19500/355.

Description

This specification covers the performance requirements for two electrically isolated, matched NPN radiation hardened silicon 2N2919 and 2N2920, unitized transistors as one dual unit. Four levels of product assurance (JAN, JANTX, JANTXV and JANS) are provided for each encapsulated device type as specified in MIL-PRF-19500/355, and two levels of product assurance (JANHC and JANKC) are provided for each unencapsulated device (die), as specified in MIL-PRF-19500/355. Provisions for radiation hardness assurance (RHA) to eight radiation levels ("M", "D", "P", "L", "R", "F", "G" and "H") are provided for JANTXV, JANS, JANHC, JANKC, JANHCD, and JANKCD product assurance levels. The device package for the encapsulated device type are as follows: similar to TO-78 and surface mount version. The dimensions and topography for JANHC and JANKC unencapsulated die are as outlined in MIL-PRF-19500/355.