JANTX2N2919L
ActiveDUAL SMALL-SIGNAL BJT TO-78 ROHS COMPLIANT: YES
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JANTX2N2919L
ActiveDUAL SMALL-SIGNAL BJT TO-78 ROHS COMPLIANT: YES
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | JANTX2N2919L |
|---|---|
| Current - Collector (Ic) (Max) [Max] | 30 mA |
| Current - Collector Cutoff (Max) [Max] | 10 µA |
| DC Current Gain (hFE) (Min) @ Ic, Vce [Min] | 150 |
| Grade | Military |
| Mounting Type | Through Hole |
| Operating Temperature | 200 °C |
| Package / Case | TO-78-6 Metal Can |
| Power - Max [Max] | 350 mW |
| Qualification | MIL-PRF-19500/355 |
| Supplier Device Package | TO-78-6 |
| Transistor Type | 2 NPN (Dual) |
| Vce Saturation (Max) @ Ib, Ic | 300 mV |
| Voltage - Collector Emitter Breakdown (Max) [Max] | 60 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 100 | $ 35.02 | |
| Microchip Direct | N/A | 1 | $ 37.72 | |
| Newark | Each | 100 | $ 35.02 | |
| 500 | $ 33.68 | |||
Description
General part information
JANTX2N2919L-Dual-Transistor Series
This specification covers the performance requirements for two electrically isolated, matched NPN radiation hardened silicon 2N2919 and 2N2920, unitized transistors as one dual unit. Four levels of product assurance (JAN, JANTX, JANTXV and JANS) are provided for each encapsulated device type as specified in MIL-PRF-19500/355, and two levels of product assurance (JANHC and JANKC) are provided for each unencapsulated device (die), as specified in MIL-PRF-19500/355. Provisions for radiation hardness assurance (RHA) to eight radiation levels ("M", "D", "P", "L", "R", "F", "G" and "H") are provided for JANTXV, JANS, JANHC, JANKC, JANHCD, and JANKCD product assurance levels. The device package for the encapsulated device type are as follows: similar to TO-78 and surface mount version. The dimensions and topography for JANHC and JANKC unencapsulated die are as outlined in MIL-PRF-19500/355.
Documents
Technical documentation and resources