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5-DSBGA-YZP
Integrated Circuits (ICs)

SN74AUP1G17YZPR

Active
Texas Instruments

SINGLE 0.8-V TO 3.6-V LOW POWER BUFFER WITH SCHMITT-TRIGGER INPUTS

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5-DSBGA-YZP
Integrated Circuits (ICs)

SN74AUP1G17YZPR

Active
Texas Instruments

SINGLE 0.8-V TO 3.6-V LOW POWER BUFFER WITH SCHMITT-TRIGGER INPUTS

Technical Specifications

Parameters and characteristics for this part

SpecificationSN74AUP1G17YZPR
Current - Output High, Low [custom]4 mA
Current - Output High, Low [custom]4 mA
Input TypeSchmitt Trigger
Logic TypeBuffer, Non-Inverting
Mounting TypeSurface Mount
Number of Bits per Element1
Number of Elements1
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Output TypePush-Pull
Package / CaseDSBGA, 5-XFBGA
Supplier Device Package5-DSBGA
Supplier Device Package [x]1.4
Supplier Device Package [y]0.9
Voltage - Supply [Max]3.6 V
Voltage - Supply [Min]0.8 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.60
10$ 0.53
25$ 0.50
100$ 0.41
250$ 0.38
500$ 0.32
1000$ 0.26
Digi-Reel® 1$ 0.60
10$ 0.53
25$ 0.50
100$ 0.41
250$ 0.38
500$ 0.32
1000$ 0.26
Tape & Reel (TR) 3000$ 0.23
6000$ 0.22
15000$ 0.21
30000$ 0.20
Texas InstrumentsLARGE T&R 1$ 0.46
100$ 0.31
250$ 0.24
1000$ 0.16

Description

General part information

SN74AUP1G17-EP Series

The AUP family of devices is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCCrange of 0.8 V to 3.6 V, resulting in increased battery life. This product also maintains excellent signal integrity (seeAUP – The Lowest-Power FamilyandExcellent Signal Integrity).

This device functions as an independent gate with Schmitt-trigger inputs, which allows for slow input transition and better switching-noise immunity at the input.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.