
SN74AUP1G17DRLR
ActiveSINGLE 0.8-V TO 3.6-V LOW POWER BUFFER WITH SCHMITT-TRIGGER INPUTS
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SN74AUP1G17DRLR
ActiveSINGLE 0.8-V TO 3.6-V LOW POWER BUFFER WITH SCHMITT-TRIGGER INPUTS
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | SN74AUP1G17DRLR |
|---|---|
| Current - Output High, Low [custom] | 4 mA |
| Current - Output High, Low [custom] | 4 mA |
| Input Type | Schmitt Trigger |
| Logic Type | Buffer, Non-Inverting |
| Mounting Type | Surface Mount |
| Number of Bits per Element | 1 |
| Number of Elements | 1 |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -40 °C |
| Output Type | Push-Pull |
| Package / Case | SOT-553 |
| Supplier Device Package | SOT-5 |
| Voltage - Supply [Max] | 3.6 V |
| Voltage - Supply [Min] | 0.8 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 0.34 | |
| 10 | $ 0.29 | |||
| 25 | $ 0.27 | |||
| 100 | $ 0.22 | |||
| 250 | $ 0.20 | |||
| 500 | $ 0.17 | |||
| 1000 | $ 0.14 | |||
| Digi-Reel® | 1 | $ 0.34 | ||
| 10 | $ 0.29 | |||
| 25 | $ 0.27 | |||
| 100 | $ 0.22 | |||
| 250 | $ 0.20 | |||
| 500 | $ 0.17 | |||
| 1000 | $ 0.14 | |||
| Tape & Reel (TR) | 4000 | $ 0.14 | ||
| Texas Instruments | LARGE T&R | 1 | $ 0.21 | |
| 100 | $ 0.15 | |||
| 250 | $ 0.11 | |||
| 1000 | $ 0.07 | |||
Description
General part information
SN74AUP1G17-EP Series
The AUP family of devices is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCCrange of 0.8 V to 3.6 V, resulting in increased battery life. This product also maintains excellent signal integrity (seeAUP – The Lowest-Power FamilyandExcellent Signal Integrity).
This device functions as an independent gate with Schmitt-trigger inputs, which allows for slow input transition and better switching-noise immunity at the input.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
Documents
Technical documentation and resources