
SN74AUP1G17DBVT
ActiveSINGLE 0.8-V TO 3.6-V LOW POWER BUFFER WITH SCHMITT-TRIGGER INPUTS
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SN74AUP1G17DBVT
ActiveSINGLE 0.8-V TO 3.6-V LOW POWER BUFFER WITH SCHMITT-TRIGGER INPUTS
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | SN74AUP1G17DBVT |
|---|---|
| Current - Output High, Low [custom] | 4 mA |
| Current - Output High, Low [custom] | 4 mA |
| Input Type | Schmitt Trigger |
| Logic Type | Buffer, Non-Inverting |
| Mounting Type | Surface Mount |
| Number of Bits per Element | 1 |
| Number of Elements | 1 |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -40 °C |
| Output Type | Push-Pull |
| Package / Case | SC-74A, SOT-753 |
| Supplier Device Package | SOT-23-5 |
| Voltage - Supply [Max] | 3.6 V |
| Voltage - Supply [Min] | 0.8 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 0.72 | |
| 10 | $ 0.64 | |||
| 25 | $ 0.61 | |||
| 100 | $ 0.50 | |||
| Digi-Reel® | 1 | $ 0.72 | ||
| 10 | $ 0.64 | |||
| 25 | $ 0.61 | |||
| 100 | $ 0.50 | |||
| Tape & Reel (TR) | 250 | $ 0.47 | ||
| 500 | $ 0.41 | |||
| 1250 | $ 0.38 | |||
| Texas Instruments | SMALL T&R | 1 | $ 0.88 | |
| 100 | $ 0.60 | |||
| 250 | $ 0.46 | |||
| 1000 | $ 0.31 | |||
Description
General part information
SN74AUP1G17-EP Series
The AUP family of devices is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCCrange of 0.8 V to 3.6 V, resulting in increased battery life. This product also maintains excellent signal integrity (seeAUP – The Lowest-Power FamilyandExcellent Signal Integrity).
This device functions as an independent gate with Schmitt-trigger inputs, which allows for slow input transition and better switching-noise immunity at the input.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
Documents
Technical documentation and resources