
Deep-Dive with AI
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Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | SN74AUP1G80DCKTG4 |
|---|---|
| Clock Frequency | 260 MHz |
| Current - Output High, Low [custom] | 4 mA |
| Current - Output High, Low [custom] | 4 mA |
| Function | Standard |
| Input Capacitance | 1.5 pF |
| Max Propagation Delay @ V, Max CL | 6.4 ns |
| Mounting Type | Surface Mount |
| Number of Bits per Element | 1 |
| Number of Elements | 1 |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -40 °C |
| Output Type | 1.81 mOhm |
| Package / Case | SC-70-5, 5-TSSOP, SOT-353 |
| Supplier Device Package | SC-70-5 |
| Trigger Type | Positive Edge |
| Type | D-Type |
| Voltage - Supply [Max] | 3.6 V |
| Voltage - Supply [Min] | 0.8 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tape & Reel (TR) | 1000 | $ 0.46 | |
| 2500 | $ 0.43 | |||
| 6250 | $ 0.41 | |||
| 12500 | $ 0.40 | |||
| 25000 | $ 0.38 | |||
Description
General part information
SN74AUP1G80 Series
The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family assures a low static- and dynamic-power consumption across the entire VCCrange of 0.8 V to 3.6 V, resulting in increased battery life (seeAUP – The Lowest-Power Family). This product also maintains excellent signal integrity (seeExcellent Signal Integrity).
This is a single positive-edge-triggered D-type flip-flop. When data at the data (D) input meets the setup time requirement, the data is transferred to theQoutput on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
Documents
Technical documentation and resources
No documents available