Integrated Circuits (ICs)

SN74AUP1G80DBVRG4

Unknown

Texas Instruments

IC FF D-TYPE SNGL 1BIT SOT23-5

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Integrated Circuits (ICs)

SN74AUP1G80DBVRG4

Unknown

Texas Instruments

IC FF D-TYPE SNGL 1BIT SOT23-5

Deep-Dive with AI

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	SN74AUP1G80DBVRG4

Clock Frequency	260 MHz
Current - Output High, Low [custom]	4 mA
Current - Output High, Low [custom]	4 mA
Function	Standard
Input Capacitance	1.5 pF
Max Propagation Delay @ V, Max CL	6.4 ns
Mounting Type	Surface Mount
Number of Bits per Element	1
Number of Elements	1
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-40 °C
Output Type	1.81 mOhm
Package / Case	SC-74A, SOT-753
Supplier Device Package	SOT-23-5
Trigger Type	Positive Edge
Type	D-Type
Voltage - Supply [Max]	3.6 V
Voltage - Supply [Min]	0.8 V

SN74AUP1G80 Series

Low-Power Single Postitive-Edge-Triggered D-Type Flip-Flop

Part	Function	Number of Bits per Element	Type	Clock Frequency	Supplier Device Package	Mounting Type	Voltage - Supply [Min]	Voltage - Supply [Max]	Max Propagation Delay @ V, Max CL	Number of Elements	Output Type	Input Capacitance	Operating Temperature [Max]	Operating Temperature [Min]	Trigger Type	Current - Output High, Low [custom]	Current - Output High, Low [custom]	Package / Case
Texas Instruments SN74AUP1G80DBVTG4	Standard	1	D-Type	260 MHz	SOT-23-5	Surface Mount	0.8 V	3.6 V	6.4 ns	1	1.81 mOhm	1.5 pF	85 °C	-40 °C	Positive Edge	4 mA	4 mA	SC-74A SOT-753
Texas Instruments SN74AUP1G80DBVT	Standard	1	D-Type	260 MHz	SOT-23-5	Surface Mount	0.8 V	3.6 V	6.4 ns	1	1.81 mOhm	1.5 pF	85 °C	-40 °C	Positive Edge	4 mA	4 mA	SC-74A SOT-753
Texas Instruments SN74AUP1G80DSFR	Standard	1	D-Type	260 MHz	6-SON (1x1)	Surface Mount	0.8 V	3.6 V	6.4 ns	1	1.81 mOhm	1.5 pF	85 °C	-40 °C	Positive Edge	4 mA	4 mA	6-XFDFN
Texas Instruments SN74AUP1G80DCKT	Standard	1	D-Type	260 MHz	SC-70-5	Surface Mount	0.8 V	3.6 V	6.4 ns	1	1.81 mOhm	1.5 pF	85 °C	-40 °C	Positive Edge	4 mA	4 mA	5-TSSOP SC-70-5 SOT-353
Texas Instruments SN74AUP1G80DPWR	Standard	1	D-Type	260 MHz	5-X2SON (0.8x0.8)	Surface Mount	0.8 V	3.6 V	6.4 ns	1	1.81 mOhm	1.5 pF	85 °C	-40 °C	Positive Edge	4 mA	4 mA	4-XFDFN Exposed Pad
Texas Instruments SN74AUP1G80DRYR	Standard	1	D-Type	260 MHz	6-SON (1.45x1)	Surface Mount	0.8 V	3.6 V	6.4 ns	1	1.81 mOhm	1.5 pF	85 °C	-40 °C	Positive Edge	4 mA	4 mA	6-UFDFN
Texas Instruments SN74AUP1G80DBVRG4	Standard	1	D-Type	260 MHz	SOT-23-5	Surface Mount	0.8 V	3.6 V	6.4 ns	1	1.81 mOhm	1.5 pF	85 °C	-40 °C	Positive Edge	4 mA	4 mA	SC-74A SOT-753
Texas Instruments SN74AUP1G80DCKTG4	Standard	1	D-Type	260 MHz	SC-70-5	Surface Mount	0.8 V	3.6 V	6.4 ns	1	1.81 mOhm	1.5 pF	85 °C	-40 °C	Positive Edge	4 mA	4 mA	5-TSSOP SC-70-5 SOT-353
Texas Instruments SN74AUP1G80DCKR	Standard	1	D-Type	260 MHz	SC-70-5	Surface Mount	0.8 V	3.6 V	6.4 ns	1	1.81 mOhm	1.5 pF	85 °C	-40 °C	Positive Edge	4 mA	4 mA	5-TSSOP SC-70-5 SOT-353

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tape & Reel (TR)	3000	$ 0.17
		6000	$ 0.16
		15000	$ 0.14
		30000	$ 0.14

Description

General part information

SN74AUP1G80 Series

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family assures a low static- and dynamic-power consumption across the entire VCCrange of 0.8 V to 3.6 V, resulting in increased battery life (seeAUP – The Lowest-Power Family). This product also maintains excellent signal integrity (seeExcellent Signal Integrity).

This is a single positive-edge-triggered D-type flip-flop. When data at the data (D) input meets the setup time requirement, the data is transferred to theQoutput on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

Documents

Technical documentation and resources

No documents available