Specification	2N3636L

Current - Collector (Ic) (Max) [Max]	1 A
Current - Collector Cutoff (Max) [Max]	10 µA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]	50 hFE
Mounting Type	Through Hole
Package / Case	TO-205AA, TO-5-3 Metal Can
Power - Max [Max]	1 W
Supplier Device Package	TO-5AA
Transistor Type	PNP
Vce Saturation (Max) @ Ib, Ic	600 mV
Voltage - Collector Emitter Breakdown (Max)	175 V

JANTX2N3636UB-Transistor Series

PNP Silicon Amplifier -140V, -1A

Part	Vce Saturation (Max) @ Ib, Ic	Transistor Type	Current - Collector (Ic) (Max) [Max]	Current - Collector Cutoff (Max) [Max]	DC Current Gain (hFE) (Min) @ Ic, Vce [Min]	Mounting Type	Supplier Device Package	Voltage - Collector Emitter Breakdown (Max)	Power - Max [Max]	Package / Case	Grade	Qualification
Microchip Technology 2N3636	600 mV	PNP	1 A	10 µA	50 hFE	Through Hole	TO-39 (TO-205AD)	175 V	1 W	TO-205AD TO-39-3 Metal Can
Microchip Technology 2N3636L	600 mV	PNP	1 A	10 µA	50 hFE	Through Hole	TO-5AA	175 V	1 W	TO-205AA TO-5-3 Metal Can
Microchip Technology JANTXV2N3636L	600 mV	PNP	1 A	10 µA	50 hFE	Through Hole	TO-5AA	175 V	1 W	TO-205AA TO-5-3 Metal Can	Military	MIL-PRF-19500/357
Microchip Technology JAN2N3636L	600 mV	PNP	1 A	10 µA	50 hFE	Through Hole	TO-5AA	175 V	1 W	TO-205AA TO-5-3 Metal Can	Military	MIL-PRF-19500/357
Microchip Technology JANTX2N3636UB	600 mV	PNP	1 A	10 µA	50 hFE	Surface Mount	UB	175 V	1.5 W	3-SMD No Lead	Military	MIL-PRF-19500/357

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	100	$ 11.21
Microchip Direct	N/A	1	$ 12.07
Newark	Each	100	$ 11.21
		500	$ 10.78

Description

General part information

JANTX2N3636UB-Transistor Series

This specification covers the performance requirements for PNP, silicon, radiation hardened, low-power amplifier, and switching 2N3634 through 2N3637 transistors. Four levels of product assurance are provided for each encapsulated device (JAN, JANTX, JANTXV and JANS) as specified in MIL-PRF-19500/357 and two levels of product assurance are provided for unencapsulated die (JANHC and JANKC). The device package for the encapsulated device type are as follows: TO-5 and TO-39 and surface mount. The dimensions and topography for JANHC and JANKC unencapsulated die are as outlined in MIL-PRF-19500/357.

Documents

Technical documentation and resources

Product Change Notice EN

Datasheet

2N3634 2N3635 2N3636 2N3637

Data Sheets