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2N3810
Discrete Semiconductor Products

2N3810

Active
Microchip Technology

DUAL SMALL-SIGNAL BJT TO-78 ROHS COMPLIANT: YES

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2N3810
Discrete Semiconductor Products

2N3810

Active
Microchip Technology

DUAL SMALL-SIGNAL BJT TO-78 ROHS COMPLIANT: YES

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

Specification2N3810
Current - Collector (Ic) (Max) [Max]50 mA
Current - Collector Cutoff (Max) [Max]10 µA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]150
Mounting TypeThrough Hole
Package / CaseTO-78-6 Metal Can
Power - Max [Max]350 mW
Supplier Device PackageTO-78-6
Transistor Type2 PNP (Dual)
Vce Saturation (Max) @ Ib, Ic250 mV
Voltage - Collector Emitter Breakdown (Max) [Max]60 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 1$ 16.28
100$ 15.12
Microchip DirectN/A 1$ 16.28
NewarkEach 100$ 15.12
500$ 14.54

Description

General part information

2N3810-Dual-Transistor Series

This specification covers the performance requirements for two electrically isolated, matched PNP, radiation hardened, silicon 2N3810, and 2N3811 Unitized, transistors as one dual unit for use in particular switching applications. Four levels of product assurance (JAN, JANTX, JANTXV and JANS), are provided for each encapsulated device type as specified in MIL-PRF-19500/336 and two levels of product assurance are provided for each unencapsulated die (JANHC and JANKC). The device package outlines are as follows: TO-78 and U for all encapsulated device types. The dimensions and topography for JANHC and JANKC unencapsulated die are as outlined in MIL-PRF-19500/336.

Documents

Technical documentation and resources