2N3838

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Microchip Technology

DUAL SMALL-SIGNAL BJT 6L FP ROHS COMPLIANT: YES

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DocumentsDatasheet Product Change Notice EN

Discrete Semiconductor Products

2N3838

Active

Microchip Technology

DUAL SMALL-SIGNAL BJT 6L FP ROHS COMPLIANT: YES

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DocumentsDatasheet Product Change Notice EN

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	2N3838

Current - Collector (Ic) (Max) [Max]	600 mA
Current - Collector Cutoff (Max) [Max]	10 µA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]	100
Mounting Type	Surface Mount
Package / Case	6-FlatPack
Power - Max [Max]	350 mW
Supplier Device Package	6-Flatpack
Transistor Type	1 NPN, 1 PNP
Vce Saturation (Max) @ Ib, Ic	400 mV
Voltage - Collector Emitter Breakdown (Max)	40 V

2N3810-Dual-Transistor Series

MIL-PRF-19500/336

Part	Package / Case	Transistor Type	Voltage - Collector Emitter Breakdown (Max) [Max]	DC Current Gain (hFE) (Min) @ Ic, Vce [Min]	Power - Max [Max]	Supplier Device Package	Current - Collector (Ic) (Max) [Max]	Mounting Type	Current - Collector Cutoff (Max) [Max]	Vce Saturation (Max) @ Ib, Ic	Voltage - Collector Emitter Breakdown (Max)
Microchip Technology 2N3810	TO-78-6 Metal Can	2 PNP (Dual)	60 V	150	350 mW	TO-78-6	50 mA	Through Hole	10 µA	250 mV
Microchip Technology 2N3838	6-FlatPack	1 NPN 1 PNP		100	350 mW	6-Flatpack	600 mA	Surface Mount	10 µA	400 mV	40 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	100	$ 49.05
Newark	Each	100	$ 49.05
		500	$ 47.16

Description

General part information

2N3810-Dual-Transistor Series

This specification covers the performance requirements for two electrically isolated, matched PNP, radiation hardened, silicon 2N3810, and 2N3811 Unitized, transistors as one dual unit for use in particular switching applications. Four levels of product assurance (JAN, JANTX, JANTXV and JANS), are provided for each encapsulated device type as specified in MIL-PRF-19500/336 and two levels of product assurance are provided for each unencapsulated die (JANHC and JANKC). The device package outlines are as follows: TO-78 and U for all encapsulated device types. The dimensions and topography for JANHC and JANKC unencapsulated die are as outlined in MIL-PRF-19500/336.