
SN74LVC2G125DCUR
Active2-CH, 1.65-V TO 5.5-V BUFFERS WITH 3-STATE OUTPUTS
Deep-Dive with AI
Search across all available documentation for this part.

SN74LVC2G125DCUR
Active2-CH, 1.65-V TO 5.5-V BUFFERS WITH 3-STATE OUTPUTS
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | SN74LVC2G125DCUR |
|---|---|
| Current - Output High, Low [x] | 32 mA |
| Current - Output High, Low [y] | 32 mA |
| Logic Type | Buffer, Non-Inverting |
| Mounting Type | Surface Mount |
| Number of Bits per Element | 1 |
| Number of Elements | 2 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -40 °C |
| Output Type | 3-State |
| Package / Case | 8-VFSOP |
| Package / Case [y] | 2.3 mm |
| Package / Case [y] | 0.091 in |
| Voltage - Supply [Max] | 5.5 V |
| Voltage - Supply [Min] | 1.65 V |
SN74LVC2G125 Series
2-ch, 1.65-V to 5.5-V buffers with 3-state outputs
| Part | Number of Bits per Element | Mounting Type | Output Type | Operating Temperature [Min] | Operating Temperature [Max] | Number of Elements | Voltage - Supply [Max] | Voltage - Supply [Min] | Logic Type | Current - Output High, Low [y] | Current - Output High, Low [x] | Package / Case [y] | Package / Case | Package / Case [y] | Supplier Device Package [y] | Supplier Device Package | Supplier Device Package [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments | 1 | Surface Mount | 3-State | -40 °C | 125 °C | 2 | 5.5 V | 1.65 V | Buffer Non-Inverting | 32 mA | 32 mA | 2.3 mm | 8-VFSOP | 0.091 in | |||
Texas Instruments | 1 | Surface Mount | 3-State | -40 °C | 125 °C | 2 | 5.5 V | 1.65 V | Buffer Non-Inverting | 32 mA | 32 mA | 2.3 mm | 8-VFSOP | 0.091 in | |||
Texas Instruments | 1 | Surface Mount | 3-State | -40 °C | 125 °C | 2 | 5.5 V | 1.65 V | Buffer Non-Inverting | 32 mA | 32 mA | 2.3 mm | 8-VFSOP | 0.091 in | |||
Texas Instruments | 1 | Surface Mount | 3-State | -40 °C | 125 °C | 2 | 5.5 V | 1.65 V | Buffer Non-Inverting | 32 mA | 32 mA | 2.3 mm | 8-VFSOP | 0.091 in | |||
Texas Instruments | 1 | Surface Mount | 3-State | -40 °C | 125 °C | 2 | 5.5 V | 1.65 V | Buffer Non-Inverting | 32 mA | 32 mA | 8-XFBGA DSBGA | 0.9 | 8-DSBGA (1.9x0.9) | 1.9 | ||
Texas Instruments | 1 | Surface Mount | 3-State | -40 °C | 125 °C | 2 | 5.5 V | 1.65 V | Buffer Non-Inverting | 32 mA | 32 mA | SM8 | |||||
Texas Instruments | 1 | Surface Mount | 3-State | -40 °C | 125 °C | 2 | 5.5 V | 1.65 V | Buffer Non-Inverting | 32 mA | 32 mA | 2.3 mm | 8-VFSOP | 0.091 in | |||
Texas Instruments | 1 | Surface Mount | 3-State | -40 °C | 125 °C | 2 | 5.5 V | 1.65 V | Buffer Non-Inverting | 32 mA | 32 mA | SM8 | |||||
Texas Instruments | 1 | Surface Mount | 3-State | -40 °C | 125 °C | 2 | 5.5 V | 1.65 V | Buffer Non-Inverting | 32 mA | 32 mA | SM8 | |||||
Texas Instruments | 1 | Surface Mount | 3-State | -40 °C | 125 °C | 2 | 5.5 V | 1.65 V | Buffer Non-Inverting | 32 mA | 32 mA | 2.3 mm | 8-VFSOP | 0.091 in |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 0.51 | |
| 10 | $ 0.41 | |||
| 25 | $ 0.38 | |||
| 100 | $ 0.28 | |||
| 250 | $ 0.25 | |||
| 500 | $ 0.21 | |||
| 1000 | $ 0.16 | |||
| Digi-Reel® | 1 | $ 0.51 | ||
| 10 | $ 0.41 | |||
| 25 | $ 0.38 | |||
| 100 | $ 0.28 | |||
| 250 | $ 0.25 | |||
| 500 | $ 0.21 | |||
| 1000 | $ 0.16 | |||
| Tape & Reel (TR) | 3000 | $ 0.14 | ||
| 6000 | $ 0.14 | |||
| 15000 | $ 0.13 | |||
| 30000 | $ 0.12 | |||
| 75000 | $ 0.11 | |||
| Texas Instruments | LARGE T&R | 1 | $ 0.23 | |
| 100 | $ 0.16 | |||
| 250 | $ 0.12 | |||
| 1000 | $ 0.08 | |||
Description
General part information
SN74LVC2G125 Series
The SN74LVC2G125 device is a dual bus buffer gate, designed for 1.65-V to 5.5-V VCCoperation. This device features dual line drivers with 3-state outputs. The outputs are disabled when the associated output-enable (OE) input is high.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
To ensure the high-impedance state during power up or power down,OEshould be tied to VCCthrough a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
Documents
Technical documentation and resources