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BA17818FP-E2
Discrete Semiconductor Products

R6004RND3TL1

Active
Rohm Semiconductor

POWER FIELD-EFFECT TRANSISTOR, 4A I(D), 600V, 1.73OHM, 1-ELEMENT, N-CHANNEL, SILICON, METAL-OXIDE SEMICONDUCTOR FET, TO-252, DPAK-3/2

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BA17818FP-E2
Discrete Semiconductor Products

R6004RND3TL1

Active
Rohm Semiconductor

POWER FIELD-EFFECT TRANSISTOR, 4A I(D), 600V, 1.73OHM, 1-ELEMENT, N-CHANNEL, SILICON, METAL-OXIDE SEMICONDUCTOR FET, TO-252, DPAK-3/2

Technical Specifications

Parameters and characteristics for this part

SpecificationR6004RND3TL1
Current - Continuous Drain (Id) @ 25°C4 A
Drain to Source Voltage (Vdss)600 V
Drive Voltage (Max Rds On, Min Rds On)15 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs10.5 nC
Input Capacitance (Ciss) (Max) @ Vds230 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSC-63, DPAK (2 Leads + Tab), TO-252-3
Power Dissipation (Max)60 W
Rds On (Max) @ Id, Vgs1.73 Ohm
Supplier Device PackageTO-252
TechnologyMOSFET (Metal Oxide)
Vgs (Max)30 V
Vgs(th) (Max) @ Id7 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 1.79
10$ 1.13
25$ 0.96
100$ 0.77
250$ 0.67
500$ 0.61
1000$ 0.57
Digi-Reel® 1$ 1.79
10$ 1.13
25$ 0.96
100$ 0.77
250$ 0.67
500$ 0.61
1000$ 0.57
Tape & Reel (TR) 2500$ 0.52
5000$ 0.48
7500$ 0.47
12500$ 0.45
17500$ 0.44
NewarkEach (Supplied on Cut Tape) 1$ 0.68

Description

General part information

R6004JND3 Series

R6004JND3 is a power MOSFET with fast reverse recovery time (trr), suitable for the switching applications.PrestoMOS™ series, R60xxJNx series increases design flexibility while maintaining the industry’s fastest reverse recovery time (trr) optimized for EV charging stations and motor drive in home appliances such as refrigerators and Air Conditioners (ACs).

Documents

Technical documentation and resources

Datasheet

Datasheet

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

About Export Regulations

Export Information

About Flammability of Materials

Environmental Data

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

What Is Thermal Design

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Explanation for Marking

Package Information

Report of SVHC under REACH Regulation

Environmental Data

Judgment Criteria of Thermal Evaluation

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Benefits given by PrestoMOS&trade; series for the Phase-Shift Full-Bridge

Technical Article

Two-Resistor Model for Thermal Simulation

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Part Explanation

Application Note

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Types and Features of Transistors

Application Note

What is a Thermal Model? (Transistor)

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

R6004RND3 ESD Data

Characteristics Data

Package Dimensions

Package Information

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article