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Discrete Semiconductor Products

R6004JNJGTL

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Rohm Semiconductor

600V 4A TO-263, PRESTOMOS™ WITH INTEGRATED HIGH-SPEED DIODE

Product thumbnail image
Discrete Semiconductor Products

R6004JNJGTL

Active
Rohm Semiconductor

600V 4A TO-263, PRESTOMOS™ WITH INTEGRATED HIGH-SPEED DIODE

Technical Specifications

Parameters and characteristics for this part

SpecificationR6004JNJGTL
Current - Continuous Drain (Id) @ 25°C4 A
Drain to Source Voltage (Vdss)600 V
Drive Voltage (Max Rds On, Min Rds On)15 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs10.5 nC
Input Capacitance (Ciss) (Max) @ Vds260 pF
Mounting TypeSurface Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-55 °C
Package / CaseD2PAK (2 Leads + Tab), TO-263AB, TO-263-3
Power Dissipation (Max)60 W
Rds On (Max) @ Id, Vgs1.43 Ohm
Supplier Device PackageLPTS
TechnologyMOSFET (Metal Oxide)
Vgs (Max)30 V
Vgs(th) (Max) @ Id7 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 2.09
10$ 1.36
100$ 0.94
500$ 0.90
Digi-Reel® 1$ 1.51
10$ 1.25
100$ 1.00
500$ 0.90
Tape & Reel (TR) 1000$ 0.90
NewarkEach (Supplied on Cut Tape) 1$ 1.32

Description

General part information

R6004JND3 Series

R6004JND3 is a power MOSFET with fast reverse recovery time (trr), suitable for the switching applications.PrestoMOS™ series, R60xxJNx series increases design flexibility while maintaining the industry’s fastest reverse recovery time (trr) optimized for EV charging stations and motor drive in home appliances such as refrigerators and Air Conditioners (ACs).

Documents

Technical documentation and resources

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Types and Features of Transistors

Application Note

Two-Resistor Model for Thermal Simulation

Thermal Design

Taping Information

Package Information

List of Transistor Package Thermal Resistance

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Create Symbols for PSpice Models

Models

R6004JNJ ESD Data

Characteristics Data

What is a Thermal Model? (Transistor)

Thermal Design

About Export Regulations

Export Information

What Is Thermal Design

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Explanation for Marking

Package Information

Inner Structure

Package Information

Package Dimensions

Package Information

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Method for Monitoring Switching Waveform

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Reliability Test Result

Manufacturing Data

Judgment Criteria of Thermal Evaluation

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Report of SVHC under REACH Regulation

Environmental Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Benefits given by PrestoMOS&trade; series for the Phase-Shift Full-Bridge

Technical Article

About Flammability of Materials

Environmental Data

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Double-pulse test substantiated advantages of PrestoMOS&trade;

Technical Article

Moisture Sensitivity Level - Transistors

Package Information

Part Explanation

Application Note

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Technical Data Sheet EN

Datasheet