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5-DSBGA-YZP
Integrated Circuits (ICs)

SN74LVC1G80YEPR

Obsolete
Texas Instruments

IC FF D-TYPE SNGL 1BIT 5DSBGA

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5-DSBGA-YZP
Integrated Circuits (ICs)

SN74LVC1G80YEPR

Obsolete
Texas Instruments

IC FF D-TYPE SNGL 1BIT 5DSBGA

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

SpecificationSN74LVC1G80YEPR
Clock Frequency160 MHz
Current - Output High, Low [x]32 mA
Current - Output High, Low [y]32 mA
Current - Quiescent (Iq)10 µA
FunctionStandard
Input Capacitance3.5 pF
Max Propagation Delay @ V, Max CL4.5 ns
Mounting TypeSurface Mount
Number of Bits per Element1
Number of Elements1
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Output Type1.81 mOhm
Package / CaseDSBGA, 5-XFBGA
Supplier Device Package5-DSBGA
Supplier Device Package [x]1.4
Supplier Device Package [y]0.9
Trigger TypePositive Edge
TypeD-Type
Voltage - Supply [Max]5.5 V
Voltage - Supply [Min]1.65 V

SN74LVC1G80 Series

Single Positive-Edge-Triggered D-Type Flip-Flop

PartSupplier Device Package [x]Supplier Device PackageSupplier Device Package [y]Trigger TypeMounting TypeVoltage - Supply [Max]Voltage - Supply [Min]Current - Output High, Low [y]Current - Output High, Low [x]Operating Temperature [Max]Operating Temperature [Min]Package / CaseOutput TypeClock FrequencyCurrent - Quiescent (Iq)TypeFunctionMax Propagation Delay @ V, Max CLInput CapacitanceNumber of ElementsNumber of Bits per Element
5-DSBGA-YZP
Texas Instruments
1.4
5-DSBGA
0.9
Positive Edge
Surface Mount
5.5 V
1.65 V
32 mA
32 mA
85 °C
-40 °C
5-XFBGA
DSBGA
1.81 mOhm
160 MHz
10 µA
D-Type
Standard
4.5 ns
3.5 pF
1
1
5-DSBGA-YZP
Texas Instruments
1.4
5-DSBGA
0.9
Positive Edge
Surface Mount
5.5 V
1.65 V
32 mA
32 mA
85 °C
-40 °C
5-XFBGA
DSBGA
1.81 mOhm
160 MHz
10 µA
D-Type
Standard
4.5 ns
3.5 pF
1
1
Texas Instruments-LM4041CIM7X-ADJ Voltage References V-Ref Adjustable 1.24V to 10V 12mA 5-Pin SC-70 T/R
Texas Instruments
SC-70-5
Positive Edge
Surface Mount
5.5 V
1.65 V
32 mA
32 mA
125 °C
-40 °C
5-TSSOP
SC-70-5
SOT-353
1.81 mOhm
160 MHz
10 µA
D-Type
Standard
4.5 ns
3.5 pF
1
1
5-DSBGA-YZP
Texas Instruments
1.4
5-DSBGA
0.9
Positive Edge
Surface Mount
5.5 V
1.65 V
32 mA
32 mA
85 °C
-40 °C
5-XFBGA
DSBGA
1.81 mOhm
160 MHz
10 µA
D-Type
Standard
4.5 ns
3.5 pF
1
1
SOT753
Texas Instruments
SOT-23-5
Positive Edge
Surface Mount
5.5 V
1.65 V
32 mA
32 mA
125 °C
-40 °C
SC-74A
SOT-753
1.81 mOhm
160 MHz
10 µA
D-Type
Standard
4.5 ns
3.5 pF
1
1
SOT753
Texas Instruments
SOT-23-5
Positive Edge
Surface Mount
5.5 V
1.65 V
32 mA
32 mA
125 °C
-40 °C
SC-74A
SOT-753
1.81 mOhm
160 MHz
10 µA
D-Type
Standard
4.5 ns
3.5 pF
1
1
5-DSBGA-YZP
Texas Instruments
1.4
5-DSBGA
0.9
Positive Edge
Surface Mount
5.5 V
1.65 V
32 mA
32 mA
85 °C
-40 °C
5-XFBGA
DSBGA
1.81 mOhm
160 MHz
10 µA
D-Type
Standard
4.5 ns
3.5 pF
1
1
SC70-5
Texas Instruments
SC-70-5
Positive Edge
Surface Mount
5.5 V
1.65 V
32 mA
32 mA
125 °C
-40 °C
5-TSSOP
SC-70-5
SOT-353
1.81 mOhm
160 MHz
10 µA
D-Type
Standard
4.5 ns
3.5 pF
1
1
SOT-23 (DBV)
Texas Instruments
SOT-23-5
Positive Edge
Surface Mount
5.5 V
1.65 V
32 mA
32 mA
125 °C
-40 °C
SC-74A
SOT-753
1.81 mOhm
160 MHz
10 µA
D-Type
Standard
4.5 ns
3.5 pF
1
1
SC70-5
Texas Instruments
SC-70-5
Positive Edge
Surface Mount
5.5 V
1.65 V
32 mA
32 mA
125 °C
-40 °C
5-TSSOP
SC-70-5
SOT-353
1.81 mOhm
160 MHz
10 µA
D-Type
Standard
4.5 ns
3.5 pF
1
1

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

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Description

General part information

SN74LVC1G80 Series

This single positive-edge-triggered D-type flip-flop is designed for 1.65-V to 5.5-V VCCoperation.

When data at the data (D) input meets the setup time requirement, the data is transferred to theQoutput on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the level at the output.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

Documents

Technical documentation and resources