Specification	24-350000-10-HT

Board Material	Polyimide (PI)
Board Thickness	1.57 mm
Board Thickness	0.062 "
Contact Finish - Post	Tin-Lead
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Post [custom]	Brass
Convert From (Adapter End)	SOIC
Convert To (Adapter End)	7.62 mm
Convert To (Adapter End)	DIP
Convert To (Adapter End)	0.3 in
Material	FR4 Epoxy Glass
Mounting Type	Through Hole
Number of Pins	24
Number of Positions	24
Package Accepted	SOIC
Pitch	0.05 in
Pitch	1.27 mm
Pitch - Mating	1.27 mm
Pitch - Mating	0.05 in
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Proto Board Type	DIP to DIP
Termination	Solder
Termination Post Length	0.125 in
Termination Post Length	3.18 mm

24-3500 Series

Part	Pitch	Pitch	Proto Board Type	Material	Size / Dimension [y]	Size / Dimension [x]	Size / Dimension [x]	Size / Dimension [y]	Board Thickness	Board Thickness	Board Thickness	Package Accepted	Number of Positions	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Contact Finish - Post	Contact Material - Post [custom]	Mounting Type	Termination	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Post	Pitch - Post	Board Material	Convert From (Adapter End)	Number of Pins	Termination Post Length	Termination Post Length	Pitch - Mating	Pitch - Mating
Aries Electronics 24-350000-10	0.05 in	1.27 mm	SMD to DIP	FR4 Epoxy Glass	0.45 in	2.4 in	60.96 mm	11.43 mm	1.57 mm	0.062 "	0.0625 in	SOIC	24
Aries Electronics 24-350000-11-RC	0.05 in	1.27 mm	SMD to DIP	FR4 Epoxy Glass	0.45 in	2.4 in	60.96 mm	11.43 mm	1.57 mm	0.062 "	0.0625 in	SOIC	24
Aries Electronics 24-350000-10-HT	0.05 in	1.27 mm	DIP to DIP	FR4 Epoxy Glass					1.57 mm	0.062 "		SOIC	24	7.62 mm	DIP	0.3 in	Tin-Lead	Brass	Through Hole	Solder	200 µin	5.08 µm	0.1 in	2.54 mm	Polyimide (PI)	SOIC	24	0.125 in	3.18 mm	1.27 mm	0.05 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly