24-3500 Series
Manufacturer: Aries Electronics
Beta
⌘K
SOCKET ADAPTER SOIC TO 24DIP 0.3
| Part | Pitch | Pitch | Proto Board Type | Material | Size / Dimension [y] | Size / Dimension [x] | Size / Dimension [x] | Size / Dimension [y] | Board Thickness | Board Thickness | Board Thickness | Package Accepted | Number of Positions | Convert To (Adapter End) | Convert To (Adapter End) | Convert To (Adapter End) | Contact Finish - Post | Contact Material - Post [custom] | Mounting Type | Termination | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Post | Pitch - Post | Board Material | Convert From (Adapter End) | Number of Pins | Termination Post Length | Termination Post Length | Pitch - Mating | Pitch - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 0.05 in | 1.27 mm | SMD to DIP | FR4 Epoxy Glass | 0.45 in | 2.4 in | 60.96 mm | 11.43 mm | 1.57 mm | 0.062 " | 0.0625 in | SOIC | 24 | ||||||||||||||||||
 Aries Electronics | 0.05 in | 1.27 mm | SMD to DIP | FR4 Epoxy Glass | 0.45 in | 2.4 in | 60.96 mm | 11.43 mm | 1.57 mm | 0.062 " | 0.0625 in | SOIC | 24 | ||||||||||||||||||
 Aries Electronics | 0.05 in | 1.27 mm | DIP to DIP | FR4 Epoxy Glass | 1.57 mm | 0.062 " | SOIC | 24 | 7.62 mm | DIP | 0.3 in | Tin-Lead | Brass | Through Hole | Solder | 200 µin | 5.08 µm | 0.1 in | 2.54 mm | Polyimide (PI) | SOIC | 24 | 0.125 in | 3.18 mm | 1.27 mm | 0.05 in |