24-3500 Series

Part	Pitch	Pitch	Proto Board Type	Material	Size / Dimension [y]	Size / Dimension [x]	Size / Dimension [x]	Size / Dimension [y]	Board Thickness	Board Thickness	Board Thickness	Package Accepted	Number of Positions	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Contact Finish - Post	Contact Material - Post [custom]	Mounting Type	Termination	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Post	Pitch - Post	Board Material	Convert From (Adapter End)	Number of Pins	Termination Post Length	Termination Post Length	Pitch - Mating	Pitch - Mating
Aries Electronics 24-350000-10	0.05 in	1.27 mm	SMD to DIP	FR4 Epoxy Glass	0.45 in	2.4 in	60.96 mm	11.43 mm	1.57 mm	0.062 "	0.0625 in	SOIC	24
Aries Electronics 24-350000-11-RC	0.05 in	1.27 mm	SMD to DIP	FR4 Epoxy Glass	0.45 in	2.4 in	60.96 mm	11.43 mm	1.57 mm	0.062 "	0.0625 in	SOIC	24
Aries Electronics 24-350000-10-HT	0.05 in	1.27 mm	DIP to DIP	FR4 Epoxy Glass					1.57 mm	0.062 "		SOIC	24	7.62 mm	DIP	0.3 in	Tin-Lead	Brass	Through Hole	Solder	200 µin	5.08 µm	0.1 in	2.54 mm	Polyimide (PI)	SOIC	24	0.125 in	3.18 mm	1.27 mm	0.05 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly