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TO-220FN

Discrete Semiconductor Products

RBQ30T45ANZC9

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Rohm Semiconductor

LOW IR, 45V, 30A, ITO-220AB, SCHOTTKY BARRIER DIODE

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Search across all available documentation for this part.

DocumentsHow to Select Reverse Current Protection Diodes for LDO Regulators What is a Thermal Model? (Diode)+45

TO-220FN

Discrete Semiconductor Products

RBQ30T45ANZC9

Active

Rohm Semiconductor

LOW IR, 45V, 30A, ITO-220AB, SCHOTTKY BARRIER DIODE

Deep-Dive with AI

DocumentsHow to Select Reverse Current Protection Diodes for LDO Regulators What is a Thermal Model? (Diode)+45

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	RBQ30T45ANZC9

Current - Average Rectified (Io) (per Diode)	15 A
Current - Reverse Leakage @ Vr	450 µA
Diode Configuration	1 Pair Common Cathode
Mounting Type	Through Hole
Operating Temperature - Junction	150 ¯C
Package / Case	TO-220-3 Full Pack
Speed	500 ns, 200 mA
Supplier Device Package	TO-220FN
Technology	Schottky
Voltage - DC Reverse (Vr) (Max) [Max]	45 V
Voltage - Forward (Vf) (Max) @ If [Max]	650 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	0	$ 0.72
	Tube	1000	$ 0.73

Description

General part information

RBQ30 Series

ROHM's schottky barrier diodes are low VF, low IR and high ESD resistant, suitable for phone and various portable electronics.

Documents

Technical documentation and resources

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

What is a Thermal Model? (Diode)

Diode Selection Method for Asynchronous Converter

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Inner Structure

Package Information

Moisture Sensitivity Level - Diodes

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Power Loss and Thermal Design of Diodes

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Explanation for Marking

Package Information

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Diode Types and Applications

Technical Article

Measurement Method and Usage of Thermal Resistance RthJC

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

About Flammability of Materials

Environmental Data

θ<sub>JA</sub> and Ψ<sub>JT</sub>

RBQ30T45ANZ ESD Data

Characteristics Data

Constitution Materials List

Environmental Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Anti-Whisker formation - Diodes

Package Information

ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Judgment Criteria of Thermal Evaluation

How to Use LTspice® Models

Schematic Design & Verification

Condition of Soldering / Land Pattern Reference

Package Information

Basics of Thermal Resistance and Heat Dissipation

Notes for Temperature Measurement Using Thermocouples

Method for Monitoring Switching Waveform

Schematic Design & Verification

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Package Dimensions

Package Information

PCB Layout Thermal Design Guide

Part Explanation

Application Note

Reliability Test Result

Manufacturing Data

Compliance of the RoHS directive

Environmental Data

How to Select Rectifier Diodes

Technical Article

What Is Thermal Design

About Export Regulations

Export Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Create Symbols for PSpice Models

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

List of Diode Package Thermal Resistance

Notes for Calculating Power Consumption:Static Operation

Taping Information

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

RBQ30T45ANZ Data Sheet

RBQ30 Series

Low IR, 100V, 30A, TO-263S (D2PAK), Schottky Barrier Diode for Automotive

Part	Mounting Type	Current - Average Rectified (Io) (per Diode)	Diode Configuration	Current - Reverse Leakage @ Vr	Speed	Voltage - DC Reverse (Vr) (Max) [Max]	Operating Temperature - Junction	Supplier Device Package	Technology	Voltage - Forward (Vf) (Max) @ If [Max]	Qualification	Grade	Package / Case	Operating Temperature - Junction [Max]	Voltage - Forward (Vf) (Max) @ If	Current - Average Rectified (Io)
Rohm Semiconductor RBQ30NS100ATL	Surface Mount	30 A	1 Pair Common Cathode	200 µA	200 mA 500 ns	100 V	150 ¯C	TO-263S	Schottky	770 mV	AEC-Q101	Automotive	D2PAK (2 Leads + Tab) TO-263-3 TO-263AB
Rohm Semiconductor RBQ30NS100AFHTL	Surface Mount	30 A	1 Pair Common Cathode	200 µA	200 mA 500 ns	100 V		LPDS	Schottky	770 mV	AEC-Q101	Automotive	D2PAK (2 Leads + Tab) TO-263-3 TO-263AB	150 °C
Rohm Semiconductor RBQ30T45ANZC9	Through Hole	15 A	1 Pair Common Cathode	450 µA	200 mA 500 ns	45 V	150 ¯C	TO-220FN	Schottky	650 mV			TO-220-3 Full Pack
Rohm Semiconductor RBQ30T65ANZC9	Through Hole	15 A	1 Pair Common Cathode	200 µA	200 mA 500 ns	65 V	150 ¯C	TO-220FN	Schottky				TO-220-3 Full Pack		690 mV
Rohm Semiconductor RBQ30TB45BNZC9	Through Hole				200 mA 500 ns	45 V	150 ¯C	TO-220FN-2	Schottky				TO-220-2 Full Pack		590 mV	30 A
Rohm Semiconductor RBQ30NS45BTL	Surface Mount				200 mA 500 ns	45 V	150 ¯C	LPDS	Schottky				D2PAK (2 Leads + Tab) TO-263-3 TO-263AB		590 mV	30 A
Rohm Semiconductor RBQ30NS45ATL	Surface Mount	15 A	1 Pair Common Cathode	200 µA	200 mA 500 ns	45 V	150 ¯C	LPDS	Schottky	650 mV			D2PAK (2 Leads + Tab) TO-263-3 TO-263AB
Rohm Semiconductor RBQ30NS65ATL	Surface Mount	15 A	1 Pair Common Cathode	200 µA	200 mA 500 ns	65 V	150 ¯C	LPDS	Schottky				D2PAK (2 Leads + Tab) TO-263-3 TO-263AB		690 mV