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LPDS (TO-263S)
Discrete Semiconductor Products

RBQ30NS100AFHTL

Active
Rohm Semiconductor

LOW IR, 100V, 30A, TO-263S (D2PAK), SCHOTTKY BARRIER DIODE FOR AUTOMOTIVE

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LPDS (TO-263S)
Discrete Semiconductor Products

RBQ30NS100AFHTL

Active
Rohm Semiconductor

LOW IR, 100V, 30A, TO-263S (D2PAK), SCHOTTKY BARRIER DIODE FOR AUTOMOTIVE

Technical Specifications

Parameters and characteristics for this part

SpecificationRBQ30NS100AFHTL
Current - Average Rectified (Io) (per Diode)30 A
Current - Reverse Leakage @ Vr200 µA
Diode Configuration1 Pair Common Cathode
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature - Junction [Max]150 °C
Package / CaseD2PAK (2 Leads + Tab), TO-263-3, TO-263AB
QualificationAEC-Q101
Speed500 ns, 200 mA
Supplier Device PackageLPDS
TechnologySchottky
Voltage - DC Reverse (Vr) (Max) [Max]100 V
Voltage - Forward (Vf) (Max) @ If [Max]770 mV

RBQ30 Series

Low IR, 100V, 30A, TO-263S (D2PAK), Schottky Barrier Diode for Automotive

PartMounting TypeCurrent - Average Rectified (Io) (per Diode)Diode ConfigurationCurrent - Reverse Leakage @ VrSpeedVoltage - DC Reverse (Vr) (Max) [Max]Operating Temperature - JunctionSupplier Device PackageTechnologyVoltage - Forward (Vf) (Max) @ If [Max]QualificationGradePackage / CaseOperating Temperature - Junction [Max]Voltage - Forward (Vf) (Max) @ IfCurrent - Average Rectified (Io)
Product thumbnail image
Rohm Semiconductor
Surface Mount
30 A
1 Pair Common Cathode
200 µA
200 mA
500 ns
100 V
150 ¯C
TO-263S
Schottky
770 mV
AEC-Q101
Automotive
D2PAK (2 Leads + Tab)
TO-263-3
TO-263AB
LPDS (TO-263S)
Rohm Semiconductor
Surface Mount
30 A
1 Pair Common Cathode
200 µA
200 mA
500 ns
100 V
LPDS
Schottky
770 mV
AEC-Q101
Automotive
D2PAK (2 Leads + Tab)
TO-263-3
TO-263AB
150 °C
TO-220FN
Rohm Semiconductor
Through Hole
15 A
1 Pair Common Cathode
450 µA
200 mA
500 ns
45 V
150 ¯C
TO-220FN
Schottky
650 mV
TO-220-3 Full Pack
TO-220FN
Rohm Semiconductor
Through Hole
15 A
1 Pair Common Cathode
200 µA
200 mA
500 ns
65 V
150 ¯C
TO-220FN
Schottky
TO-220-3 Full Pack
690 mV
TO-220FN(2PIN)
Rohm Semiconductor
Through Hole
200 mA
500 ns
45 V
150 ¯C
TO-220FN-2
Schottky
TO-220-2 Full Pack
590 mV
30 A
Product thumbnail image
Rohm Semiconductor
Surface Mount
200 mA
500 ns
45 V
150 ¯C
LPDS
Schottky
D2PAK (2 Leads + Tab)
TO-263-3
TO-263AB
590 mV
30 A
LPDS (TO-263S)
Rohm Semiconductor
Surface Mount
15 A
1 Pair Common Cathode
200 µA
200 mA
500 ns
45 V
150 ¯C
LPDS
Schottky
650 mV
D2PAK (2 Leads + Tab)
TO-263-3
TO-263AB
LPDS (TO-263S)
Rohm Semiconductor
Surface Mount
15 A
1 Pair Common Cathode
200 µA
200 mA
500 ns
65 V
150 ¯C
LPDS
Schottky
D2PAK (2 Leads + Tab)
TO-263-3
TO-263AB
690 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 4.06
10$ 2.67
100$ 1.88
500$ 1.54
Digi-Reel® 1$ 4.06
10$ 2.67
100$ 1.88
500$ 1.54
N/A 1605$ 3.21
Tape & Reel (TR) 1000$ 1.43
2000$ 1.37
NewarkEach (Supplied on Cut Tape) 1$ 3.90
10$ 2.70
25$ 2.44
50$ 2.19
100$ 1.93
250$ 1.77
500$ 1.59

Description

General part information

RBQ30 Series

ROHM's schottky barrier diodes are low VF, low IR and high ESD resistant, suitable for phone and various portable electronics.

Documents

Technical documentation and resources

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Report of SVHC under REACH Regulation

Environmental Data

List of Diode Package Thermal Resistance

Thermal Design

Electrical Static Discharge Immunity

Characteristics Data

What Is Thermal Design

Thermal Design

ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment

White Paper

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Reliability Test Result

Manufacturing Data

How to Use LTspice® Models

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

Anti-Whisker formation - Diodes

Package Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

RBQ30NS100AFH Data Sheet

Data Sheet

How to Select Rectifier Diodes

Technical Article

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

How to Create Symbols for PSpice Models

Models

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Power Loss and Thermal Design of Diodes

Thermal Design

Diode Selection Method for Asynchronous Converter

Schematic Design & Verification

Diode Types and Applications

Technical Article

Notes for Temperature Measurement Using Thermocouples

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Inner Structure

Package Information

Part Explanation

Application Note

Judgment Criteria of Thermal Evaluation

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

About Export Regulations

Export Information

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

What is a Thermal Model? (Diode)

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design