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Technical Specifications
Parameters and characteristics for this part
| Specification | 628-25ABT3 |
|---|---|
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Fin Height | 6.35 mm |
| Fin Height | 0.25 in |
| Length | 1.75 in |
| Length | 44.45 mm |
| Material | Aluminum |
| Material Finish | Black Anodized |
| Package Cooled | LGA, CPU, ASIC, BGA |
| Power Dissipation @ Temperature Rise | 4.5 W, 80 °C |
| Shape | Pin Fins, Square |
| Thermal Resistance @ Forced Air Flow | 7 °C/W |
| Type | Top Mount |
| Width [x] | 1.7 in |
| Width [x] | 43.18 mm |
| Part | Thermal Resistance @ Forced Air Flow | Package Cooled | Shape | Width [x] | Width [x] | Fin Height | Fin Height | Power Dissipation @ Temperature Rise | Type | Material Finish | Attachment Method | Material | Length | Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Wakefield Thermal Solutions | 7 °C/W | ASIC BGA CPU LGA | Pin Fins Square | 1.7 in | 43.18 mm | 6.35 mm | 0.25 in | 4.5 W 80 °C | Top Mount | Black Anodized | Thermal Tape Adhesive (Included) | Aluminum | 1.75 in | 44.45 mm |
Wakefield Thermal Solutions | 7 °C/W | ASIC BGA CPU LGA | Pin Fins Square | 1.7 in | 43.18 mm | 6.35 mm | 0.25 in | 4.5 W 80 °C | Top Mount | Black Anodized | Thermal Tape Adhesive (Included) | Aluminum | 1.75 in | 44.45 mm |
 Wakefield Thermal Solutions | 7 °C/W | ASIC BGA CPU LGA | Pin Fins Square | 1.7 in | 43.18 mm | 6.35 mm | 0.25 in | 4.5 W 80 °C | Top Mount | Black Anodized | Thermal Tape Adhesive | Aluminum | 1.75 in | 44.45 mm |
Wakefield Thermal Solutions | 7 °C/W | ASIC BGA CPU LGA | Pin Fins Square | 1.7 in | 43.18 mm | 6.35 mm | 0.25 in | 4.5 W 80 °C | Top Mount | Black Anodized | Thermal Tape Adhesive (Included) | Aluminum | 1.75 in | 44.45 mm |
Wakefield Thermal Solutions | 7 °C/W | ASIC BGA CPU LGA | Pin Fins Square | 1.7 in | 43.18 mm | 6.35 mm | 0.25 in | 4.5 W 80 °C | Top Mount | Black Anodized | Thermal Tape Adhesive (Included) | Aluminum | 1.75 in | 44.45 mm |
Wakefield Thermal Solutions | 7 °C/W | ASIC BGA CPU LGA | Pin Fins Square | 1.7 in | 43.18 mm | 6.35 mm | 0.25 in | 4.5 W 80 °C | Top Mount | Black Anodized | Thermal Tape Adhesive (Included) | Aluminum | 1.75 in | 44.45 mm |
Wakefield Thermal Solutions | 7 °C/W | ASIC BGA CPU LGA | Pin Fins Square | 1.7 in | 43.18 mm | 6.35 mm | 0.25 in | 4.5 W 80 °C | Top Mount | Black Anodized | Thermal Tape Adhesive (Included) | Aluminum | 1.75 in | 44.45 mm |
Wakefield Thermal Solutions | 7 °C/W | ASIC BGA CPU LGA | Pin Fins Square | 1.7 in | 43.18 mm | 6.35 mm | 0.25 in | 4.5 W 80 °C | Top Mount | Black Anodized | Thermal Tape Adhesive | Aluminum | 1.75 in | 44.45 mm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 1000 | $ 3.54 | |
| 1000 | $ 3.54 | |||
| N/A | 0 | $ 3.54 | ||
| 0 | $ 3.54 | |||
Description
General part information
628-25 Series
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum 4.5W @ 80°C Top Mount
Documents
Technical documentation and resources