628-25 Series

Manufacturer: Wakefield Thermal Solutions

Catalog

HEATSINK FOR 45MM BGA

Part	Thermal Resistance @ Forced Air Flow	Package Cooled	Shape	Width [x]	Width [x]	Fin Height	Fin Height	Power Dissipation @ Temperature Rise	Type	Material Finish	Attachment Method	Material	Length	Length
Wakefield Thermal Solutions 628-25ABT5	7 °C/W	ASIC BGA CPU LGA	Pin Fins Square	1.7 in	43.18 mm	6.35 mm	0.25 in	4.5 W 80 °C	Top Mount	Black Anodized	Thermal Tape Adhesive (Included)	Aluminum	1.75 in	44.45 mm
Wakefield Thermal Solutions 628-25ABT3	7 °C/W	ASIC BGA CPU LGA	Pin Fins Square	1.7 in	43.18 mm	6.35 mm	0.25 in	4.5 W 80 °C	Top Mount	Black Anodized	Thermal Tape Adhesive (Included)	Aluminum	1.75 in	44.45 mm
Wakefield Thermal Solutions 628-25AB	7 °C/W	ASIC BGA CPU LGA	Pin Fins Square	1.7 in	43.18 mm	6.35 mm	0.25 in	4.5 W 80 °C	Top Mount	Black Anodized	Thermal Tape Adhesive	Aluminum	1.75 in	44.45 mm
Wakefield Thermal Solutions 628-25ABT1E	7 °C/W	ASIC BGA CPU LGA	Pin Fins Square	1.7 in	43.18 mm	6.35 mm	0.25 in	4.5 W 80 °C	Top Mount	Black Anodized	Thermal Tape Adhesive (Included)	Aluminum	1.75 in	44.45 mm
Wakefield Thermal Solutions 628-25ABT5	7 °C/W	ASIC BGA CPU LGA	Pin Fins Square	1.7 in	43.18 mm	6.35 mm	0.25 in	4.5 W 80 °C	Top Mount	Black Anodized	Thermal Tape Adhesive (Included)	Aluminum	1.75 in	44.45 mm
Wakefield Thermal Solutions 628-25ABT3	7 °C/W	ASIC BGA CPU LGA	Pin Fins Square	1.7 in	43.18 mm	6.35 mm	0.25 in	4.5 W 80 °C	Top Mount	Black Anodized	Thermal Tape Adhesive (Included)	Aluminum	1.75 in	44.45 mm
Wakefield Thermal Solutions 628-25ABT1E	7 °C/W	ASIC BGA CPU LGA	Pin Fins Square	1.7 in	43.18 mm	6.35 mm	0.25 in	4.5 W 80 °C	Top Mount	Black Anodized	Thermal Tape Adhesive (Included)	Aluminum	1.75 in	44.45 mm
Wakefield Thermal Solutions 628-25AB	7 °C/W	ASIC BGA CPU LGA	Pin Fins Square	1.7 in	43.18 mm	6.35 mm	0.25 in	4.5 W 80 °C	Top Mount	Black Anodized	Thermal Tape Adhesive	Aluminum	1.75 in	44.45 mm