Deep-Dive with AI
Search across all available documentation for this part.
Documents628-25ABT5 | Datasheet
Deep-Dive with AI
Documents628-25ABT5 | Datasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | 628-25ABT5 |
|---|---|
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Fin Height | 6.35 mm |
| Fin Height | 0.25 in |
| Length | 1.75 in |
| Length | 44.45 mm |
| Material | Aluminum |
| Material Finish | Black Anodized |
| Package Cooled | LGA, CPU, ASIC, BGA |
| Power Dissipation @ Temperature Rise | 4.5 W, 80 °C |
| Shape | Pin Fins, Square |
| Thermal Resistance @ Forced Air Flow | 7 °C/W |
| Type | Top Mount |
| Width [x] | 1.7 in |
| Width [x] | 43.18 mm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 1000 | $ 1.97 | |
| 1000 | $ 1.97 | |||
| N/A | 0 | $ 1.97 | ||
| 0 | $ 1.97 | |||
Description
General part information
628-25 Series
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum 4.5W @ 80°C Top Mount
Documents
Technical documentation and resources
