Connectors, Interconnects

36-3513-10H

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Aries Electronics

IC & COMPONENT SOCKETS LO-PRO FILE COLLET SOLDER TAIL 36 PINS

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Connectors, Interconnects

36-3513-10H

Active

Aries Electronics

IC & COMPONENT SOCKETS LO-PRO FILE COLLET SOLDER TAIL 36 PINS

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Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	36-3513-10H

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	0.25 µm
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Closed Frame
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	36
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-55 C
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Solder
Termination Post Length	0.125 in
Termination Post Length	3.18 mm
Type	7.62 mm
Type	0.3 in
Type	DIP

513 Series

Part	Type	Type	Type	Contact Finish - Post	Housing Material	Pitch - Mating	Pitch - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Contact Material - Post	Contact Material - Mating	Mounting Type	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid)	Contact Finish - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Features	Termination	Pitch - Post	Pitch - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Type [custom]	Type [custom]	Contact Material - Post [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Termination Post Length	Termination Post Length	Current Rating (Amps)	Material Flammability Rating
Aries Electronics 24-3503-31	7.62 mm	0.3 in	DIP	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	-55 C	125 °C	Phosphor Bronze	Beryllium Copper	Through Hole	12	2	24	Gold	10 Áin	0.25 çm	Closed Frame	Wire Wrap	0.1 in	2.54 mm	0.25 µm	10 µin
Aries Electronics 10-6513-10			DIP	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	-55 C	105 ░C		Beryllium Copper	Through Hole	2	5	10	Gold	200 µin	5.08 µm	Closed Frame	Solder	0.1 in	2.54 mm	0.25 µm	10 µin	15.24 mm	0.6 in	Brass
Aries Electronics 16-6513-10			DIP	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	-55 C	105 ░C		Beryllium Copper	Through Hole			16	Gold	200 µin	5.08 µm	Closed Frame	Solder	0.1 in	2.54 mm	0.25 µm	10 µin	15.24 mm	0.6 in	Brass	2	8
Aries Electronics 32-9513-10	22.86 mm	0.9 in	DIP	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	-55 C	105 ░C		Beryllium Copper	Through Hole			32	Gold	200 µin	5.08 µm	Closed Frame	Solder	0.1 in	2.54 mm	0.25 µm	10 µin			Brass			0.125 in	3.18 mm	3 A	UL94 V-0
Aries Electronics 10-2513-10	5.08 mm		DIP	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	-55 C	105 ░C		Beryllium Copper	Through Hole	2	5	10	Gold	200 µin	5.08 µm	Closed Frame	Solder	0.1 in	2.54 mm	0.25 µm	10 µin			Brass			0.125 in	3.18 mm	3 A	UL94 V-0
Aries Electronics 10-9513-10	22.86 mm	0.9 in	DIP	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	-55 C	105 ░C		Beryllium Copper	Through Hole	2	5	10	Gold	200 µin	5.08 µm	Closed Frame	Solder	0.1 in	2.54 mm	0.25 µm	10 µin			Brass
Aries Electronics 24-3513-10H	7.62 mm	0.3 in	DIP	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	-55 C	105 ░C		Beryllium Copper	Through Hole	12	2	24	Gold	200 µin	5.08 µm	Closed Frame	Solder	0.1 in	2.54 mm	0.25 µm	10 µin			Brass			0.125 in	3.18 mm	3 A	UL94 V-0
Aries Electronics 36-3513-10H	7.62 mm	0.3 in	DIP	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	-55 C	105 ░C		Beryllium Copper	Through Hole			36	Gold	200 µin	5.08 µm	Closed Frame	Solder	0.1 in	2.54 mm	0.25 µm	10 µin			Brass			0.125 in	3.18 mm	3 A	UL94 V-0
Aries Electronics 12-6503-31			DIP	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	-55 C	125 °C	Phosphor Bronze	Beryllium Copper	Through Hole			12	Gold	10 Áin	0.25 çm	Closed Frame	Wire Wrap	0.1 in	2.54 mm	0.25 µm	10 µin	15.24 mm	0.6 in
Aries Electronics 36-6513-11H			DIP	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	-55 C	105 ░C		Beryllium Copper	Through Hole			36	Gold	10 Áin	0.25 çm	Closed Frame	Solder	0.1 in	2.54 mm	0.25 µm	10 µin	15.24 mm	0.6 in	Brass			0.125 in	3.18 mm	3 A	UL94 V-0

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	48	$ 10.54
	N/A	0	$ 11.13
Mouser	N/A	1	$ 12.89
		12	$ 10.51
		24	$ 8.60
		252	$ 8.33
		504	$ 8.06
		1008	$ 7.76

Description

General part information

513 Series

36 (2 x 18) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources